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HK1008111B - 磁控管喷涂装置和薄膜覆盖的方法 - Google Patents

磁控管喷涂装置和薄膜覆盖的方法 Download PDF

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Publication number
HK1008111B
HK1008111B HK98107302.1A HK98107302A HK1008111B HK 1008111 B HK1008111 B HK 1008111B HK 98107302 A HK98107302 A HK 98107302A HK 1008111 B HK1008111 B HK 1008111B
Authority
HK
Hong Kong
Prior art keywords
substrate
target surface
target
cathode
cathode assembly
Prior art date
Application number
HK98107302.1A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1008111A1 (zh
Inventor
E. Cole Barrett
Original Assignee
Honeywell Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/986,834 external-priority patent/US5328582A/en
Application filed by Honeywell Inc. filed Critical Honeywell Inc.
Publication of HK1008111A1 publication Critical patent/HK1008111A1/zh
Publication of HK1008111B publication Critical patent/HK1008111B/zh

Links

HK98107302.1A 1992-12-04 1998-06-27 磁控管喷涂装置和薄膜覆盖的方法 HK1008111B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/986,834 US5328582A (en) 1992-12-04 1992-12-04 Off-axis magnetron sputter deposition of mirrors
US986834 1992-12-04

Publications (2)

Publication Number Publication Date
HK1008111A1 HK1008111A1 (zh) 1999-04-30
HK1008111B true HK1008111B (zh) 1999-04-30

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