HK1126034B - Pressure bonding device and mounting method - Google Patents

Description

Crimping device and mounting method

Technical Field

The present invention relates to a pressure bonding apparatus for mounting an electrical component on a substrate and a mounting method thereof.

Background

Conventionally, in a mounting process for connecting an electrical component such as a semiconductor element to a substrate, a pressure bonding apparatus has been used which heats the electrical component while pressing the electrical component against the substrate with a pressing head.

Reference numeral 101 of fig. 18(a) shows a crimping apparatus of the related art, the crimping apparatus 101 having a base 126 and a pressing head 120.

The pressing head 120 includes a pressing head in which a pressing rubber is fitted into a metal frame, a pressing head in which a pressing rubber is bonded to a metal plate with an adhesive, a pressing head in which a liquid rubber is poured into a metal frame and the rubber is cured in the metal frame, and the like.

A pressing head in which a pressing rubber 122 is fitted into a head main body 121 made of a metal frame, a surface of the pressing rubber 122 is flush with a surface of the head main body 121, or protrudes downward from the surface of the head main body 121, and when the pressing head 120 is pressed against an object 110 to be pressed on a base 126, the surface of the pressing rubber 122 is brought into contact with the object 110 to be pressed.

The object 110 to be pressure-bonded has a substrate 111 and electric components 116 and 118 arranged on the substrate 111 and having different thicknesses, and a step is formed on the substrate 111 due to the difference in thickness between the electric components 116 and 118.

The pressing rubber 122 is made of an elastic material that deforms when a force is applied thereto, the pressing rubber 122 first comes into contact with the thickest electrical component 116, the pressing rubber 122 deforms to come into contact with the thick electrical component 116 and the thin electrical component 118 in this order, and finally all the electrical components 116 and 118 are pressed by the pressing rubber 122.

Before the electrical components 116 and 118 are pressed by the pressure bonding apparatus 101, the electrical components 116 and 118 and the substrate 111 are positioned, and the terminals of the electrical components 116 and 118 are positioned directly above the terminals of the substrate 111 with the adhesive 115 interposed therebetween.

The surface of the base 126 is substantially horizontal, the substrate 111 is horizontally arranged on the surface, and when the pressing head 120 is moved vertically downward to press the electric components 116 and 118, the electric components 116 and 118 push the adhesive 115 and move directly downward, so that the terminals of the electric components 116 and 118 are brought into contact with the terminals of the substrate 111, and the electric components 116 and 118 are electrically connected to the substrate 111 (fig. 18(b)), whereby the conventional pressure bonding apparatus 101 can simultaneously connect electric components having different thicknesses to one substrate.

Further, the pressing rubber 122 has a property that when it is depressed when the electric components 116 and 118 are pressed, its surrounding portion expands due to its reaction force, and the expanded portion of the pressing rubber 122 extends horizontally beyond the frame of the head main body 121.

Fig. 19 is a plan view showing a state where the surface of the pressing rubber 122 is expanded in the horizontal direction, and the pressing rubber 122 flows in the radial direction around the center C of the planar shape thereof. Since the amount of movement of the end portions is larger than the vicinity of the center C of the pressing rubber 122, the electric components 166 and 118 pressed by the end portions of the pressing rubber 122 move in the horizontal direction together with the expansion of the pressing rubber 122, and the terminals of the electric components 116 and 118 are displaced from the positions directly above the terminals of the board 111.

If the positions of the electrical components 116 and 118 are displaced, the terminals of the electrical components 116 and 118 and the terminals of the substrate 111 do not come into contact with each other, and the connection reliability between the electrical components 116 and 118 and the substrate 111 is reduced.

Patent document 1: japanese unexamined patent publication No. 2002-359264

Patent document 2: japanese laid-open patent publication No. 2005-32952

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a pressure bonding apparatus capable of reliably connecting an electric component and a substrate.

In order to solve the above problems, the present invention is a pressure bonding apparatus including a base and a pressing head that moves the pressing head and the base relative to each other and presses an object to be pressure bonded disposed on a mounting surface of the base, wherein the pressing head includes a head body and a pressing rubber disposed on the head body, a stopper member having a height higher than a surface height of the pressing rubber is disposed around the pressing rubber, and the pressing rubber presses the object to be pressure bonded disposed on the base while being deformed.

The present invention is a pressure bonding apparatus, wherein the base is inserted into a space surrounded by the stopper member.

The present invention is the pressure bonding apparatus, wherein the stopper member is configured to be separable from the head body.

The present invention is a pressure bonding apparatus including a base and a pressing head, the pressing head and the base being relatively moved, and an object to be pressure bonded disposed on a mounting surface of the base being pressed by the pressing head, wherein the pressing head includes a head body and a pressing rubber disposed on the head body, and the mounting surface is surrounded by a stopper member having a height higher than a surface of the mounting surface.

The present invention is a pressure bonding apparatus in which the pressing head is inserted into a space surrounded by the dam member.

The present invention is the pressure bonding apparatus, wherein the stopper member is configured to be separable from the base.

The present invention is a pressure bonding apparatus in which a compression member capable of compression deformation is disposed between the pressing rubber and the head main body, and the height of the stopper member is higher than the surface height of the pressing rubber at least when the compression member is compressed.

The present invention is a component mounting method for mounting a component on a substrate, the component being a pressure contact object in which a plurality of components having different heights are arranged on a mounting surface of a base, and pressing the component with a pressing rubber provided on a pressing head, wherein when the pressing rubber presses the component, a periphery of the pressure contact object is surrounded with a dam member, and a cross flow of the pressing rubber due to deformation is stopped with the dam member.

The present invention is a mounting method in which an anisotropic conductive film is disposed between the component and the substrate, the component is bonded to the substrate, and then the substrate is heated and pressed with the pressing rubber.

The present invention is a mounting method in which a protective film that can be peeled off from the anisotropic conductive film is disposed between the pressing rubber and the object to be pressure-bonded when the member is pressed.

When the pressing rubber is pressed against the object to be pressure-bonded, the stopper member prevents the object from expanding in the lateral direction, and therefore, the electric component is less likely to be displaced even at the end of the pressing rubber. Further, if the pressing rubber does not expand in the lateral direction, most of the force with which the pressing rubber deforms becomes force for pressing the object to be pressure-bonded, and therefore, there is no waste of pressing pressure during pressing.

Drawings

Fig. 1 is a sectional view illustrating a first example of the pressure bonding apparatus.

Fig. 2 is a plan view illustrating the shapes of the pressing head and the base.

Fig. 3(a) to (c) are sectional views for explaining a step of mounting an electric component on a substrate.

Fig. 4(a) to (c) are sectional views illustrating a process of mounting an electrical component using the pressure bonding apparatus of the second example.

Fig. 5 is a sectional view illustrating another example of the pressing head.

Fig. 6 is a sectional view illustrating a third example of the crimping apparatus.

Fig. 7 is a plan view illustrating the shapes of the pressing head and the base.

Fig. 8(a) to (c) are sectional views for explaining a step of mounting an electric component on a substrate.

Fig. 9 is a sectional view illustrating another example of the pressing head.

Fig. 10(a) to (c) are sectional views illustrating a process of mounting an electrical component on a substrate using the pressure bonding apparatus of the fourth example.

Fig. 11 is a plan view illustrating an example of the dam member.

Fig. 12 is a plan view illustrating another example of the blocking member.

Fig. 13(a) to (c) are sectional views illustrating a process of mounting an electrical component on a substrate using the pressure bonding apparatus of the fifth example.

Fig. 14 is a sectional view illustrating another example of the method of disposing the protective film.

Fig. 15 is a side view illustrating another example of the blocking member.

Fig. 16 is a sectional view illustrating another example of the pressing head in which the stopper member can be separated.

Fig. 17 is a sectional view illustrating another example of the pressing head in which the stopper member can be separated.

Fig. 18(a) and (b) are sectional views illustrating a conventional mounting method.

Fig. 19 is a plan view illustrating expansion of the pressing rubber.

Description of the reference numerals

1. 3, 4 crimping device

5 protective film

10 object to be pressure-bonded

11 substrate

15 Anisotropic conductive film

16. 18 electric component

20. 30, 35, 40, 70 pressing head

21 head body

22 crimping part (pressing rubber)

31 compression member

32 push rubber

24. 49, 74, 78, 89 stop member

26. 46, 86 base

Detailed Description

Reference numeral 1 in fig. 1 shows a first example of the pressure bonding apparatus of the present invention, and the pressure bonding apparatus 1 includes an operation table 9, a driving device 25, a pressing head 20, and a base 26. The pressing head 20 has a head body 21, a stopper member 24, and a crimping portion 22.

Here, the head main body 21 is a metal plate-like body, and does not deform when pressing the object to be pressure-bonded 10 described later. The inside of the pressure-bonding section 22 is made of an elastic material (e.g., rubber) of a uniform material, and the pressure-bonding section 22 is deformed when a force is applied thereto, unlike a metal material such as iron, and returns to its original shape when the force is removed.

The pressure contact portion 22 is fixed to the surface of the head body 21, and the pressing head 20 arranges the pressure contact portion 22 downward at a position above the table 9.

The pressing head 20 is connected to a driving device 25, and when the driving device 25 operates, the pressing head 20 moves up and down in the vertical direction on the table 9 with the exposed surface of the pressure-bonding section 22 facing downward.

Here, the planar shape of the head body 21 is a quadrangle, and the pressure contact part 22 is formed in a quadrangular prism. The head main body 21 is larger than the pressure contact portion 22, and a cylindrical stopper member 24 is disposed at a portion of the head main body 21 protruding outward from the pressure contact portion 22 so as to surround the pressure contact portion 22.

Here, the stopper member 24 is made of metal similarly to the head body 21, and here, the stopper member 24 is fixed to the head body 21. The tip of the dam member 24 protrudes from the surface of the pressure-bonding section 22, and a recess 29 having the inner peripheral side surface of the dam member 24 as the side surface and the surface of the pressure-bonding section 22 as the bottom surface is formed.

The inner peripheral side surface of the stopper member 24 is substantially vertical with respect to the horizontal plane, and the surface of the crimping portion 22 is substantially horizontal. The height of the tip of the stopper member 24 from the surface of the pressure-bonding section 22 is uniform. Thus, the opening 23 formed by the tip end of the stopper member 24 is located in the horizontal plane and has a quadrangular shape as the shape of the bottom surface of the recess 29. Here, the base 26 is a quadrangular prism, and is vertically provided on the console 9 with one bottom surface thereof being in close contact with the surface of the console 9.

The other bottom surface of the base 26 is a mounting surface 27 on which an object to be pressure-bonded, which will be described later, is mounted, and the mounting surface 27 is substantially horizontal by the mounting surface 27 being parallel to the surface of the table 9. The mounting surface 27 has the same shape as the opening 23 of the recess 29 or a similar shape slightly smaller than the opening 23 of the recess 29 (fig. 2), and a portion of the base 26 where the mounting surface 27 is located can be inserted into the recess 29.

Next, a process of connecting an electrical component such as a semiconductor element to a substrate using the pressure bonding apparatus 1 will be described. Reference numeral 10 in fig. 3(a) shows an object to be pressure-bonded, and the object to be pressure-bonded 10 includes a substrate 11, an anisotropic conductive film 15, and electric components 16 and 18.

The anisotropic conductive film 15 is disposed on the terminal 12 of the substrate 11, and the electric components 16 and 18 are disposed on the surface of the anisotropic conductive film 15 opposite to the substrate 11. The electric components 16, 18 have terminals 17, 19 such as bumps or ridges, and the terminals 17, 19 of the electric components 16, 18 are arranged so as to be positioned on the terminals 12 of the substrate 11.

The electric components 16 and 18 are respectively mounted on the anisotropic conductive film 15 by a mounting head (not shown), and then pressed by a small pressure via the mounting head while being heated to a relatively low temperature in advance, whereby the electric components 16 and 18 are temporarily bonded (temporarily pressure-bonded) to the substrate by the adhesive force of the anisotropic conductive film 15. However, the adhesive force at the time of temporary pressure bonding is weak, the electric components 16 and 18 are easily detached from the substrate 11, and the terminal 12 of the substrate 11 and the terminals 17 and 19 of the electric components 16 and 18 are not in contact with each other physically and mechanically, with the anisotropic conductive film 15 therebetween.

The surface of the substrate 11 on which the electrical components 16 and 18 are not arranged is flat, and the flat surface of the object to be pressure-bonded 10 is placed on the base 26 by being brought into close contact with the placement surface 27.

The anisotropic conductive film 15 is formed to be larger than the electric components 16 and 18, and a part thereof protrudes from the electric components 16 and 18 and is exposed between the electric components 16 and 18. Even when the anisotropic conductive film 15 is not exposed from the electrical components 16 and 18, the anisotropic conductive film 15 is pressed and partially protrudes from the outer peripheries of the electrical components 16 and 18 at the time of pressing, which will be described later.

Since the pressure-bonding section 22 is made of a material having a surface capable of adhering to the anisotropic conductive film 15, the protective film 5 having low adhesiveness to the anisotropic conductive film 15 is disposed on the surface of the object 10 to be pressure-bonded so that the pressure-bonding section 22 and the anisotropic conductive film 15 do not contact each other at the time of pressing (fig. 3(a)) described later.

Here, the mounting surface 27 is formed to be smaller than the opening 23, the protective film 5 is formed to be larger than the mounting surface 27, and the outer periphery of the base 26 including the protective film 5 is substantially equal to the size of the opening 23 in a state where the end of the protective film 5 is suspended on the side surface of the base 26.

Thus, the directions of the pressing head 20 and the base 26 are positioned so that the outer periphery of the base 26 including the protective film 5 coincides with the opening 23, and when the pressing head 20 is lowered by the driving device 25, the base 26 is inserted into the recess 29 together with the protective film 5.

The protective film 5 is made of a material that can be compressed and deformed, and the base 26 including the protective film 5 can be inserted even if the outer shape of the base 26 is slightly larger than the opening 23.

The electric components 16 and 18 are, for example, semiconductor elements or resistive elements, and the thickness thereof differs for each type of component, and a step is formed on the surface of the substrate 11 due to the difference in thickness between the electric components 16 and 18.

Fig. 3(b) shows a state in which the pressure-bonding section 22 is in contact with the last electrical component 16 on the substrate 11 via the protective film 5 before the placement surface 27 of the base 26 is inserted into the recess 29 together with the object 10 to be pressure-bonded and the pressure-bonding section 22 presses the electrical components 16 and 18 of the object 10 to be pressure-bonded, in which state the placement surface 27 is located above the opening 23, and the tip end portion of the placement surface 27 on the side surface of the base 26 is inserted into the recess 29 and surrounded by the inner peripheral side surface of the dam member 24.

When the pressing head 20 is further lowered from this state and the pressure-bonding section 22 is relatively brought close to the substrate 11, a portion of the pressure-bonding section 22 in contact with the electrical component 16 is pressed and dented.

Here, the side surface of the pressure-bonding section 22 is not fixed to the dam member 24, and the center and the periphery of the pressure-bonding section 22 are recessed, and the pressing head 20 is further lowered to perform pressing, whereby the electric component 16 having a large thickness is sequentially brought into contact with the surface of the pressure-bonding section 22 toward the electric component 18 having a small thickness, and is pressed.

When the pressure-bonding section 22 is depressed by contact with the electrical components 16 and 18, the other portions expand due to the reaction thereof, but the pressure-bonding section 22 does not expand in the horizontal direction because the bottom surface is fixed to the head body 21 and the side surfaces are surrounded by the dam member 24, and the portions of the surface of the pressure-bonding section 22 that do not face the electrical components 16 and 18 expand downward before being pressed. Thereby, the surface of the pressure-bonding section 22 expands downward at a portion between the electric components 16 and 18 and a portion around the object 10 to be pressure-bonded (fig. 3 c).

As described above, the anisotropic conductive film 15 is exposed between the electrical components 16 and 18, and when the electrical components 16 and 18 are pressed, a part of the anisotropic conductive film 15 protrudes from the outer peripheries of the electrical components 16 and 18, but the bonding section 22 does not directly contact the anisotropic conductive film 15 because the space between the electrical components 16 and 18 and the electrical components 16 and 18 are covered with the protective film 5.

Further, since the gap between the base 26 and the stopper member 24 is small and does not flow out through the gap even if the surface of the pressure-bonding section 22 swells downward around the object to be pressure-bonded 10, the pressure-bonding section 22 does not flow outward in the radial direction unlike the conventional case even if the portion swelling downward in the pressure-bonding section 22 is filled in the recess between the electric components 16 and 18. This prevents the electric components 16 and 18 from being biased outward, and thus prevents the electric components 16 and 18 from being displaced.

The base 26 incorporates a heater 8, and the object to be pressure-bonded 10 is heated to a predetermined temperature by applying current to the heater 8, whereby the flowability of the anisotropic conductive film 15 is increased by the heating.

Thus, when the electric components 16 and 18 are pressed, the anisotropic conductive film 15 is pushed away by the electric components 16 and 18, the terminals 17 and 19 of the electric components 16 and 18 are pressed against the terminals 12 of the substrate 11 via the conductive particles in the anisotropic conductive film 15, and the electric components 16 and 18 are electrically connected to the substrate 11.

When the anisotropic conductive film 15 contains a thermosetting resin, the anisotropic conductive film 15 is cured by heating, and when the anisotropic conductive film 15 contains a thermoplastic resin, the anisotropic conductive film 15 is cured when the temperature is lowered after the heating is completed. Thereby, the electric components 16 and 18 are mechanically connected to the substrate 11 through the cured anisotropic conductive film 15, and the electric device 10a in which the electric components 16 and 18 are mechanically and electrically connected to the substrate 11 is obtained.

When the electric components 16 and 18 are pressed, the electric device 10a has high connection reliability because the electric components 16 and 18 are not displaced.

As described above, since the pressure-bonding section 22 does not contact the anisotropic conductive film 15 when the electric components 16 and 18 are pressed, the pressure-bonding section 22 does not stick to the anisotropic conductive film 15, and the surface of the pressure-bonding section 22 is separated from the electric device 10a when the pressing head 20 is raised, leaving the electric device 10a on the base 26.

When the pressure-bonding section 22 is separated from the electric device 10a, the force applied to the pressure-bonding section 22 is removed, and the pressure-bonding section 22 returns to the shape before the electric components 16 and 18 are pressed.

The electrical device 10a left on the base 26 is taken out, and a new object 10 to be pressure-bonded is placed on the base 26, so that the electrical components 16 and 18 can be continuously connected in the steps of fig. 3(a) to (c).

The height of the tip of the dam member 24 is not particularly limited, but the amount of expansion of the pressure-bonding section 22 when the pressure-bonding section 22 presses the object to be pressure-bonded 10 is not larger than the maximum film thickness of the object to be pressure-bonded 10, and therefore, if the height from the surface of the pressure-bonding section 22 before pressing to the tip of the dam member 24 is equal to or larger than the total amount of the film thickness of the thickest electrical component 16 (for example, semiconductor device) and the film thickness of the substrate 11, the pressure-bonding section 22 does not exceed the dam member 24.

In the above description, the concave portion 29 is formed in advance in the pressing head 20, and after the object to be pressure-bonded 10 is accommodated in the concave portion 29, the pressure-bonding section 22 is brought into contact with the object to be pressure-bonded 10.

Reference numeral 3 in fig. 4(a) shows a pressure bonding apparatus according to a second example of the present invention, and this pressure bonding apparatus 3 has the same configuration as the pressure bonding apparatus 1 according to the first example except that the pressure bonding section 34 of the pressing head 30 is changed as described below, and the arrangement of the pressing head 30 and the base 26 is also the same as the pressure bonding apparatus 1 according to the first example.

The pressure-bonding section 22 of the pressure-bonding device 1 of the first example is made of rubber, and the pressure-bonding section 34 of the pressure-bonding device 3 includes a pressing rubber 32, a movable plate 33, and a compression member 31, which are made of rubber, similarly to the pressure-bonding section 22 of the pressure-bonding device 1 of the first example, and the compression member 31 is made of a material such as sponge rubber having a cavity therein and a volume reduced by crushing the cavity at the time of application of a force.

The upper end of the compression member 31 is fixed to the surface of the head body 21, the surface of the movable plate 33 is attached to the lower end of the compression member 31, and the upper end of the pressing rubber 32 is attached to the back surface of the movable plate 33. Thereby, the compression member 31, the movable plate 33, and the pressing rubber 32 are arranged in the stated order from the head body 21 to the vertically lower side where the base 26 is located.

Here, the cross-sectional shape of the compression member 31 when cut in the horizontal direction is a columnar shape similar to the cross-sectional shape of the region surrounded by the dam member 24. Thus, the side surface of the compression member 31 is in contact with the inner peripheral side surface of the stopper member 24, but the side surface is not fixed to the stopper member 24. The pressing rubber 32 and the movable plate 33 are also not fixed to the stopper member 24, but are configured to be movable in the region surrounded by the stopper member 24.

Fig. 4(b) shows a state in which the pressing head 30 is further lowered after the pressing rubber 32 is brought into contact with the protective film 5 on the object 10 to be pressure-bonded.

The force required to deform the compression member 31 is smaller than the force required to deform the pressing rubber 32, and when the pressing head 30 is lowered, the compression member 31 is pressed against the head main body 21 via the pressing rubber 32, and the compression member 31 is compressed before the pressing rubber 32 is deformed, and the thickness thereof becomes smaller, so that the compression member 31 presses against the pressing rubber 32, and a concave portion that is not compressed before the pressing head 30 appears.

Since there is a limit to the amount of deformation of the compression member 31, when the compression member 31 is deformed to some extent, the compression stops, and when the pressing head 30 further continues to be lowered, the pressing rubber 32 is deformed (fig. 4 (c)).

The pressing rubber 32 is deformed to form the concave portion, and the stopper member 24 has a tip protruding downward from the surface of the pressing rubber 32 and a small gap between the tip and the base 26. Thus, as in the case of the pressure bonding apparatus 1 of the first example, the pressing rubber 32 does not flow out from the gap therebetween, and the positional deviation of the electric components 16 and 18 does not occur.

The compression member 31 is not particularly limited as long as the volume is reduced by pressing. The pressing head denoted by reference numeral 35 in fig. 5 has the same configuration as the pressing head 3 in fig. 4(a) to (c) except for the difference in the compression member, and the same members are denoted by the same reference numerals.

The compression member of the pressing head 35 may be constituted by a spring 36, and the spring 36 may be compressed by pressing, so that the surface of the pressure-bonding section 34 is pushed up, and the tip end of the stopper member 24 may protrude downward from the pressure-bonding section 34.

The support plate 33 is not particularly required as long as the force applied to the pressing rubber 32 can be transmitted to the compression member 36.

The above description has been given of the case where the dam member is provided on the pressing head 20, but the present invention is not limited thereto.

Reference numeral 4 in fig. 6 shows a pressure bonding apparatus according to a third example of the present invention, and the pressure bonding apparatus 4 has the same configuration as the pressure bonding apparatus 1 of the first example described above, except that the pressing head 40 is not provided with the stopper member, and the stopper member 49 is provided around the placement surface of the base 46 as described below.

Here, the pressure-bonding section 42 is formed of a pressing rubber as in the pressure-bonding device 1 of the first example, and is surrounded by a sliding plate 44 formed of a thin plate instead of being attached to the surface of the head main body 41 and surrounding the pressure-bonding section 42 with a stopper member.

The base 46 is columnar as in the pressure bonding apparatus 1 of the first example, and a stopper member 49 is fixed to the base 46 so as to surround the placement surface 47 around the placement surface 47.

The stopper member 49 has a tip projecting upward from the mounting surface 47, and a recess 45 having an inner peripheral side surface of the stopper member 49 as a side surface and a mounting surface as a bottom surface is formed.

Fig. 7 is a schematic plan view for comparing the planar shape of the base 46 and the planar shape of the pressing head 40, and the size of the outer periphery of the crimping section 42 including the sliding plate 44 is the same as or smaller than the opening 48 of the recess 45.

The side surface of the pressure-bonding section 42 faces vertically downward, and the film thickness of the slide plate 44 is uniform, so that the side surface of the slide plate 44 also faces vertically downward. The inner peripheral side surface of the stopper member 49 is directed vertically downward, whereby the lower end of the pressing head 40 can be inserted into the recessed portion 45.

Next, a case where the object to be pressure-bonded 10 is connected by using the pressure-bonding apparatus 4 will be described. As in the case of the pressure bonding apparatus 1 of the first example, when the object 10 to be pressure bonded is placed on the placement surface 47, the protective film 5 is placed on the opening 48 of the dam member 49, and the protective film 5 is pressed into the dam member 49, the object 10 to be pressure bonded is covered with the protective film 5 (fig. 8 (a)).

Here, the size of the opening 48 of the recess 45 is larger than the outer periphery of the planar shape of the pressing head 40, the end of the protective film 5 covers the side surface of the recess 45 and the periphery thereof, and the size of the opening 48 of the recess 45 narrowed by the covering of the protective film 5 is substantially equal to the size of the outer periphery of the planar shape of the pressing head 40.

Accordingly, the direction of the pressing head 40 and the base 46 is positioned so that the opening 48 coincides with the outer periphery of the pressing head 40, and when the pressing head 40 is lowered by the driving device 25, the lower end of the pressing head 40 is inserted into the opening 48 and is surrounded by the stopper member 49.

Fig. 8(b) shows a state in which the lower end of the pressing head 40 is inserted into the opening 48, and the surface of the pressure-bonding section 42 is in contact with the thickest electrical component 16 via the protective film 5, and in this state, the pressure-bonding section 42 is not pressed and is not deformed.

In this state, when the sliding plate 44 has flexibility, the side surfaces of the pressure-bonding section 42 are surrounded by the stopper members 49 from the front surface to the bottom surface, and when the sliding plate 44 does not have flexibility, at least the periphery of the surface of the pressure-bonding section 42 is surrounded by the stopper members 49.

In any case, the side surface of the pressure-bonding section 42 is surrounded by a hard member, and when the pressing head 40 is lowered without bringing the pressure-bonding section 42 into pressure contact with the object to be pressure-bonded 10, the pressure-bonding section 42 does not expand in the horizontal direction, and the surface thereof expands downward (fig. 8 (c)).

The slide plate 44 is thin, and the gap between the pressing head 40 and the stopper member 49 is narrowed, so that the distance from the edge of the surface of the crimping portion 42 to the stopper member 49 becomes short. Even if the pressure-bonding section 42 expands outward by swelling, the expansion amount is small because the stopper member 49 blocks the expansion, and thus the positional displacement of the electrical components 16 and 18 is less likely to occur.

In the case where the difference between the planar shape of the pressing head 40 and the size of the opening 48 of the dam member 49 is large, the thickness of the protective film 5 may be made as thick as possible, and the gap between the dam member 49 and the side surface of the pressing head 40 may be filled with the protective film 5.

In the above description, the periphery of the pressure-bonding section 42 is surrounded by the sliding plate 44, but the present invention is not limited to this, and the sliding plate 44 may be exposed on the side surface without being provided around the pressure-bonding section 42 as shown in fig. 9.

The above description has been given of the case where the stopper member is fixed to the head main body 41 or the base 46, but the present invention is not limited to this, and the stopper member may be constituted by a separate member separated from the base or the head main body, and may be brought into close contact with the base or the head main body when the object 10 to be pressure-bonded is pressed.

Reference numeral 7 in fig. 10(a) shows a pressure bonding apparatus according to a fourth example of the present invention, and this pressure bonding apparatus 7 has the same configuration as the pressure bonding apparatus 1 of the first example except that the stopper member 74 of the pressing head 70 and the head main body 71 are configured as separate members, and the arrangement of the pressing head 70 and the base 26 is also the same. Fig. 10(a) shows a state where the blocking member 74 is separated from the head body 71.

As shown in fig. 11, the stopper member 74 has a plurality of plate-like unit members 75, and each unit member 75 is arranged along the side surface of the pressure-bonding section 72 in close contact with the head main body 71 with the surface facing in the vertical direction by a not-shown moving device, and the side surface of the pressure-bonding section 72 is surrounded by the unit member 75 with each unit member 75 in close contact with the head main body 71.

Fig. 10(b) shows a state where the pressure-bonding section 72 is in contact with the protective film 5 at the thickest electric component 16, and shows a state where the pressure-bonding section 72 is not pressed and deformed, and at the latest when this state is reached, the unit members 75 are brought into close contact, and when the pressure-bonding section 72 is pressed and deformed, the side surfaces of the pressure-bonding section 72 are surrounded by the unit members 75.

When the pressure-bonding section 72 is made of a pressing rubber, if each unit member 75 is attached so as to protrude from the lower end of the surface of the pressure-bonding section 72 before pressing, even if the pressing head 70 is further lowered to press the pressure-bonding section 72, the pressure-bonding section 72 does not go beyond the dam member 74, and the positional deviation of the electric components 16 and 18 does not occur (fig. 10(c)), as in the case of the pressure-bonding apparatus 1 of the first example.

Further, the pressure contact portion 72 may be formed of a pressing rubber or a compression member.

Reference numerals 90 and 95 of fig. 16, 17 show a pressing head in which the blocking member 74 is separable from the body 71, and the crimping portion 72 has the compression members 31, 36, the pressing rubber 21. Here, the pressing head 90 of fig. 16 has the same configuration as the pressure-bonding section 34 of the pressing head 30 of fig. 4(a) to (c), and the pressing head 95 of fig. 17 has the same configuration as the pressure-bonding section 34 of the pressing head 35 of fig. 5. The head main body 71 and the stopper unit member 75 are the same in structure as the pressing head 70 of fig. 10, and the same members are denoted by the same reference numerals.

In the case of the pressing heads 90 and 95, when the concave portion whose bottom surface is the surface of the pressing rubber 32 is formed later by the compression of the compression member 31, when the dam member 74 is attached to the head main body 71, the tip of the dam member 74 may be formed to be flush with the surface of the pressure-bonding section 34 before the pressing, the surface of the pressure-bonding section 34 before the pressing may be formed to protrude downward from the tip of the dam member 74, or the tip of the dam member 74 may be formed to protrude downward from the surface of the pressure-bonding section 34 before the pressing.

The above description has been made of the case where the dam member 74 is constituted by the plurality of unit members 75, but the present invention is not limited to this, and the dam member 78 may be first cylindrically formed as shown in fig. 12. In this case, before the object 10 to be pressure bonded is pressed and the pressure bonding section 72 is deformed, the pressing head 70 is inserted into the inside of the cylinder of the dam member 78, and the inner circumferential side surface of the dam member 78 covers the pressure bonding section 72. In this case, the horizontal expansion of the pressure-bonding section 72 is also blocked by the blocking member 78, and therefore, the positional deviation of the electrical components 16 and 18 is prevented.

Next, a case where the blocking member is detachable from the base will be described.

Reference numeral 8 in fig. 13(a) shows a pressure bonding apparatus according to a fifth example of the present invention, and this pressure bonding apparatus 8 has the same configuration as the pressure bonding apparatus 4 according to the third example described above except that the stopper member 89 is a separable member separable from the base 86, and the arrangement of the base 86 and the pressing head 40 is also the same. Fig. 13(a) shows a state in which the blocking member 89 is separated from the base 86.

The stopper member 89 may be constituted by a plurality of unit members as shown in fig. 11, or may be constituted by one tube as shown in fig. 12. When the dam member 89 is formed of a plurality of unit members, the unit members are closely attached to each other in a state of being arranged along the edge of the mounting surface 87 so as to surround the mounting surface 87, and when the dam member 89 is cylindrical, the base 86 is inserted into the lower end of the cylinder so that the dam member 89 is closely attached to the base 86.

In a state where the stopper member 89 is brought into close contact with the base 86, the tip end of the stopper member 89 protrudes upward from the placement surface 87, and a recess 85 having the inner peripheral side surface of the stopper member 89 as a side surface and the placement surface 87 as a bottom surface is formed.

The opening of the recess 85 and the size relationship of the pressing head 40 are the same as those of the pressure bonding apparatus 4 shown in fig. 6 and 7, and thus the lower end of the pressing head 40 can be inserted into the recess 85.

Fig. 13(b) shows a state where the pressure-bonding section 42 is in contact with the thickest electric component 16 of the object to be pressure-bonded 10 on the placement surface 87 via the protective film 5, and the pressure-bonding section 42 is not pressed and deformed. At the latest in this state, the stopper member 89 is brought into close contact with the base 86, and the periphery of the placement surface 87 is surrounded by the stopper member 89.

In the pressure bonding apparatus 8, since the swollen surface of the pressure bonding section 42 is blocked by the blocking member 89 (fig. 13(c)), the horizontal expansion of the pressure bonding section 42 is small, and the positional deviation of the electric components 16 and 18 is prevented.

In the case where the planar shape of the protective film 5 is wide enough to protrude from the mounting surface 87, if the dam member 89 is attached to the base 86 and then the protective film 5 is covered, the protective film 5 is not caught between the dam member 89 and the base 86.

As shown in fig. 14, the pressing head 40 may be pressed against the object to be pressure-bonded 10 while the protective film 5 is wound around the pressing head 40 and covers the surface of the pressure-bonding section 42 without being placed on the placement surface 87.

While the stopper member 24 or the stopper member 49 of the pressing head 20 surrounds the pressure-bonding section 22 when the object to be pressure-bonded 10 is pressed, the present invention is not limited to this, and 1 or more cuts 99 may be provided in the stopper member 24 to expose a part of the side surface of the pressure-bonding section 22 as shown in fig. 15, as long as the horizontal expansion of the pressure-bonding section 22 when the object to be pressure-bonded 10 is pressed can be prevented.

The shape and size of the protective film 5 are not particularly limited, and the protective film 5 having a size not expanded from the mounting surfaces 27, 47, 87 may be used as long as the contact between the anisotropic conductive film 15 and the pressure-bonding sections 22, 34, 42, 72 can be avoided, or the protective film 5 covering only a part of the surface of the object to be pressure-bonded 10 may be used.

When the adhesiveness between the anisotropic conductive film 15 and the pressure-bonding sections 22, 34, 42, and 72 to be used is low, the pressure-bonding sections 22, 34, 42, and 72 may be directly brought into contact with the object to be pressure-bonded 10 without using the protective film 5. As a method for reducing the adhesiveness between the pressure-bonding sections 22, 34, 42, 72 and the anisotropic conductive film 15, there is a method in which the constituent material of the pressing rubber is changed to a material having low adhesiveness to the anisotropic conductive film 15, or a method in which a parting layer having parting properties with respect to the anisotropic conductive film 15 is provided on the surface of the pressing rubber.

As described above, the pressure bonding apparatus according to the present invention can connect the electric component and the substrate without using the protective film 5, but when the gap between the dam member and the pressing head or between the dam member and the base is large, the gap can be narrowed by covering the side surface of the dam member with the protective film 5.

Thus, the base, the dam member, and the pressing head can be manufactured at low cost without using a mold, and even when the molding accuracy is poor, the gap between the dam member and the pressing head or the gap between the dam member and the base can be filled by appropriately selecting the film thickness of the protective film 5.

The type of the substrate 11 used in the present invention is not particularly limited, and various substrates such as a rigid substrate and a flexible substrate can be used.

The type of the electrical component connected to the substrate 11 is not particularly limited, and the pressure bonding apparatus and the connection method according to the present invention may be used when connecting another substrate to the substrate 11 in addition to the electrical component.

The anisotropic conductive film 15 may contain only one of a thermoplastic resin and a thermosetting resin, or both of them.

The kind of the thermosetting resin and the thermoplastic resin is not particularly limited, but one or more of an epoxy resin, an acrylic resin, a urethane resin, and the like can be used as the thermosetting resin, and one or more of a phenoxy resin, a polyvinyl alcohol resin, and the like can be used as the thermoplastic resin.

The type of the conductive particles is not particularly limited, and particles having a metal layer provided on the surface of resin particles may be used in addition to metal particles.

Alternatively, instead of the anisotropic conductive film 15, a paste-like anisotropic conductive adhesive may be applied to the surface of the substrate 11, and then the electrical component may be bonded to the anisotropic conductive adhesive to form the object 10 to be pressure-bonded.

The type of the protective film is not particularly limited, and the protective film having peelability to the anisotropic conductive film 15 is preferably used, and for example, a protective film formed by molding polytetrafluoroethylene into a film shape, or a protective film formed by molding silicone rubber into a film shape can be used.

The elastic material constituting the pressing rubber is not particularly limited, and an elastic body having a rubber hardness (according to JIS S6050) of 40 or 80 may be used as an example.

Measured in accordance with JIS S6050: 2002, 6, test methods. The contents of which are as follows.

The test sample used in the test was a sample that had passed over 24 hours after the production. General matters commonly used in chemical analysis are referred to JIS K0050. The hardness test was performed by using a hardness tester in which the needle of the tester was set to be vertical and the pressing surface was brought into contact with the surface of the test piece held horizontally, and immediately, the scale was read in positive numbers. The measurement position of the test piece was determined by dividing the entire surface into three equal parts and measuring the central part of each part, and the intermediate value was defined as the hardness of the test piece.

The hardness tester is a hemispherical spring hardness tester having a needle shape with a diameter of 5.08mm plus or minus 0.02 mm. The height of the needle is 2.54 plus or minus 0.22mm when the scale is 0, and 0mm when the scale is 100. The relationship between the scale and the force of the spring is shown in table 1 below.

Table 1: relationship between scale and spring force

Scale division	0	10	20	25	30	40	50	60	70	75	80	90	100
														Force N of the spring	0.54	1.32	2.11	2.50	2.89	3.68	4.46	5.25	6.03	6.42	6.82	7.60	8.39

For elastomers having rubber hardnesses of 40, 60, and 80, respectively, the rubber hardnesses were measured at 30 ℃ intervals in the range of 30 ℃ to 240 ℃ and the variation in rubber hardness was ± 2. This value can be referred to as a measurement error range, and hence it is known that the rubber hardness is a value not affected by a temperature change.

As the elastomer used for the pressing rubber, either natural rubber or synthetic rubber can be used, but from the viewpoint of heat resistance and pressure resistance, silicone rubber is preferably used.

The above description has been made of the case where the pressing head 20 is moved in the vertical direction by the driving device 25, but the present invention is not limited to this, and the pressing head 20 may be fixed and the table 9 may be moved up and down in the vertical direction, or both the pressing head 20 and the table 9 may be moved up and down in the vertical direction, as long as the pressing head 20 and the table 9 are moved relatively.

Examples

The height (tip height) from the surface of the pressure-bonding section 22 before pressing to the tip of the dam member 24 in the pressure-bonding apparatus 1 of the first example is changed to connect the semiconductor element 16 and the board 11, and the amount of horizontal deviation of the semiconductor element 16 is measured.

Here, the distance (gap) from the side surface of the pressing head 20 to the inner wall surface of the dam member 24 when the pressing head 20 is accommodated in the concave portion 29 is 50 μm, and the protective film 5 having a film thickness of 50 μm is used to perform pressing substantially in a state where there is no gap between the pressing head 20 and the dam member 24. The thickness of the semiconductor element 16 is 0.4mm, and the thickness of the substrate 11 is 0.6 mm.

The maximum value of the measured deviation amount of the semiconductor element 16 is described in table 2 below together with the height of the top end of the stopper member 24.

Table 2: height of top end of blocking component and maximum deviation

Height of tip (mm)	Maximum deflection (mm)
		-3.0	0.050
-1.0	0.050
		0	0.050
1.0	0.020
		2.0	0.015
3.0	0.015

In the "tip height" in table 2, the case where the tip of the stopper member 24 and the surface of the pressure-bonding section 22 are flush with each other is "0 mm", the case where the tip of the stopper member 24 protrudes downward from the surface of the pressure-bonding section 22 is "+", and the case where the surface of the pressure-bonding section 22 protrudes downward from the tip of the stopper member 24 is "-".

As is clear from table 2 above, the maximum deviation amount becomes smaller when the tip of the dam member 24 protrudes from the surface of the pressure-bonding section 22 before pressing, whereas the maximum deviation amount of the semiconductor element 16 becomes larger when the surface of the pressure-bonding section 22 is flush with the tip of the dam member 24 or protrudes beyond the tip of the dam member 24.

As described above, it was confirmed that the stopper member 24 is provided so that the tip thereof protrudes from the surface of the pressure-bonding section 22, thereby preventing positional displacement of the electrical component and manufacturing a highly reliable electrical device.

Claims (11)

1. A press bonding apparatus having a base, a stopper, a pressing head, a protective film, and a heater, wherein the pressing head and the base are relatively moved, and an object to be press bonded arranged on a mounting surface of the base is pressed by the pressing head,

the pressing head comprises a head body and a pressing rubber arranged on the head body,

the protective film is disposed on the object to be pressure-bonded disposed on the base,

the pressing rubber is configured to press the object to be pressure-bonded while contacting the protective film,

a stopper member having a height higher than a surface of the pressing rubber is disposed around the pressing rubber in a process of pressing the object to be pressure-bonded,

the stopper member is configured to block a cross flow of the pressing rubber due to deformation when the pressing rubber is pressed.

2. The crimping apparatus according to claim 1, wherein the base is configured to be inserted into a space surrounded by the stopper member.

3. The crimping apparatus according to claim 1, wherein the pressing head is configured to be inserted into a space surrounded by the dam member.

4. The crimping apparatus according to claim 1, wherein the stopper member is configured to be separable from the head body.

5. The crimping apparatus according to claim 1, wherein a compression member capable of compressive deformation is disposed between the pressing rubber and the head body,

the height of the stopper member is higher than the surface height of the pressing rubber at least when the compressing member is compressed.

6. A component mounting method for mounting a component on a substrate by disposing a pressure-bonding object, in which a plurality of components having different heights are disposed on a mounting surface of a base, relatively moving a pressing head, in which a pressing rubber is provided on a head main body, and the base, and pressing the component with the pressing rubber provided on the pressing head to fix the component to the substrate,

a deformable protective film is arranged between the pressing rubber and the object to be pressure-bonded,

the periphery of the object to be pressure-bonded is surrounded by a dam member, and the pressing rubber is pressed against the object to be pressure-bonded via the protective film while the object to be pressure-bonded is heated in a state where the cross flow of the pressing rubber due to deformation is blocked by the dam member, whereby the member is fixed to the substrate.

7. The component mounting method according to claim 6, wherein the component is disposed on the substrate with an anisotropic conductive film interposed therebetween,

the protective film is peelable from the anisotropic conductive film,

when the pressing rubber is pressed against the object to be pressure-bonded via the protective film, the anisotropic conductive film is brought into contact with the protective film, and the member is fixed to the substrate.

8. The component mounting method according to claim 6, wherein the base is inserted into a space surrounded by the dam member, and the pressing head presses the object to be pressure-bonded.

9. The component mounting method according to claim 8, wherein a compression member whose volume decreases when a force is applied is disposed between the pressing rubber and the head main body,

at least when the compression member is compressed by applying a force, the height of the stopper member is made higher than the surface height of the pressing rubber.

10. The component mounting method according to claim 6, wherein the pressing rubber is surrounded by a sliding plate, the base is surrounded by the stopper member, the pressing head is inserted into a space surrounded by the stopper member, and the pressing head presses the object to be pressure-bonded.

11. The component mounting method according to claim 6, wherein the stopper member is provided so as to be separable from the head main body.