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HK1080047B - 模塊式頂置空調系統的結構 - Google Patents

模塊式頂置空調系統的結構 Download PDF

Info

Publication number
HK1080047B
HK1080047B HK06101864.5A HK06101864A HK1080047B HK 1080047 B HK1080047 B HK 1080047B HK 06101864 A HK06101864 A HK 06101864A HK 1080047 B HK1080047 B HK 1080047B
Authority
HK
Hong Kong
Prior art keywords
evaporator
module
sections
bus
set forth
Prior art date
Application number
HK06101864.5A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1080047A1 (zh
Inventor
Peter R. Bushnell
Robert C. Reimann
Christopher Repice
Mark Colton
Xuqiang Liao
Gawain Mundy
Stephen Stopyra
Belin Czechowicz
Suresh Duraisamy
Timothy R. Campbell
Original Assignee
Carrier Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/429,389 external-priority patent/US6763670B1/en
Application filed by Carrier Corporation filed Critical Carrier Corporation
Publication of HK1080047A1 publication Critical patent/HK1080047A1/zh
Publication of HK1080047B publication Critical patent/HK1080047B/zh

Links

HK06101864.5A 2003-05-05 2004-04-26 模塊式頂置空調系統的結構 HK1080047B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/429,389 US6763670B1 (en) 2003-05-05 2003-05-05 Configuration for modular rooftop air conditioning system
US10/429,389 2003-05-05
PCT/US2004/012937 WO2004098931A1 (en) 2003-05-05 2004-04-26 Configuration for modular rooftop air conditioning system

Publications (2)

Publication Number Publication Date
HK1080047A1 HK1080047A1 (zh) 2006-04-21
HK1080047B true HK1080047B (zh) 2006-12-29

Family

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