HK1097071B - A wireless ic tag and a method for manufacturing antenna - Google Patents

Description

Method for manufacturing wireless IC tag and antenna

Technical Field

The present invention relates to a wireless IC tag having sufficient durability even in a severe use environment, and a method for manufacturing an antenna used for the wireless IC tag.

Background

There is known a radio frequency identification (rfid) type wireless IC tag that receives an interrogation signal transmitted from an interrogator and returns a response signal including information such as a stored identification number. As one of such wireless IC tags, a wireless IC tag called a linen tag (linen tag) is known for the purpose of being attached to clothes. Here, the linen label has a rectangular shape as described in japanese unexamined patent publication No. 9-61520, for example, and has a structure in which urethane resin is adhered to both surfaces of a film-shaped circuit portion on which an IC chip or a loop antenna is mounted, and the entire surface thereof is coated with a silicon film (coating). In addition, Japanese patent laid-open No. 2005-56362 discloses the following structure: the case is formed in a button shape, and a hooking member for hooking and fixing the thread-like member to a part of the case is provided in a button shape.

The linen label is exposed to a high-temperature and high-pressure environment, for example, during washing or cleaning. Accordingly, flax labels are required to have a construction that is also tolerable in such environments. Here, if the rectangular flax label is placed in a high-pressure dehydrator (recently, there is a facility for performing dehydration at a high pressure of 4.4 MPa), for example, an antenna portion may be broken due to metal fatigue. On the other hand, the button-shaped linen label is difficult to break the antenna due to its structure, but the button-shaped linen label has a problem that it is easy to fall off due to centrifugal dehydration, and its application range is limited to specific clothes due to its shape.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object of the present invention is to provide: provided are a method for manufacturing a wireless IC tag and an antenna having sufficient durability even in a severe use environment.

In order to achieve the above object, the main invention of the present invention is a wireless IC tag including: an IC chip including a response circuit for receiving a signal transmitted from an interrogator and transmitting a response signal to the signal; a rectangular antenna connected to the response circuit; a hard first protective material covering the IC chip; and a second protective material that is softer than the first protective material and covers at least a part of the antenna, wherein the antenna has a structure in which a first antenna member and a second antenna member that is softer than the first antenna member and has higher toughness are stacked, and the first protective material and the second protective material are bonded by a heat sealing method.

In the wireless IC tag of the present invention, the IC chip is reliably protected by the hard first protective material from external force or the like, and the antenna portion which is easily broken by bending due to external force is protected by the soft second protective material which is less likely to form a fold. Therefore, a wireless IC tag having sufficient durability even in a severe use environment can be provided.

According to the present invention, a wireless IC tag having sufficient durability even in a severe use environment can be realized.

Disclosure of Invention

Fig. 1 is a perspective view of a wireless IC tag 1 explained as an embodiment of the present invention.

Fig. 2 is a cross-sectional view of the wireless IC tag 1 shown in fig. 1, which is described as an embodiment of the present invention.

Fig. 3 is a plan view of the first antenna member 12 explained as one embodiment of the present invention.

Fig. 4 is a plan view of the second antenna member 13 explained as one embodiment of the present invention.

Fig. 5 is a plan view of a symmetrical antenna explained as one embodiment of the present invention.

Fig. 6 is a sectional view of the configuration of the second antenna member 13 explained as one embodiment of the present invention.

Fig. 7 is a side view of the antenna 91 and the first and second members 141 and 142 illustrating the position of the fold when the antenna 91 is bent by an external force.

Fig. 8 is a side view of the antenna 91 and the first and second members 141 and 142 according to an embodiment of the present invention illustrating the position of the fold in the case of changing the length of the first and second members 141 and 142 extending in the longitudinal direction of the antenna.

Fig. 9 is a block diagram illustrating a circuit integrated in the IC chip 11 as one embodiment of the present invention.

Fig. 10 is a cross-sectional view of the wireless IC tag 1 explained as one embodiment of the present invention.

Fig. 11(a) to (c) are views illustrating an example of a manner of overlapping the second antenna member 13 and the first antenna member 12 in the case where 2 second antenna members 13 are provided, which is described as an embodiment of the present invention.

Fig. 12 is a cross-sectional view of the wireless IC tag 1 described as an embodiment of the present invention, in which the second protective material 15 is configured to cover only the periphery of the first protective material 14.

Fig. 13 is a cross-sectional view of the wireless IC tag 1 according to the embodiment of the present invention, in which the second protective material 15 is formed to cover only the periphery of the first protective material 14 and 2 second antenna members 13 are provided.

Fig. 14 is a cross-sectional view of the wireless IC tag 1 described as an embodiment of the present invention in which the first protective material 14 is provided on the outer peripheral side of the second protective material 15.

Fig. 15 is a cross-sectional view of the wireless IC tag 1 having the configuration of fig. 14 and including 2 second antenna members 13, which is described as an embodiment of the present invention.

Fig. 16 is a cross-sectional view of the wireless IC tag 1 in which the second protective material 15 covers only the periphery of the first protective material 14 in the wireless IC tag 1 having the structure of fig. 15, which is described as an embodiment of the present invention.

Fig. 17 is a cross-sectional view of a wireless IC tag 1 having 2 second antenna members 13 provided in the wireless IC tag 1 having the configuration of fig. 16, which is described as an embodiment of the present invention.

Fig. 18 is a plan view of the second antenna member 13 explained as one embodiment of the present invention.

Fig. 19 is a plan view of an asymmetric antenna explained as an embodiment of the present invention.

Fig. 20 is a perspective view of the wireless IC tag 1 configured by using an asymmetric antenna according to an embodiment of the present invention.

Fig. 21 is a cross-sectional view of a wireless IC tag 1 configured using an asymmetric antenna, which is described as an embodiment of the present invention.

Fig. 22 is a cross-sectional view of a wireless IC tag 1 in which 2 second antenna members 13 are provided in the wireless IC tag 1 using an asymmetric antenna, which is described as an embodiment of the present invention.

Fig. 23 is a cross-sectional view of the wireless IC tag 1 in which the second protective material 15 covers only the periphery of the first protective material 14 in the wireless IC tag 1 using the asymmetric antenna, which is described as an embodiment of the present invention.

Fig. 24 is a cross-sectional view of the wireless IC tag 1 in which 2 second antenna members 13 are provided in the wireless IC tag 1 shown in fig. 23, which is described as an embodiment of the present invention.

Fig. 25 is a cross-sectional view of the wireless IC tag 1 in which the first protective material 14 is provided on the outer peripheral side of the second protective material 15 in the wireless IC tag 1 using the asymmetric antenna, which is described as an embodiment of the present invention.

Fig. 26 is a cross-sectional view of the wireless IC tag 1 in which 2 second antenna members 13 are provided in the wireless IC tag 1 shown in fig. 25, which is described as an embodiment of the present invention.

Fig. 27 is a cross-sectional view of the wireless IC tag 1 in which the second protective material 15 covers only the periphery of the first protective material 14 in the wireless IC tag 1 shown in fig. 25, which is described as an embodiment of the present invention.

Fig. 28 is a cross-sectional view of the wireless IC tag 1 in which 2 second antenna members 13 are provided in the wireless IC tag 1 shown in fig. 27, which is described as an embodiment of the present invention.

Fig. 29(a) and (b) are diagrams illustrating a method of manufacturing a symmetric antenna, which is described as an embodiment of the present invention.

Fig. 30(a) and (b) are diagrams illustrating a method for manufacturing an asymmetric antenna, which is described as an embodiment of the present invention.

Fig. 31 is a plan view of a symmetrical antenna provided with a non-slip hole 331 explained as one embodiment of the present invention.

Fig. 32 is a plan view of an asymmetric antenna provided with a non-slip hole 331 explained as an embodiment of the present invention.

Detailed Description

Hereinafter, examples of the present invention will be described in detail. Fig. 1 is a perspective view of a wireless IC tag 1 explained as an embodiment of the present invention. Fig. 2 is a sectional view of the wireless IC tag 1 of fig. 1 taken along line a-a'. The wireless IC tag 1 is constituted by: an IC chip 11 into which an RFID response circuit and the like are integrated; a first antenna member 12 and a second antenna member 13 constituting the antenna 91; a first protective material 14 and a second protective material 15 that protect the IC chip 11 and the antenna 91.

In fig. 3 a plan view of the first antenna component 12 is shown. The first antenna member 12 is, for example, a flat rectangular member having a size of about 2mm in length, 20mm in width, and 0.2mm in thickness, and is made of a hard, low-toughness material having low metal fatigue, such as a conductor foil of a metal such as aluminum (Al) or copper (Cu). The IC chip 11 is fixed to the substantially center of the first antenna member 12 on one surface thereof with an adhesive such as an anisotropic conductive film or a conductive paste (paste). The IC chip 11 may also have its electrode portion fixed on the first antenna member 12 by friction based on ultrasonic waves. In this case, in order to strongly bond the electrode of the IC chip 11 made of gold (Au) bump (bump) to the first antenna member 12, it is desirable that the material of the first antenna member 12 is hard, and for example, when aluminum is used as the material of the first antenna member 12, aluminum that is harder than soft aluminum (a1) can be physically strongly bonded. In the following description, the side of the wireless IC tag 1 on which the IC chip 11 is mounted on the first antenna member 12 is referred to as a front surface, and the other side opposite to the front surface is referred to as a back surface.

Provided substantially in the center of the first antenna member 12 are: the notch portion 121 is formed to extend from the front surface to the back surface of the first antenna member 12, and is formed of a notch extending from the IC chip 11 in the longitudinal direction of the first antenna member 12 and a notch extending from the IC chip 11 in the direction perpendicular to the longitudinal direction of the first antenna member 12 and reaching the end surface. The notch portion 121 functions as an inductor which constitutes a matching circuit that is coupled to a capacitive element formed inside the IC chip 11 to match the resistance between the IC chip 11 and the antenna 91.

Fig. 4 is a plan view of the second antenna member 13. The second antenna member 13 has a size of, for example, a planar rectangle having a length of 3mm, a width of 50mm, and a thickness of about 89 μm. In addition, the width of the second antenna member 13 is generally set to a length of 1/2 of the use wavelength λ of the wireless IC tag 1. The second antenna member 13 has, at substantially the center in the longitudinal direction thereof: a rectangular notch 131 having a smaller outer shape than the first antenna member 12 and having a long side parallel to the longitudinal direction of the first antenna member 12.

The antenna 91 of the wireless IC tag 1 is configured by overlapping the first antenna member 12 and the second antenna member 13 having the shapes described above. Fig. 5 is a plan view of the antenna 91 (hereinafter referred to as a symmetrical antenna) of the wireless IC tag 1 configured as described above. In addition, in the case of overlapping the first antenna member 12 and the second antenna member 13, the portion of the cutout portion 121 of the first antenna member 12 does not overlap the second antenna member 13. This is because if part of the cutout portion 121 overlaps with the second antenna member 13, the inductance of the inductance formed by the cutout portion 121 varies.

Fig. 6 is a sectional view illustrating the configuration of the second antenna member 13. As shown in the figure, the second antenna member 13 has the following structure (laminated film structure): a CPP layer 61 made of non-oriented PolyPropylene (CPP), a conductor layer 62 made of a conductor, and a PET layer 63 made of polyethylene terephthalate (PET) were sequentially laminated in a thickness of 70 μm, 7 μm, and 12 μm, respectively. The conductor layer 62 is, for example, a conductor foil or a vapor-deposited film of a metal such as aluminum (a1) or copper (Cu). The laminated film constituted by the above-described configuration is easily available since products manufactured in, for example, retort assemblies are commercially available. In addition, the structure of the second antenna member 13 may be configured as follows: for example, a configuration in which hdpe (high Density polyethylene), a conductor, and PET are sequentially laminated; a configuration in which the CPP, the conductor, and the CPP are sequentially stacked; a CPP, conductor and HDPE configuration are sequentially stacked.

The second antenna member 13 having the laminated film structure as described above is soft and has high toughness as compared with the first antenna member 12, and has a characteristic that it is not easily creased when it is bent. In addition, the tensile strength, the tensile rupture strength, and the rupture strength are also ensured by the laminated film structure. Therefore, by forming the antenna 91 by overlapping the second antenna member 13 formed in such a structure and the first antenna member 12 formed of a hard and low-toughness material and forming the wireless IC tag 1 using the antenna members, the IC chip 11 and the notch portion 121 can be reliably protected from external force, and the wireless IC tag 1 having resistance to external force or bending in a portion extending in the longitudinal direction of the antenna 91 can be realized. The wireless IC tag 1 configured as described above is flat and thin, and thus can be applied to clothing, and of course, has a wider range of applications.

Next, the first protective material 14 and the second protective material 15 will be described. As shown in the sectional view of fig. 2, the first protective material 14 is composed of: a rectangular first member 141 covering the first antenna member 12 from the surface side thereof; the rectangular second member 142 of the first antenna member 12 is covered from the back surface side thereof. Here, as the material of the first member 141 and the second member 142, a material having high strength and heat resistance capable of reliably protecting the IC chip 11 from external force, heat, or the like is used, for example, polyethylene (melting point 130 ℃), polypropylene (melting point 170 ℃), polyethylene Terephthalate (PET: Poly Ethylene Terephthalate, melting point 250 ℃), amorphous polyester (PETG: polyethylene Terephthalate: no melting point), nylon 6 (melting point 225 ℃), polyvinyl Alcohol (PVA: Poly Vinyl Alcohol: melting point 230 ℃), nylon 6, 6 (melting point 267 ℃), or the like. Further, polytetrafluoroethylene (melting point 327 ℃ C.) has high chemical resistance, and is therefore particularly useful in the embodiment in which the first protective material is located outside the second protective material. The first protective material 14 may be configured to adhere the first member 141 and the second member 142 together by heat sealing.

On the other hand, the second protective material 15 has the following configuration: the first film on the front surface side of the first antenna member 11 and the second film on the back surface side of the first antenna member 11 are bonded together by heat sealing. In this way, the inside of the second protective material 15 is sealed by heat sealing, and thus waterproofness is ensured. As the second protective material 15, a material having flexibility, high elasticity, and sufficient heat resistance, such as urethane-based synthetic rubber or silicone rubber, can be used. By using a soft and highly elastic material for the second protective material 15 in this manner, it is possible to prevent the antenna 91 from being folded when the second protective material 15 is bent by an external force. In addition, the second protective material 15 extends to the outside longer than the first protective material 14 along the length direction of the antenna 91. Therefore, even when the antenna is bent by an external force, the external force is absorbed by the elasticity of the second protective material 15, and stress is less likely to concentrate on the base portion (fulcrum), and thus a fold is less likely to occur.

Further, when the second antenna member 13 is bent by an external force, for example, as shown in fig. 7, a base portion of the second antenna member 13 abuts against an end portion of the first member 141 or the second member 142, a fold is formed in the base portion, and the antenna 91 is easily broken in the portion. To prevent this, for example, the lengths of the first member 141 and the second member 142 extending in the longitudinal direction of the antenna 91 may be changed. That is, since the position of the fold is different depending on the direction in which the second antenna member 13 is bent when it is bent, the fold is not concentrated on a specific portion of the antenna 91 (see fig. 8), and the resistance of the antenna 91 against bending can be improved.

The IC chip 11 fixed to the first antenna 12 is a component in which a circuit such as the communication circuit or the nonvolatile memory is formed on a silicon substrate. Fig. 9 shows a block diagram of a circuit integrated in the IC chip 11. As shown in the figure, an antenna circuit 911, a rectifier circuit 92, a power supply regulator 93, a clock generation circuit 94, a demodulation circuit 95, a modulation circuit 96, a logic circuit 97, a nonvolatile memory 98, and the like are integrated in the IC chip 11. The circuit shown in the figure operates as follows, for example. First, if an interrogation signal transmitted from an interrogator is received in the antenna circuit 911, an electromotive force is generated in the antenna circuit 911 by the received signal. A part of the electromotive force is rectified by the rectifier circuit 92 to become the driving power of the wireless IC tag 1. The other part of the electromotive force is supplied to the clock generation circuit 94, and a clock signal for operating the logic circuit 97 and the like is generated. On the other hand, a reception signal received by the antenna circuit 911 is demodulated by the demodulation circuit 95, and the logic circuit 97 reads information stored in the nonvolatile memory 98 based on the demodulated signal. The logic circuit 97 supplies the read information to the modulation circuit 96, and transmits the modulated signal modulated by the modulation circuit 96 from the antenna circuit 911 to the outside as a response signal.

Fig. 10 is a cross-sectional view of a wireless IC tag 1 according to another embodiment of the present invention in which the wireless IC tag 1 having the structure shown in fig. 1 to 2 is modified, and 2 second antenna members 13 are provided. By providing the second antenna member 13 in multiple layers in this manner, the strength of the antenna 91 against external force can be increased. In addition, as a manner of overlapping the second antenna member 13 and the first antenna member 12 in the case where 2 second antenna members 13 are provided, for example, there are: a method of sandwiching the first antenna member 12 between 2 second antenna members 13 (fig. 11 (a)); a method of arranging a member in which 2 second antenna members 13 are overlapped on the surface side of the first antenna member 12 (fig. 11 (b)); a method (fig. 11(c)) of disposing a member having 2 second antenna members 13 stacked on the back surface side of the first antenna member 12.

As shown in fig. 12, the wireless IC tag 1 may be such that the second protective material 15 covers only the periphery of the first protective material 14. In this case, since the base portion of the second antenna member 13 is protected by the soft second protective material 15, the second antenna member 13 is less likely to be folded, and therefore, the IC chip 11 and the notch portion 121 can be reliably protected from external force, and the portion extending in the longitudinal direction of the antenna 91 can be made resistant to bending. Further, since the portion not protected by the second protective material 15 can be made thin, the range of use of the wireless IC tag 1 can be widened in the case where there is a problem in thickness. As shown in fig. 13, 2 second antenna members 13 may be stacked on the wireless IC tag 1 having the structure shown in fig. 12.

The wireless IC tag 1 shown in fig. 14 changes the order of overlapping the first protective material 14 and the second protective material 15 with respect to the IC chip 11, and the first protective material 14 is provided on the outer peripheral side of the second protective material 15. As described above, various modifications can be made to the method of laminating the first protective material 14 and the second protective material 15 in accordance with the form and use of the wireless IC tag 1.

In the wireless IC tag 1 shown in fig. 15, 2 second antenna members 13 are provided in the wireless IC tag 1 having the structure of 14. In the wireless IC tag 1 having the structure shown in fig. 15, the second protective material 15 covers only the periphery of the first protective material 14 in the wireless IC tag 1 shown in fig. 16. In the wireless IC tag 1 shown in fig. 17, 2 second antenna members 13 are provided in the wireless IC tag 1 having the configuration shown in fig. 16.

However, the structure of the antenna 91 may be the structure shown in fig. 18, other than the above-described symmetrical antenna. The second antenna member 13 shown in the figure is, for example, a planar rectangle having a length of 3mm, a width of 45mm, and a thickness of about 89 μm. In the second antenna member 13 shown in the figure, the notch 12 is not provided as in the case of a symmetrical antenna. As shown in fig. 19, the antenna 91 using the second antenna member 13 shown in the figure is configured such that: the first antenna member 11 and the second antenna member 12 are overlapped in parallel in the longitudinal direction thereof, so that the first antenna member 12 constituted by the structure shown in fig. 3 does not overlap with a portion where the IC chip 11 and the matching circuit are provided.

The wireless IC tag 1 shown in fig. 20 and 21 is an example of the wireless IC tag 1 configured by using the antenna 91 (hereinafter referred to as an asymmetric antenna) configured by the configuration shown in fig. 19. Fig. 20 is a perspective view of the wireless IC tag 1, and fig. 21 is a sectional view of the wireless IC tag 1 of fig. 20 taken along line a-a'.

As in the case of the symmetric antenna, various modifications can be made to the wireless IC tag 1 using the asymmetric antenna. For example, the wireless IC tag 1 shown in fig. 22 is an example in which 2 second antenna members 13 are provided in the wireless IC tag 1 using an asymmetric antenna. In the wireless IC tag 1 shown in fig. 23, the second protective material 15 covers only the periphery of the first protective material 14 in the wireless IC tag 1 shown in fig. 21. The wireless IC tag 1 shown in fig. 24 is the wireless IC tag 1 shown in fig. 23, in which 2 second antenna members 13 are provided. In the wireless IC tag 1 shown in fig. 25, the first protective material 14 is provided on the outer peripheral side of the second protective material 15. The wireless IC tag 1 shown in fig. 26 is the wireless IC tag 1 shown in fig. 25, in which 2 second antenna members 13 are provided. In the wireless IC tag 1 shown in fig. 27, the second protective material 15 covers only the periphery of the first protective material 14 in the wireless IC tag 1 shown in fig. 25. Further, in the wireless IC tag 1 shown in fig. 28, 2 second antenna members 13 are provided in the wireless IC tag 1 shown in fig. 27.

Next, the above-described symmetric antenna and the method of manufacturing the asymmetric antenna will be described. Fig. 29 shows an example of a method for manufacturing a symmetric antenna. In this method, first, a band-shaped first material 301 having slit portions 121 formed at predetermined intervals in the longitudinal direction is superimposed on a second material 302 in which rectangular slits 131 having long sides parallel to each other in the longitudinal direction are formed symmetrically at predetermined intervals and bent along the longitudinal center axis thereof, so that each slit portion 121 plugs each slit 131 without overlapping the second material (fig. 29 (a)). Next, the overlapped first material 301 and second material 302 are cut so that the cuts 131 are separated from each other, and the symmetrical antenna is cut (fig. 29 (b)).

On the other hand, fig. 30 shows an example of a method for manufacturing an asymmetric antenna. In this method, first, a strip-shaped first material 311 having a plurality of cut portions 121 formed perpendicularly to the longitudinal direction of a strip-shaped second material 312 bent along the longitudinal direction center axis thereof is inserted into the strip-shaped second material 312, and the first material 311 and the second material 312 are overlapped so that the long sides of the first material 311 and the second material 312 are parallel to each other and the cut portions 121 do not overlap the second material 312 (fig. 30 (a)). Next, the overlapped first material 311 and second material 312 are cut into a rectangular shape so that the longitudinal direction of the second material 312 becomes the short side of the antenna and the cut portions 121 are separated from each other (fig. 30 (b)).

In the above-described method of manufacturing a symmetric antenna, the first material 301 and the second material 302 are positioned by moving the first material 301 or the second material 302 in the short-side direction of the first antenna member 12. On the other hand, in the case of an asymmetric antenna, the first material 311 and the second material 312 are positioned by moving the first material 311 or the second material 312 in the longitudinal direction of the first antenna member 12. Therefore, the asymmetrical antenna adjusted by moving in the longitudinal direction of the first antenna member 12 has a larger tolerance than the symmetrical antenna, and the asymmetrical antenna can be positioned more easily than the symmetrical antenna. In the method for manufacturing a symmetric antenna, the resin 303 for connecting the adjacent second antenna members 13 needs to be interposed between the second antenna members 13 of the first material 301, but the resin is not necessary in the method for manufacturing an asymmetric antenna, and the material cost can be reduced as compared with the method for manufacturing a symmetric antenna.

The above description of the embodiment of the present invention has been made in detail, but the above description of the embodiment is only for the purpose of facilitating understanding of the present invention and does not limit the present invention. The present invention can be modified and improved without departing from the gist thereof, and equivalents thereof are also encompassed by the present invention.

For example, the first protective material 14 may be formed by potting a resin such as an epoxy resin.

When a large external force is applied to the end of the second protective member 15 to extend the second protective member 15, the length of the antenna 91 that is difficult to stretch or contract is hardly changed, and when only the second protective member 15 is extended and the second protective member 15 is contracted without the external force, the antenna 91 may come off the second protective member 15 and be deformed into a wave shape. Here, holes (hereinafter referred to as slip-preventing holes 331) may be provided at predetermined intervals along the longitudinal direction of the antenna 91, and the holes may be filled with the second protective material 15 to connect the front surface side and the back surface side of the second protective material 15, thereby preventing the deformation. That is, by doing so, even if an external force is applied to the second protective material 15, only the end portion of the second protective material 15 extends, and the second protective material 15 in the portion between the slip prevention holes 331 hardly extends, so that the antenna 91 does not come off even if the second protective material 15 is shortened, and as a result, the above-described deformation can be prevented. Fig. 31 is a plan view of a symmetrical antenna provided with the anti-slip hole 331, and fig. 32 is a plan view of an asymmetrical antenna provided with the anti-slip hole 331.

Claims (22)

1. A wireless IC tag characterized by comprising:

an IC chip including a response circuit for receiving a signal transmitted from an interrogator and transmitting a response signal to the signal;

a rectangular antenna connected to the response circuit;

a hard first protective material covering the IC chip;

a second protective material softer than the first protective material covering at least a portion of the antenna, wherein

The antenna has a structure in which a first antenna member and a second antenna member that is softer and more flexible than the first antenna member are stacked, and the first protective material and the second protective material are bonded by a heat sealing method.

2. The wireless IC tag according to claim 1, wherein:

the second protective material is longer than the first protective material in the longitudinal direction of the antenna and extends outward.

3. The wireless IC tag according to claim 1, wherein:

the second protective material is provided on the outer peripheral side of the first protective material.

4. The wireless IC tag according to claim 1, wherein:

the first protective material is provided on an outer peripheral side of the second protective material.

5. The wireless IC tag according to claim 1, wherein:

the second protective material is provided so as to cover the entire antenna.

6. The wireless IC tag according to claim 1, wherein:

the second protective material is disposed to cover only a portion of the antenna.

7. The wireless IC tag according to claim 1, wherein:

the first protective material includes a planar first member provided on the front surface side of the antenna and a planar second member provided on the back surface side of the antenna,

the first member and the second member have different lengths extending outside in the longitudinal direction of the antenna.

8. The wireless IC tag according to claim 1, wherein:

the IC chip is provided at a central portion in a longitudinal direction of the antenna.

9. The wireless IC tag according to claim 1, wherein:

the IC chip is provided at a longitudinal end of the antenna.

10. The wireless IC tag according to claim 1, wherein:

the material of the first protective material is at least one of polyethylene, polyethylene terephthalate, amorphous polyester, nylon 6, polyethylene alcohol, polypropylene, nylon 6, polytetrafluoroethylene and epoxy resin.

11. The wireless IC tag according to claim 1, wherein:

the material of the second protective material is at least one of urethane synthetic rubber or silicone rubber.

12. The wireless IC tag according to claim 1, wherein:

the antenna has a laminated film structure in which a conductor layer and a resin layer are laminated.

13. The wireless IC tag according to claim 12, wherein:

the conductor layer is formed of at least one of a conductor foil and a conductor vapor deposition film.

14. The wireless IC tag according to claim 12, wherein:

the conductor layer is a layer made of at least one of aluminum, copper, and silver.

15. The wireless IC tag according to claim 12, wherein:

the resin layer is a layer made of at least one of non-oriented polypropylene, polyethylene terephthalate, and high-density polyethylene.

16. The wireless IC tag according to claim 12, wherein:

the laminated film structure may be at least one of a structure in which inextensible polypropylene, a conductor and polyethylene terephthalate are sequentially laminated, a structure in which high-density polyethylene, a conductor and polyethylene terephthalate are sequentially laminated, a structure in which inextensible polypropylene, a conductor and inextensible polypropylene are sequentially laminated, and a structure in which inextensible polypropylene, a conductor and high-density polyethylene are sequentially laminated.

17. The wireless IC tag according to claim 1, wherein:

the antenna has a structure in which a plurality of planar antenna members having different rigidities are stacked.

18. The wireless IC tag according to claim 1, wherein:

the IC chip is disposed on the first antenna element,

a notch portion constituting a matching circuit for obtaining impedance matching between the antenna and the response circuit is formed in the first antenna member,

the first antenna member overlaps the second antenna member such that the cutout portion does not overlap the second antenna member.

19. The wireless IC tag according to claim 18, wherein:

a notch is provided at the center of the second antenna member,

the first antenna member overlaps the second antenna member such that the cutout portion does not overlap the cutout groove.

20. The wireless IC tag according to claim 18, wherein:

the first antenna member overlaps with a longitudinal end of the second antenna member.

21. The wireless IC tag according to claim 18, wherein:

the antenna has a structure in which a plurality of the second antenna elements overlap the first antenna element.

22. The wireless IC tag according to claim 5, wherein:

a plurality of through holes are formed in the antenna at predetermined intervals,

a portion of the second protective material covering the front surface side of the antenna and a portion of the second protective material covering the rear surface side of the antenna are connected by the second protective material filled in the through hole.