HK1070047B - Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel - Google Patents

Description

Cutter roller, scoring device using same, scoring method, method for dividing bonded substrate, and method and device for manufacturing cutter roller

Technical Field

The present invention relates to a cutter roller serving as a scoring cutter for forming a score line in a brittle material, a scoring device to which the cutter roller is attached, a scoring method and a bonded substrate cutting method for forming a score line for cutting a brittle material, and a cutter roller manufacturing method and device for manufacturing the cutter roller.

The brittle material includes glass, semiconductor wafers, ceramics, and the like used for glass substrates and bonded glass substrates.

Background

Compared with a display adopting a Liquid Crystal Display (LCD), the organic EL display adopting the organic Electroluminescent (EL) device does not need a background light because of self-luminous type, thereby being extremely thin, having small electric energy consumption and quick response speed; due to the advantages described above, in recent years, development of Flat Panel Displays (FPDs) as a next generation alternative to LCD displays has been progressing at a high speed.

An organic EL device is formed by stacking a transparent anode layer, an organic hole injection layer, an organic light emitting layer, and a metal electrode layer (cathode) in this order on a glass substrate, and by applying a dc voltage to the device, holes and electrons are injected from the anode and the cathode, respectively, into the organic hole injection layer, and the electrons and holes are recombined in the organic light emitting layer to generate an excited state, and light is emitted in the process of shifting from the excited state to a ground state. Such an organic EL device is also manufactured through a process of forming a plurality of devices in a matrix on a brittle substrate, and then dicing the substrate into the devices, similarly to a semiconductor chip such as a large scale integrated circuit (LSI), for example.

As a method used for cutting a brittle substrate such as glass, silicon, or ceramic, there are a cutting method in which a substrate is cut with a diamond blade having a thickness of about 50 to 200 μm rotating at a high speed to form a cutting groove on the substrate, and a scoring method in which a cutter roller made of diamond having a thickness of about 0.6 to 2mm scratches the surface of the substrate to generate a vertical crack in the thickness direction of the substrate.

As described above, the cutting method uses a blade having an extremely thin thickness as compared with a cutter roll of the scoring method, and therefore, when a substrate having a thin film or a convex portion formed on the surface thereof, such as the organic EL device, is cut, the thin film or the convex portion is not easily damaged, and thus the cutting method is a suitable method.

However, in the case of the cutting method, heat is generated by friction in a region where the blade is cutting, and cooling water must be supplied to the region during cutting, and therefore, the method is absolutely not a desirable method for an organic EL device having a metal portion such as a metal electrode layer and a metal terminal. That is, in the case of the cutting method, it is practically difficult to completely remove the cooling water after cutting, and if the cooling water is not completely removed and moisture remains, there is a possibility that the metal portion of the organic EL device is corroded. Further, the cutting method has a problem of low productivity because of a long cutting time as compared with the scoring method.

In contrast, the scoring method does not require any cooling water at all, and therefore has advantages of higher yield than the method using cutting, shorter cutting time than the cutting method, and higher productivity.

However, the scoring method has a problem of completely different properties from the cutting method.

That is, since the scoring method is different from the cutting method in that it is difficult to score if a thin film is present on the substrate, in the case of cutting by the scoring method, the convex portion including the light emitting portion and the thin film are formed on the surface of the substrate at an interval into which the cutter roller can be inserted. Further, the substrate surface exposed from between the convex portions or the films is scored by the cutter roller, but as shown in fig. 28, the conventional cutter roller H has a blade edge line C located at the center between both side surfaces of the roller, and therefore, the scoring position S has to be sufficiently distant from the convex portions or the films X in order to avoid interference between the cutter roller H and the convex portions or the films. The notch position S is located at a position far from the projection or the thin film X, which causes a problem that the size of the substrate per one device is larger than necessary.

Fig. 30(a) to (d) are cross-sectional views illustrating respective steps of a1 st dividing method of a liquid crystal mother substrate, which is an example of a conventional step of cutting a bonded glass substrate such as a liquid crystal mother substrate from a desired cutting position. In the following description, for convenience, one of the bonded glass substrates 71 formed by bonding a pair of glass substrates as liquid crystal mother substrates to each other in an opposed manner is referred to as a glass substrate 7A, and the other glass substrate is referred to as a glass substrate 7B.

(1) First, as shown in fig. 30(a), the glass substrate 7A of the bonded glass substrate 71 is faced upward, the bonded glass substrate 71 is set on the 1 st scoring device, and the glass substrate 7A is scored using the glass cutter roller 72 to form a score line Sa.

(2) Next, the front and back surfaces of the bonded glass substrate 71 on which the score line Sa is formed on the glass substrate 7A are reversed, and the glass substrate is conveyed to the 2 nd scoring device. Thereafter, in the second scoring device 2, as shown in fig. 30(B), the glass substrate 7B to which the glass substrate 71 is bonded is scored using the glass cutter roller 72, thereby forming a score line Sb parallel to the score line Sa. Since a plurality of liquid crystal panels are formed as the liquid crystal mother substrates and terminals are formed on the side edge portion of the glass substrate on which the liquid crystal panels are formed, in many cases, the score line Sb formed on the glass substrate 7B and the score line Sa formed on the glass substrate 7A are formed so as to be shifted from each other in score position in the horizontal direction.

(3) Next, the bonded glass substrate 71 having the score line Sa and the score line Sb formed on the glass substrate 7A and the glass substrate 7B, respectively, is sent to the 1 st breaking device with the glass substrate 7B facing upward without turning the glass substrate 7A and the glass substrate 7B up and down. In the 1 st breaking apparatus, as shown in fig. 30(c), the bonded glass substrate 71 is placed on a backing plate 74, and the breaking bar 73 presses the glass substrate 7B of the bonded glass substrate 71 along a score line Sa formed on the glass substrate 7A. Then, on the lower glass substrate 7B, the vertical crack extends upward from the score line Sa, and the glass substrate 7A is broken along the score line Sa.

(4) Next, the glass substrate 7A and the glass substrate 7B of the bonded glass substrate 71 in which the glass substrate 7A was broken were turned upside down, and the glass substrate 7A was conveyed to the 2 nd breaking device with the glass substrate 7A facing upward. In the 2 nd breaking apparatus, as shown in fig. 30(d), the bonded glass substrate 71 is placed on a backing plate 74, and the breaking bar 73 presses the glass substrate 7A of the bonded glass substrate 71 along a score line Sb formed on the glass substrate 7B. Then, the lower glass substrate 7B is broken along the score line Sb.

By performing the above-described steps (1) to (4), the bonded glass substrate 71 is divided into two pieces from a desired position.

As shown in the above steps (3) and (4), the breaking bar 73 presses the glass plate located on the upper surface, thereby breaking the glass substrate located on the lower surface. When the breaking bar 73 is pressed against the upper glass substrate 7B as shown in fig. 30(c), for example, the glass substrate 7A and the glass substrate 7B are in a state where the portion pressed against by the breaking bar 73 is raised downward, and a force is generated in a direction in which a crack (vertical crack) in the vertical direction of the score line Sa, which has been generated in the glass substrate 7A, is propagated to both sides. Then, the vertical crack extends up to the upper portion of the glass substrate 7A, thereby dividing the glass substrate 7A. The score line Sb formed on the upper glass substrate 7B is subjected to a force of pressing the crack (vertical crack) from both sides, in contrast to the lower glass substrate, and therefore the upper glass substrate 7B is not broken.

In the breaking step performed in steps (3) and (4), for example, as shown in fig. 30(c), when the depth of the vertical crack of the score line Sa of the lower glass substrate 7A is small, a large pressing force needs to be applied to break the glass substrate 7A. However, if the pressing force applied by the breaking bar 73 is too large, the upper glass substrate 7B may be broken at the same time. In this case, the lower glass substrate 7A is not problematic because the vertical crack extends in a substantially vertical direction and breaks, but the upper glass substrate 7B may have an inclined dividing plane because the pressing force of the breaking bar 73 is not applied at the same position as the score line Sb formed in the glass substrate 7B and no force acts in a direction in which the upper glass substrate 7B can be broken. In addition, it may cause the crack portions to cross each other, and a notch (horizontal crack) may occur at the crossing portion. The bonded glass substrate having such an inclined divided surface, a notch, or the like loses its commercial value as a liquid crystal panel.

Accordingly, the present inventors have proposed a method for dividing a brittle substrate, which can solve the above-mentioned problems, in a "method for cutting a bonded glass substrate" disclosed in Japanese patent application laid-open No. 6-48755.

Fig. 31(a) to (d) are cross-sectional views illustrating respective steps in the second cutting method for cutting a brittle material described in the publication. The method described in this publication will be described below with reference to fig. 31(a) to (d).

In the following description, as in fig. 30(a) to (d), for convenience, one of bonded glass substrates 71 formed by bonding a pair of glass substrates as liquid crystal mother substrates to each other is referred to as a glass substrate 7A, and the other is referred to as a glass substrate 7B.

(1) First, as shown in fig. 31(a), the glass substrate 7A with the glass substrate 71 bonded thereto is set on the 1 st scoring device, and the glass cutter roller 72 is used to form a score line Sa on the glass substrate 7A.

(2) Next, the bonded glass substrate 71 having the score line Sa formed thereon on the glass substrate 7A is reversed in front and back sides and conveyed to the 1 st breaking device. In the 1 st breaking apparatus, as shown in fig. 31(B), the bonded glass substrate 71 is placed on a backing plate 74, and the breaking bar 73 presses the glass substrate 7B of the bonded glass substrate 71 along a score line Sa formed on the glass substrate 7A. Then, on the lower glass substrate 7A, the vertical crack extends upward from the score line Sa, and the glass substrate 7A is broken along the score line Sa.

(3) Next, the bonded glass substrate 71 in which the glass substrate 7A was broken was conveyed to the 2 nd scoring device without reversing the front and back surfaces of the glass substrate 7A and the glass substrate 7B. Thereafter, in the second scoring device 2, as shown in fig. 31(c), the glass substrate 7B to which the glass substrate 71 is bonded is scored using the glass cutter roller 72, thereby forming a score line Sb parallel to the score line Sa. Since a plurality of liquid crystal panels are formed as the liquid crystal mother substrates and terminals are formed at the side edge of the glass substrate on which the liquid crystal panels are formed, in many cases, the score line Sb formed on the glass substrate 7B and the score line Sa formed on the glass substrate 7A are formed so as to be shifted from each other in the score position in the horizontal direction.

(4) Next, the front and back sides of the bonded glass substrate 71 were turned over, and the glass substrate 7A was conveyed upward to the 2 nd breaking device. In the 2 nd breaking apparatus, as shown in fig. 31(d), the bonded glass substrate 71 is placed on a backing plate 74, and the breaking bar 73 presses a portion of the glass substrate 7A of the bonded glass substrate 71, which is opposed to the score line Sb formed on the glass substrate 7B, along the score line Sb. Then, the lower glass substrate 7B is broken along the score line Sb. By performing the above-described steps (1) to (4), the bonded glass substrate 71 is divided from a desired position.

According to the second cutting method of the brittle material, as shown in the steps (2) and (4), when the breaking step is performed, although the score line is formed on the lower glass substrate to be broken, since the upper glass substrate does not have the score line, the upper glass substrate is not broken simultaneously with the lower glass substrate. Therefore, the problem of the 1 st dividing method shown in fig. 30(a) to (d), that is, the possibility of occurrence of an inclined dividing surface, a notch, or the like, is avoided.

Fig. 7 shows a front view as seen from a direction perpendicular to the rotation axis of the glass cutter roller 72 used in the 1 st and 2 nd cutting methods. The glass cutter roller 72 is in the form of a disk having a roller diameter of phi and a roller thickness of W, and a blade having a blade angle alpha of obtuse angle is formed around the roller.

The present applicant has disclosed a glass cutter roller capable of forming deep vertical cracks in addition to the improvement of the glass cutter roller 72 shown in fig. 7 in the "glass cutter roller" of japanese unexamined patent publication No. 9-188534.

Fig. 29(a) and (b) show a front view of the glass cutter roller described in the publication and a side view thereof viewed in the direction of the rotation axis.

The glass cutter roller 25 has a concave-convex portion formed on a ridge line portion of a blade formed around the roller. That is, the ridge line portion 25a of the blade has a U-shaped or V-shaped groove 25 b. The groove 25b is formed by cutting a notch at a depth h from the edge ridge portion 25a at every pitch P. Since such grooves 25b are formed, projections j having a height h are formed every pitch P.

In fig. 29(a) and (b), the grooves are drawn in an enlarged scale for clearly showing the grooves formed on the ridge line portion of the glass cutter roller, but actually, the grooves have a size of the order of micrometers and are not visually recognized with the naked eye.

In table 1 below, specific values of the roller diameter Φ, the roller thickness W, and the like are shown, and two types of type 1 and type 2 are listed as examples.

TABLE 1

	Type 1	Type 2
			Diameter of roller	2.5mm	2.0mm
Thickness W of the roller	0.65mm	0.65mm
			Edge angle alpha	125°	125°
Number of projections j	125 pieces of	110 are
			Height h of projection j	5μm	10μm
Pitch p	63μm	63μm
			Knife edge load	3.6Kgf	1.8Kgf
Scoring speed	300mm/sec	400mm/sec

The glass cutter roller 25 having the uneven portions formed on the ridge line portion can dramatically improve the scoring performance, that is, the ability to form vertical cracks, and when scoring is performed using this glass cutter roller 25, vertical cracks as deep as near the lower surface of the glass can be obtained at the time of scoring.

The glass cutter roller having the uneven portions formed on the ridge line portion can greatly improve the scoring performance as compared with the conventional glass cutter roller, but since the accurate uneven portions are formed on the entire circumference of the ridge line portion, it takes a long time to process the uneven portions on the ridge line portion, and there is a problem in workability. When the 2 nd cutting method shown in fig. 31 is performed using the glass cutter roller 25 having the uneven portion formed on the ridge portion as described above, the glass substrate 7B on the upper surface is scored in the step (3), and a score line Sb having a deep vertical crack may be formed on the glass substrate 7B, so that the bonded glass substrate 71 is substantially cut. Therefore, when the bonded glass substrate 71 is sucked by a suction pad or the like and conveyed to the 2 nd breaking device in order to shift from the step (3) to the step (4), a part of the cut bonded glass substrate 71 may remain in the 2 nd scoring device, and a part of the cut bonded glass substrate 71 may fall off during the conveyance of the bonded glass substrate 71, which may cause the line apparatus for cutting the bonded glass substrate 71 to fail to operate normally.

In the series of dividing steps, the cutting device is used, and the cutting device is used to cut the surface of each substrate by using a cutter roller made of diamond with a thickness of about 0.6 to 2mm, so as to generate vertical cracks in the thickness direction of the substrate, and the substrate is appropriately pressed to extend the vertical cracks, thereby realizing the dividing. In this scoring process, chips (glass chips) are inevitably generated at all times. Such glass dust remains on the bonded substrate, and the bonded substrate is scratched, thereby affecting the quality of the bonded substrate. For this reason, it is necessary to perform an operation of removing the glass cullet appropriately.

However, the operation of removing the glass chips generated at the time of scoring requires a large number of steps, and it is sometimes very difficult to completely remove the glass chips. In addition, there is a problem that the surface of the glass substrate is scratched by removing the glass cullet. Such a scratch is undesirable for a liquid crystal display glass substrate, and particularly, even if the scratch is very small, the scratch is enlarged after projection, and the quality of the projector substrate is reduced, reliability cannot be ensured, and yield is reduced.

The present invention has been made to solve the problems of the above-described apparatuses and methods, and aims to achieve the following objects (1) to (3).

(1) Provided are a cutter roller, and a scoring method and a scoring device using the cutter roller, which can score a substrate from a position close to a convex part or a thin film without damaging the convex part or the thin film for each device.

(2) Provided are a glass cutter roller capable of solving the problem of workability of a glass cutter roller having a ridge portion formed with a concavity and a convexity over the entire circumference thereof, having a desired scoring property when cutting a glass substrate, that is, capable of forming a score line having a vertical crack reaching a desired depth, a scoring method for forming a score line for cutting a brittle material, a scoring device equipped with the cutter roller, and a cutter roller manufacturing method and a cutter roller manufacturing device for manufacturing the cutter roller.

(3) A bonded substrate having a good quality, which can be prevented from being scratched by glass chips generated on the surface thereof in a dividing step of the bonded substrate, particularly a projector substrate, and a bonded substrate dividing method and a dividing apparatus capable of obtaining a vertical crack sufficient for dividing the bonded substrate and accurately dividing the bonded substrate along a scribe line.

Disclosure of Invention

Cutter roller

To achieve the above object, a cutter roller (invention 1) according to the invention of claim 1 is a cutter roller in which a cutting edge line is deviated from a center between both side surfaces of the roller toward one side surface, characterized in that a position where a score line formed on a brittle substrate is deviated is defined as a position where the cutting edge line is deviated, and a vertical crack extending from the score line toward a lower side is formed.

According to the invention 1, the convex portion of the device or the portion of the film can be indented while ensuring that the roller has the thickness required for achieving a certain strength as in the case of the conventional cutter roller. That is, by making the roller side surface on the side where the distance from the blade ridge line is shorter approach the convex portion or the film, the blade ridge line can be made closer to the convex portion or the film than the existing cutter roller.

In the structure of the invention 1, the blade ridge may have protrusions of a predetermined shape formed at a predetermined pitch over a part of or the entire circumference thereof.

In this case, when the cutter roller having the projections according to the present invention is used for scoring, an extremely long vertical crack penetrating the thickness of the brittle substrate is generated, as compared with the conventional cutter roller having no projection on the edge line of the blade. The reason for this is considered to be that the projections of the edge lines of the blade click the substrate when the cutter roller rotates, and the projections are deeply embedded in the glass plate. In addition, there is an advantage that unnecessary horizontal cracks are not easily generated on the surface of the brittle substrate. The reason for this is considered to be that since the cutter roller is mainly engaged with the brittle substrate by the point contact of the protrusion, the stress generated in the direction of the glass plate surface at the time of scoring is smaller than that in the conventional art. Furthermore, the protrusion is embedded into the glass plate, so that the sliding of the cutter roller can be completely avoided, and the adverse phenomena of abrasion and the like caused by the sliding can be completely avoided.

The pitch of the protrusions may be 20 to 200 μm corresponding to the diameter of the roller of 1 to 20 mm.

In addition, the depth of the protrusion may be 2 to 200 μm corresponding to the diameter of the roller of 1 to 20 mm.

Further, shafts may be protrusively provided on both side surfaces of the roller integrally with the roller.

In so doing, managing the shaft is facilitated. That is, when the cutter roller is used, the shaft is inserted into an insertion hole provided at the center of the cutter roller, but since the roller diameter is as small as several millimeters, the diameter of the shaft will be 1 millimeter or less. Therefore, it is very troublesome to manage the very small shaft, and if the shaft is integrated with the roller, the management of the shaft becomes easy.

Further, a cutter roller (invention 2) according to the invention of claim 6 is a cutter roller for cutting a brittle material, wherein a blade is formed on a ridge line portion of the cutter roller of invention 1, and a plurality of grooves of a predetermined shape are formed on the ridge line portion at a predetermined pitch, wherein a ratio of a length of a region occupied by the plurality of groove portions to a whole circumference of the ridge line portion is less than 1.

In the cutter roller according to invention 2, a ratio of a length of a region occupied by the plurality of groove portions to a whole circumference of the ridge line portion is preferably greater than 1/4 and equal to or less than 3/4. In the cutter roller according to invention 2, it is preferable that a ratio of a length of a region occupied by the plurality of groove portions to a whole circumference of the ridge line portion is not more than 1/4.

Further, as the cutter roller of invention 2, it is preferable that the pitch of each of the plurality of grooves is 20 to 200 μm corresponding to a roller diameter of 1 to 20 mm.

As the cutter roller of invention 2, it is preferable that the depth of the plurality of grooves is 2 to 200 μm corresponding to the roller diameter of 1 to 20 mm.

As the cutter roller of invention 2, it is preferable that the cutter roller is formed integrally with a shaft inserted into the roller.

In the cutter roller according to the invention 2, it is preferable that the depth of each groove formed in the ridge portion is different from each other so that the depth of the groove gradually increases from the groove at the end portion to the groove at the central portion.

Further, a cutter roller (invention 3) according to the invention of claim 13 is characterized in that the groove portion is formed over the entire periphery of the ridge portion of the cutter roller of invention 1, and the region in which the depth of the groove is successively deeper and the region in which the depth of the groove is successively shallower are continuous.

Scoring device

The scoring apparatus (invention 4) according to the invention of claim 14 is characterized by comprising a table on which the brittle substrate is placed, a scoring head disposed above the table, and a cross scoring unit for forming mutually perpendicular scoring lines on the brittle substrate on the table by the scoring head; the nicking head is provided with a certain cutter roller wheel.

In addition, in the scoring device, a cutter roller reversing unit may be provided to reverse the orientation of the cutter roller by 180 degrees every time formation of one score line is completed.

Thus, a predetermined portion of the substrate, that is, a portion close to the convex portion or the thin film of each device can be scored without turning the substrate.

Further, as the scoring device, a device having two cutter rollers may be used. In this case, the two cutter rollers are arranged side by side and the edge lines of the cutting edges of each other are located at the farthest positions. And the two cutter rollers can selectively and simultaneously or independently score under the control of the working program. Thus, the cutter roller does not have to be turned 180 degrees after each score line is formed as previously described.

Method of scoring

A scoring method (invention 5) corresponding to the invention of claim 18 is characterized in that the depth of a vertical crack formed inside a brittle material as a scoring target is periodically changed by using the cutter roller of invention 2 described in claim 6.

In the invention 5, it is preferable that the scoring is performed by using a roller in which a ratio of a length of a region occupied by the plurality of groove portions to a whole circumference of the ridge line portion is 3/4 or less. In the scoring method according to invention 5, it is preferable that the scoring is performed by using a roller in which a ratio of a length of a region occupied by the plurality of grooves to the ridge line portion is 1/4 or less.

Method for dividing bonded substrate

A method for dividing a bonded glass substrate according to the invention of claim 21 (invention 6) is characterized by comprising a1 st scoring step, a2 nd scoring step, and a breaking step, wherein the glass cutter roll of the present invention is used in any one of the 1 st and 2 nd scoring steps.

A method for dividing a bonded glass substrate according to the invention of claim 22 (invention 7) is characterized in that the method comprises a1 st scoring step, a1 st breaking step, a2 nd scoring step, and a2 nd breaking step, and the glass cutter roll of the present invention is used in any one of the 1 st and 2 nd scoring steps.

A method for dividing a bonded substrate according to the invention of claim 23 (invention 8) is a method for dividing a bonded substrate in which a pair of glass substrates are bonded to each other, wherein the scoring step is performed in a state in which thin films are bonded to both surfaces of the bonded substrate.

By adopting the method, the glass scraps generated in the scoring process can not be attached to the glass substrate.

The method may further include a step of bonding a protective film having a larger thickness and a higher adhesive force than the thin film to the thin film on the upper glass substrate after the scoring step, and then peeling the protective film together with the thin film from the upper glass substrate after a predetermined step.

In this way, the glass chips generated in the scoring process are closely adhered to the protective film, and are removed together with the thin film when the protective film is peeled off.

Further, as the above method, it may be configured such that after thin films are bonded to both surfaces of the bonded substrate, a1 st protective film having a thickness larger than that of the thin film and a weak adhesive force is bonded to the thin film on the lower glass substrate side, vertical cracks are formed on the upper glass substrate up to the lower surface by scoring from the thin film surface side of the upper glass substrate, then a2 nd protective film having a thickness larger than that of the thin film and a strong adhesive force is bonded to the thin film on the upper glass substrate, after the 1 st protective film is peeled off, the bonded substrate is turned over so that the lower glass substrate becomes the upper layer, and the glass substrate positioned on the upper layer is scored from the thin film surface side thereof, so that vertical cracks are formed up to the lower surface of the glass substrate positioned on the upper layer, and then, after the 2 nd protective film is attached to the thin film located on the upper layer, the 2 nd protective film is peeled off together with the thin film from the glass substrate located on the upper layer.

According to this method, as in the above method, even if glass chips are generated in the scoring step, the glass chips do not adhere to the glass substrate and the glass substrate is not scratched. In addition, since the 1 st and 2 nd protective films are bonded to the glass substrate which is the lower layer, the bonded substrate can be effectively protected from direct contact with the scoring table at the time of scoring. Since the thin film is peeled off together with the 2 nd protective film as the 2 nd protective film is finally peeled off, the glass cullet remaining on the glass substrate is removed together with the 2 nd protective film, and the surface of the glass substrate can be kept clean.

A method for dividing a bonded substrate according to the invention of claim 26 (invention 9) is a method for dividing a bonded substrate in which a glass substrate and a silicon substrate are bonded to each other, wherein the step of scoring is performed in a state where a thin film is bonded to the glass substrate.

According to the above method, in invention 9, similarly to invention 8, the glass cullet generated in the scoring step does not adhere to the glass substrate.

As this method, after the scoring step, a protective film having a larger thickness and a stronger adhesive force than the thin film may be attached to the thin film on the upper glass substrate, and after a predetermined step, the protective film may be peeled off together with the thin film from the glass substrate.

According to this method, the glass chips generated in the scoring process are closely adhered to the protective film, and are removed together with the thin film when the protective film is peeled off.

As the above method, it may be configured such that after a thin film is bonded to the glass substrate, a vertical crack is formed from the thin film surface side of the upper glass substrate to the lower surface of the upper glass substrate in a state where the silicon substrate is positioned in the lower layer, a protective film having a higher thickness than the thin film and a strong adhesive force is bonded to the thin film on the upper glass substrate, the bonded substrate is turned over to change the silicon substrate in the lower layer to the upper layer, after the silicon substrate positioned in the upper layer is scored, the bonded substrate is turned over to change the silicon substrate to the lower layer, and the glass substrate side positioned in the upper layer is pressed to form the vertical crack in the silicon substrate.

According to this method, since the silicon substrate is used as one of the substrates constituting the bonded substrate, the glass chips generated by scoring are not affected. Since only the other glass substrate is bonded with a thin film and scoring is performed in this state, even if glass chips are generated in the scoring step, the glass chips do not adhere to the glass substrate and the glass substrate is not scratched. Further, when the protective film is peeled off, the protective film is peeled off together with the thin film from the glass substrate, and thus the glass cullet can be removed. In addition, the protective film protects the bonded substrate, and can prevent the bonded substrate from being in direct contact with the nicking workbench during nicking and being in direct contact with the breaking workbench due to pressurization during breaking operation.

In the above method, a cutter roller is used as a means for performing the scoring, and the cutter roller may be a1 st cutter roller in which a cutting edge line portion is formed with a groove over the entire circumference, or a2 nd cutter roller in which a region formed with a groove is formed in a predetermined ratio to a region not formed with a groove.

By using the cutter roller, the brittle material substrate can be cut. In addition, in the case of using the 1 st cutter roller, vertical cracks up to the lower surface of the glass substrate can be obtained. In the case of using the 2 nd cutter roller, vertical cracks having periodically changed depths were obtained.

Cutter roller manufacturing device

The cutter roller manufacturing apparatus (invention 10) corresponding to the invention of claim 30 is a cutter roller manufacturing apparatus for manufacturing the cutter roller of the invention described above, characterized by comprising: at least one supported and rotatable disk-shaped grinding member, and a grinding mechanism for supporting at least one cutter roller as a grinding object and moving the cutter roller closer to or away from the grinding member; the grinding mechanism includes a rotating unit for moving a portion of the cutter roller to be ground by the grinding member.

The cutter roller manufacturing apparatus according to invention 10 preferably includes a control unit for controlling the rotating unit and the unit that moves toward and away from the grinding member by the grinding mechanism.

In the apparatus for manufacturing a cutter roller according to claim 10, it is preferable that the control means controls the rotating means so that the groove is formed at a desired position of the ridge portion of the cutter roller, based on the number of divided portions and the number of regions of the ridge portion of the cutter roller.

Method for manufacturing cutter roller

A method for manufacturing a cutter roller according to the invention of claim 33 (invention 11) is a method for manufacturing a cutter roller according to the invention, characterized in that an outer periphery of the cutter roller is processed at a predetermined position and at a predetermined depth by using at least one supported and rotatable disk-shaped grinding member and a grinding mechanism for supporting at least one cutter roller to be ground and moving the grinding member and the cutter roller relatively closer to or away from each other.

Drawings

Fig. 1 is a front view schematically showing the external appearance of a cutter roller according to the present invention.

Fig. 2(a) is a front view of a cutter roller having a protrusion formed on a blade ridge line, and fig. 2(b) is a side view and a partially enlarged view of the cutter roller.

Fig. 3 is a partially enlarged view of another embodiment of the cutter roller of fig. 2(b) in which protrusions are formed on the edge lines of the blades.

Fig. 4 is a partially enlarged view of another embodiment of the cutter roller of fig. 2(b) having protrusions formed on the edge lines of the cutting edges.

Fig. 5 is a partially enlarged view of another embodiment of the cutter roller of fig. 2(b) in which protrusions are formed on the edge lines of the blades.

Fig. 6 is a front view of an embodiment of a cutter roller formed by integrally protruding a shaft from the roller on both side surfaces of the roller.

Fig. 7 is a front view of a conventional glass cutter roller.

Fig. 8 is a side view of a cutter wheel according to an embodiment of the present invention.

Fig. 9 is a side view of a cutter wheel according to another embodiment of the present invention.

Fig. 10 is a side view of the cutter roller of embodiment 1.

Fig. 11 is a side view of the cutter roller of embodiment 2.

Fig. 12 is a side view of the cutter roller of embodiment 3.

Fig. 13 is a side view of the cutter roller of embodiment 4.

Fig. 14 is a side view of the cutter roller of embodiment 5.

Fig. 15 is a diagram illustrating a state where the cutter roller according to the present invention performs scoring.

FIG. 16 is a cross-sectional view showing a crack generated when a glass plate is scored by a cutter roller having a protrusion formed on a blade edge line.

Fig. 17 is a schematic front view of an embodiment of a scoring device according to the present invention.

Fig. 18 is a side view of the scoring apparatus of fig. 17.

Fig. 19 is a plan view showing a schematic structure of the cutter roller manufacturing apparatus.

Fig. 20 shows an example of a touch panel provided in an operation section of the cutter wheel manufacturing apparatus.

Fig. 21 shows an example of a signal panel provided in the cutter wheel manufacturing apparatus.

Fig. 22 is a flowchart for explaining a grinding process of the cutter roller.

Fig. 23 shows the form of a vertical crack when scoring is performed by the cutter roller of the present invention.

Fig. 24 shows a step of dividing by a scoring device provided with a cutter roller of the present invention.

Fig. 25 shows another step of cutting by the scoring device provided with the cutter roller of the present invention.

FIG. 26 is a process diagram for explaining an embodiment of the dividing step of the present invention.

FIG. 27 is a view showing a layout of a dividing line for explaining an embodiment of the flow process of the present invention.

Fig. 28 is a diagram illustrating a state where a conventional cutter roller performs scoring.

Fig. 29(a) is a front view of a glass cutter roller having a groove formed in a cutting edge line portion, and fig. 29(b) is a side view of the roller.

Fig. 30 is a process diagram showing a conventional general dividing step performed on the bonded glass.

Fig. 31 shows another conventional dividing step performed on the bonded glass.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings.

Fig. 1 is a front view of a cutter roller according to an embodiment of the present invention, and fig. 15 is a front view illustrating a state in which a score is made by the cutter roller shown in fig. 1.

The knife roller 1 has a cutting edge 2 that is offset from the center 5 between the two side surfaces 3, 4 of the roller toward one side surface (the left side surface 3 in the illustrated example), and has an insertion hole 6 formed at the center of the roller. As the degree of displacement of the edge ridge line 2 is larger, that is, the distance from the center 5 to the edge ridge line 2 is larger, in other words, the distance between the left side surface 3 and the edge ridge line 2 is shorter in the illustrated example, the convex portion of the device or the film X can be scored closer to each other in the scoring as shown in fig. 15, and therefore, this is preferable. The size of the cutter roller 1 is, for example, 0.65mm in thickness w, 2 to 3mm in diameter phi at the edge line 2 of the blade, 30 to 150 μm in distance k from the left side surface 3 of the roller to the edge line 2 of the blade, and 0.8mm in inner diameter d of the insertion hole 6, but is not limited thereto. In fig. 15, symbol G denotes a brittle substrate.

When the brittle material substrate G is scored by the cutter roller 1 configured as above, the cutter roller 1 is brought into contact with the brittle material substrate G in a state where the side surface closer to the blade edge 2 is adjacent to the convex portion of the device or the thin film X, as shown in fig. 15. Here, since the devices X are arranged in a matrix on the brittle material substrate G, the projections or films X next to them are scribed along one row of devices, and after one scribing line E is formed, the cutter roller 1 is turned 180 degrees, and the projections or films X next to them are scribed along the row of devices adjacent to the previous row, thereby forming the next scribing line F.

In the scoring, in addition to the cutter roller 1 being turned 180 degrees after each score line is formed as described above, a space holder (not shown) may be used, which is provided such that the two cutter rollers 1, 1 maintain the positional relationship shown in fig. 15, that is, the two cutter rollers 1, 1 are juxtaposed and the edge lines 2, 2 of the cutting edges are located at the farthest positions. In the case of using two cutter rollers 1 and 1, the scoring head is moved once between the respective devices, so that the portions E, F of the film X, X and the projections of the adjacent devices can be scored simultaneously, and the cutter rollers 1 do not have to be turned 180 degrees for each score line formed as described above, thereby improving the work efficiency. In addition, the two cutter rollers 1 and 1 can selectively perform scoring simultaneously or independently under the control of the working program.

Next, fig. 2(a) is a front view of the cutter roller having a protrusion formed on the edge line of the blade. Fig. 2(b) is a side view of the roller with a partially enlarged view. Here, as shown in an enlarged view a, a U-shaped groove 71 is cut in the blade ridge 21 of the cutter roller 11, so that projections 81 having a height h are obtained at intervals of a pitch P.

As an example of the cutter roller 11 exemplified herein, the diameter (φ) of the roller is 2.5mm, the thickness (w) of the roller is 0.65mm, the blade angle (α) is 125 °, the number of projections is 125, the height (h) of the projections is 5 μm, and the pitch (P) is 63 μm; the cross-sectional view of the glass when a 1.1mm thick glass plate was scored using the cutter roller 11 under the conditions that the blade load was 2.6Kgf and the scoring speed was 300mm/sec is shown in FIG. 16.

In fig. 16, the depression L on the upper surface of the glass plate G is a glass groove generated at the time of scoring, and is referred to as a score line (this line extends in a direction perpendicular to the paper surface). While the score line L is cut, a crack (vertical crack) K extending from the score line L to a position just below the score line L is generated, in this example, a long crack (actually measured 962 μm) almost penetrating the glass sheet G in the sheet thickness direction is generated.

As described above, with the cutter roller 11 provided with the protrusion 81 according to the present invention, even if the blade load is increased, the horizontal crack does not occur, and the long vertical crack K can be obtained at the depth proportional to the magnitude of the load. If the vertical crack K is long, the subsequent breaking operation can be performed with precision along the score line, and the yield can be improved. Further, since the breaking operation is easy to perform, the breaking step can be reduced or simplified, and the breaking step can be omitted in some cases.

Fig. 3 shows an example of the protrusion 82 having a shape different from the above, in which the protrusion 82 is formed by cutting a V-shaped groove 72 in the blade ridge 22.

Fig. 4 shows an example of the protrusion 83 having another shape than the above, in which the protrusion 83 is formed by cutting a serrated groove 73 in the blade ridge 23.

Fig. 5 shows an example of a protrusion 84 having another shape different from the above, in which the protrusion 84 is formed by cutting a rectangular groove 74 in the blade ridge 24.

The cutter roller 1 has an insertion hole 6, and a shaft (not shown) is inserted into the insertion hole 6 and then attached to the illustrated pitch holder of the scoring head, but as shown in fig. 6, shafts 9 may be provided integrally with the roller on both side surfaces 3 and 4 of the roller.

In so doing, management of the axes can be facilitated. That is, when the cutter roller 1 is used, the shaft is inserted through the insertion hole 6 provided in the center of the cutter roller 1, but the diameter of the shaft may be 1mm or less because the diameter of the roller is as small as several mm. Therefore, the management of the minute shaft is very troublesome, and the management of the shaft is facilitated by integrating the shaft 9 with the roller.

Fig. 8 is a side view of the cutter roller 16 according to invention 2 of this embodiment.

As shown in fig. 8, the cutter roller 16 has a region a where a groove is formed and a region B where no groove is formed. The ratio of the area a in which the groove is formed to the entire periphery (area a + area B) (hereinafter referred to as the ratio of area a to the entire periphery) of the ridge line portion is preferably 3/4 or less from the viewpoint of workability of forming the groove in the ridge line of the cutter roller 16. When the ratio is set as described above, the groove is processed without a long time, and the workability is good.

Further, when the ratio of the region a to the entire circumference is in the range of 3/4 or less but more than 1/4, a vertical crack whose depth varies periodically as shown in fig. 23 later can be obtained. However, when the ratio of the region a to the entire circumference is within this range, the conditions need to be limited in order to obtain the periodic cracks.

On the other hand, when the ratio of the region a to the entire circumference is in the range of 1/4 or less, vertical cracks with periodically changing depths can be stably obtained under a wide range of conditions. Preferably, the ratio of the area a to the entire circumference is set within this range, which prevents the brittle material substrate from being partially broken and falling off during conveyance when the brittle substrate on which the score line has been formed is conveyed.

The grooves 6b formed in the region a of the ridge line portion are intentionally formed by periodic machining on the order of micrometers, and are distinguished from the grinding marks on the order of micrometers that are inevitably formed when grinding is performed to form the edge line of the cutting edge.

Fig. 9 shows an example of a glass cutter roll according to another embodiment, and fig. 9(a) is designed such that a blade is divided into 6 regions over the entire circumference, and the regions a and B are alternately formed. Fig. 9(B) is designed such that the blade is divided into 8 regions over the entire circumference, and the regions a and B are alternately formed.

In fig. 9(B), the regions a in which grooves are formed in a plurality of regions a1 to a4, and the regions B in which grooves are not formed are formed in a plurality of regions B1 to B4. The lengths of the regions A1 to A4 and B1 to B4 are designed as follows, for example.

A1＝A2＝A3＝A4 A1+A2+A3+A4＝A

B1＝B2＝B3＝B4 B1+B2+B3+B4＝B

A/B＝1

In this case, the regions a1 to a4 are all equal, and the regions B1 to B4 are all equal. Since a/B is 1, the ratio of the area a to the entire circumference is 2/4.

Further, as another example, the design is as follows.

A1＝A2≠A3≠A4 A1+A2+A3+A4＝A

B1＝B2≠B3≠B4 B1+B2+B3+B4＝B

A/B＝1

In this case, in each of the regions a1 to a4 and B1 to B4, A3 and a4 are different from a1 and a2, and B3 and B4 are different from B1 and B2. Further, as a whole, since a/B is 1, the ratio of the area a to the entire circumference is 2/4.

In yet another example, the design is as follows.

A1＝A2≠A3≠A4 A1+A2+A3+A4＝A

B1＝B2≠B3≠B4 B1+B2+B3+B4＝B

A/B＝3/1

In this case, A3 is different from a4 and a1 is different from a2, and B3 is different from B4 and B1 is different from B2 in the regions a1 to a4 and B1 to B4. In addition, since a/B is 3/1 as a whole, the ratio of the area a to the entire circumference is 3/4.

The cutter roller 16 may also be formed integrally with a shaft that should be inserted into the roller 16. As a method of integrally forming, a method of grinding a raw material to integrate both the roller and the shaft, or a method of bonding and/or brazing both the cutter roller and the shaft may be adopted.

Fig. 23 is a schematic view schematically showing a vertical crack generated in a glass substrate when a score line is formed in the glass substrate by using the cutter roller 16.

The score line generated by scoring with the cutter roller 16 includes a score line S formed by a region a formed with a groove on the ridge line portion of the cutter roller_AA score line S formed by a region B where no groove is formed_BThe depth of the vertical cracks was different from each other, and it was confirmed from the color depth. Namely, it was confirmed that the cutting line S is a cut line_AThen, vertical cracks D deeper than the irregularities formed on the ridge line part are formed_AAt the score line S_BSince the ridge portion is not formed with irregularities, shallow vertical cracks are formed.

As described above, when scoring is performed using the cutter roller 16 of the present embodiment, the depth of the vertical crack changes periodically, and it is understood that the scoring performance of the present embodiment is between the scoring performance of the conventional cutter roller 72 of fig. 7 and the scoring performance of the cutter roller 11 of fig. 2. Further, by appropriately changing the ratio of the region a in which the groove is formed and the region B in which the groove is not formed to the entire circumference of the cutter roller, a desired score characteristic, that is, a line (score line) having a desired vertical crack for dividing the glass substrate can be obtained.

Examples 1 to 5 showing specific examples of the cutter roller according to the present embodiment will be described below.

(example 1)

Fig. 10 shows the form of the cutter roller of example 1, and table 2 below shows the dimensions such as the roller diameter of the cutter roller of example 1.

TABLE 2

Diameter of the roller	2.0mm
		Thickness W of the roller	0.65mm
Edge angle alpha	135°
		Depth of groove	7μm

The cutter roller 16 of this example 1 was designed such that grooves (7 μm) of the same depth were continuously formed at one point on 1/10(8 parts/80 parts) of the entire circumferential length of the ridge line portion.

The cutter roller 16 is used to notch alkali-free glass with a thickness of 0.7mm at a blade load of 0.16-0.40 MPa and a notch speed of 400 mm/sec. As shown in fig. 23, when the cutter roller 16 of example 1 was used for scoring, a score line in which the depth of the vertical crack was periodically changed was formed, and when the load was 0.18MPa, the deeper vertical crack D of fig. 23 was formed_AAbout 400 μm, shallow vertical crack D_BAbout 100 μm.

(example 2)

Fig. 11 shows the form of the cutter roller 16 of example 2, and table 3 below shows the dimensions such as the roller diameter of the cutter roller of example 2.

TABLE 3

Diameter of the roller	2.0mm
		Thickness W of the roller	0.65mm
Edge angle alpha	135°
		Depth of groove	7μm

The cutter roller 16 of this example 2 was designed so that regions a1 and a2, in which grooves (7 μm) of the same depth were continuously formed, were provided at two locations over the length of 1/10(8 parts/80 parts) of the entire circumferential length of the ridge line portion. The areas a1 and a2 in which the grooves are formed are provided on opposite sides with respect to the center axis of the cutter roller 16.

The cutter roller 16 is used to notch alkali-free glass with a thickness of 0.7mm at a blade load of 0.16-0.40 MPa and a notch speed of 400 mm/sec. As shown in fig. 23, when the cutter roller 16 of example 2 was used for scoring, a score line in which the depth of the vertical crack was periodically changed was formed, and when the load was 0.20MPa, the deeper vertical crack D of fig. 23 was formed_AAbout 400 μm, shallow vertical crack D_BAbout 100 μm.

(example 3)

Fig. 12 shows the form of the cutter roller 16 of example 3, and table 4 below shows the dimensions of the cutter roller 16 of example 3, such as the roller diameter.

TABLE 4

Diameter of the roller	2.0mm
		Thickness W of the roller	0.65mm
Edge angle alpha	135°
		Depth of groove	7μm

The cutter roller 16 of this example 3 was designed so that regions a1, a2 and A3, in which grooves (7 μm) of the same depth were continuously formed, were provided at three locations over the length of 1/10(8 parts/80 parts) of the entire circumferential length of the ridge line portion. The regions a1, a2, and A3 are respectively disposed at equal intervals.

The cutter roller 16 is used to notch alkali-free glass with a thickness of 0.7mm at a blade load of 0.16-0.40 MPa and a notch speed of 400 mm/sec. As shown in FIG. 23, when the cutter roller 16 of example 3 was used for scoring, a score line in which the depth of the vertical crack was periodically changed was formed, and when the load was 0.20MPa, the deeper vertical crack D in FIG. 23 was formed_AAbout 400 μm, shallow vertical crack D_BAbout 100 μm.

(example 4)

Fig. 13 shows the form of the cutter roller 16 of example 4, and table 5 below shows the dimensions such as the roller diameter of the cutter roller 16 of example 4.

TABLE 5

Diameter of the roller	2.0mm
		Thickness W of the roller	0.65mm
Edge angle alpha	135°
		Depth of groove	3、5、7、7、7、5、3μm

The cutter roller 16 of this embodiment 4 is designed such that a region a1 in which grooves are continuously formed is provided at one point in the length of 1/10(8 parts/80 parts) of the entire circumferential length of the ridge line portion. In the region a1, 7 grooves were formed, and the depth of each groove was varied and was designed to be 3, 5, 7, 5, and 3 μm in this order.

The cutter roller 16 is used to notch alkali-free glass with a thickness of 0.7mm at a blade load of 0.16-0.40 MPa and a notch speed of 400 mm/sec. As shown in FIG. 23, when the cutter roller 16 of example 4 was used for scoring, a score line in which the depth of the vertical cracks was periodically changed was formed, and when the load was 0.22MPa, the deeper vertical cracks D in FIG. 23 were formed_AAbout 400 μm, shallow vertical crack D_BAbout 100 μm.

(example 5)

Fig. 14 shows the form of the cutter roller 16 of example 5, and table 6 below shows the dimensions of the cutter roller 16 of example 5, such as the roller diameter.

TABLE 6

Diameter of the roller	2.0mm
		Thickness W of the roller	0.65mm
Edge angle alpha	140°
		Number of divisions	106
Depth of groove	3、5、7、7、7、5、3μm

The cutter roller 16 of example 5 was designed such that the entire periphery of the ridge line portion was divided into 106 parts, and grooves having a depth of 3, 5, 7, 5, 3 μm were formed in this order over the entire periphery.

The cutter roller 16 is used to score alkali-free glass with a thickness of 0.7mm at a blade load of 0.16-0.40 MPa and a scoring speed of 400mm/sec. As shown in FIG. 23, when the cutter roller 16 of example 5 was used for scoring, a score line in which the depth of the vertical cracks was periodically changed was formed, and when the load was 0.29MPa, the deeper vertical cracks D in FIG. 23 were formed_AAbout 400 μm, shallow vertical crack D_BAbout 100 μm.

As is clear from the results of examples 1 to 5, the pitch of each groove of the plurality of grooves formed is preferably 20 to 200 μm corresponding to a roller diameter of 1 to 20mm, and the depth of the plurality of grooves is preferably 2 to 200 μm corresponding to a roller diameter of 1 to 20 mm.

In the drawings illustrating the cutter roller according to the present invention, the grooves are enlarged for clearly showing the grooves formed on the ridge lines of the cutter roller, but actually, the size of the grooves is in the order of micrometers, which cannot be seen clearly with the naked eye.

Scoring device

Fig. 17 is a schematic front view showing an embodiment of the scoring device to which the cutter roller is attached.

Fig. 18 is a side view of the scoring apparatus of fig. 17.

The scoring device comprises a worktable 51 which is fixed by a vacuum adsorption component and can horizontally rotate and is used for fixing the arranged brittle material substrate G, a pair of parallel guide rails 52, 52 for supporting the table 51 to be movable in the Y direction (direction perpendicular to the paper surface), a ball screw 53 for moving the table 51 along the guide rails 52, a guide rod 54 extending above the table 51 in the X direction (the left-right direction in the figure), a scoring head 55 provided on the guide rod 54 to be slidable in the X direction, a motor 56 capable of sliding the scoring head 55, a spacing holder 57 which is arranged at the lower part of the scoring head 55 and can be lifted and freely swung, the rotatable cutter roller 1 arranged at the lower end of the spacing holder 57, and a pair of CCD cameras 58 provided above the guide rods 54 and recognizing a positioning mark marked on the brittle material substrate G on the table 51. Further, a cutter roller reversing unit for reversing the space holder 57 by 180 degrees every time formation of one score line is completed is incorporated in the scoring head 55 so that the cutter roller 1 is reversed by 180 degrees as described above.

In addition, instead of providing the cutter roller reversing unit as described above, the scoring device may be configured such that two cutter rollers 1 and 1 are mounted in parallel and the blade edges 2 and 2 thereof are farthest from each other on two space holders 57 and 57. In the case of using two cutter rollers 1 and 1, the scoring head is moved once between the respective devices, so that the portions E, F of the film X, X or the projections of the adjacent devices can be scored simultaneously (see fig. 15), and the cutter roller 1 does not need to be turned 180 degrees after each score line is formed as described above, thereby improving the working efficiency.

Further, the two cutter rollers 1, 1 can selectively perform scoring simultaneously or individually under the control of the operation program, and a lifting and lowering unit for independently lifting and lowering the two space holders 57, 57 is incorporated in the scoring head 55.

Method for dividing bonded substrate

Next, a method of dividing the bonded glass substrate by using the dividing apparatus of the present embodiment will be described.

Fig. 24(a) to (c) are cross-sectional views each illustrating a method of cutting the bonded glass substrate 10 by using the cutting apparatus having the cutter roller according to the present embodiment, for each step. In the following description, for convenience, one of bonded glass substrates formed by bonding a pair of glass substrates, which are liquid crystal mother substrates, to each other is referred to as a glass substrate 10A, and the other is referred to as a glass substrate 10B.

(1) First, as shown in fig. 24(a), the glass substrate 10A with the glass substrate 10 bonded thereto is faced upward, the bonded glass substrate 10 is set on the 1 st scoring device, and the glass substrate 10A is scored using the cutter roller 11 having the groove shown in fig. 2 formed on the ridge line of the cutter roller in fig. 1, thereby forming a score line Sa'. As shown in fig. 24(b), the score line Sa' formed by using the glass cutter roller 11 has a vertical crack Va as deep as the vicinity of the lower surface of the glass substrate 10A.

(2) Next, the front and back sides of the bonded glass substrate 10 having the score line Sa' formed on the glass substrate 10A are reversed and conveyed to the 2 nd scoring device. Then, in this 2 nd scoring device, as shown in fig. 24(B), the glass substrate 10B to which the glass substrate 10 is bonded is scored using the glass cutter roller 16 in which the groove shown in fig. 8 is formed on the ridge line of the cutter roller 1 of fig. 1, and a score line Sb 'parallel to the score line Sa' is formed. The 2 nd scoring device used the cutter roller described in the embodiment of any one of embodiments 1 to 5, and the score line Sb' formed by the cutter roller 16 formed vertical cracks Vb in which the shallower portion and the deeper portion are alternately periodically changed. Since a plurality of liquid crystal panels are formed as the liquid crystal mother substrates and terminals need to be formed on the side edge portion of one of the glass substrates on which the liquid crystal panels are formed, in many cases, the score line Sb 'formed on the glass substrate 10B is formed at a position shifted from the score line Sa' formed on the glass substrate 10A in the horizontal direction.

(3) Next, the bonded glass substrate 10 having the score lines Sa 'and Sb' formed on the glass substrate 10A and the glass substrate 10B is transferred to the breaking device with the glass substrate 10A turned upside down after the glass substrate 10A and the glass substrate 10B are turned upside down. In this breaking apparatus, as shown in fig. 24(c), the bonded glass substrate 10 is placed on a backing plate 44, and the breaking bar 39 presses the glass substrate 10A of the bonded glass substrate 10 along a score line Sb' formed on the glass substrate 10B. Then, on the lower glass substrate 10B, the vertical crack extends upward from the score line Sb ', and the glass substrate 10B is broken along the score line Sb'.

The bonded glass substrate 10 is divided by sequentially performing the steps (1) to (3).

As described above, the scoring by the cutter roller 16 of the present invention can form vertical cracks Vb in which a shallow portion and a deep portion are alternately and periodically changed, and the vertical cracks Vb do not completely penetrate in the thickness direction of the glass substrate. Therefore, even if the glass substrate 10A is completely cut in the process of conveying the bonded glass substrate 10 from the 2 nd scoring device to the breaking device in the step (2), there is no fear that the glass substrate 10 is separated because the glass substrate 10A is bonded to the glass substrate 10B by the sealant.

Fig. 25(a) to (c) are cross-sectional views each illustrating the step of the method 2 for dividing the bonded glass substrate 10 by using the dividing apparatus having the glass cutter roller 1 according to embodiment 1. In the following description, for convenience, one of bonded glass substrates formed by bonding a pair of glass substrates, which are liquid crystal mother substrates, to each other is referred to as a glass substrate 10A, and the other is referred to as a glass substrate 10B.

(1) First, as shown in fig. 25(a), the glass substrate 10A of the bonded glass substrate 10 is faced upward, the bonded glass substrate 10 is set on the 1 st scoring device, and the glass substrate 10A is scored using the cutter roller 1 (or 15, 16) to form a score line Sc.

(2) Next, the front and back surfaces of the bonded glass substrate 10 having the score line Sc formed thereon are reversed and conveyed to the 1 st breaking device. In the first breaking apparatus 1, as shown in fig. 25(B), the bonded glass substrate 10 is placed on a backing plate 44, and the breaking bar 39 presses the glass substrate 10B of the bonded glass substrate 10 along a score line Sc formed on the glass substrate 10A. Then, on the lower glass substrate 10A, the vertical crack extends upward from the score line Sc, and the glass substrate a is broken along the score line Sc.

(3) Next, the bonded glass substrate 10 obtained by dividing the glass substrate 10A is conveyed to the scoring device 2 without reversing the front and back surfaces of the glass substrate 10A and the glass substrate 10B. Thereafter, in the second scoring device 2, as shown in fig. 25(c), the glass substrate 10B to which the glass substrate is bonded is scored using the cutter roller 16, and a score line Sd parallel to the score line Sc is formed. Since a plurality of liquid crystal panels are formed as the liquid crystal mother substrates and terminals need to be formed on the side edge portion of one of the glass substrates on which the liquid crystal panels are formed, the score line Sd formed on the glass substrate 10B and the score line Sa formed on the glass substrate 10A are formed so as to be shifted from each other in the score position in the horizontal direction in many cases.

(4) Next, the front and back sides of the bonded glass substrate 10 were turned over, and the glass substrate 10A was conveyed upward to the 2 nd breaking device. In the 2 nd breaking apparatus, as shown in fig. 25(d), the bonded glass substrate is placed on the backing plate 44, and the breaking bar 39 presses the glass substrate 10A of the bonded glass substrate 10 along the score line Sd formed on the glass substrate 10B. Then, the vertical crack extends upward from the score line Sd, and the lower glass substrate 10B is broken along the score line Sd. In step (3), a vertical crack occurring in the glass substrate 10B due to the formation of the score line Sd is denoted by Vd in fig. 25 (d).

As described above, the scoring by the cutter roller 16 of the present invention forms the vertical cracks Vd in which the shallow portions and the deep portions are alternately and periodically changed, and the vertical cracks Vd do not completely penetrate in the thickness direction of the glass substrate. Therefore, in the process of conveying the bonded glass substrate 10 from the 2 nd scoring device to the 2 nd breaking device in the step (4), even if the glass substrate 10A is in a completely broken state, the glass substrate 10B is not in a broken state, and therefore there is no fear that the glass substrate 10 will be broken.

In the above description, the scribing method of bonding the glass substrate has been described, but as a special case, another brittle material may be scribed by using the scribing method of the present invention, and in this case, a vertical crack in which a shallow portion and a deep portion are periodically changed may be generated in another brittle material. By forming such vertical cracks with periodically changing depths, the brittle material can be prevented from being completely broken and sent to the next step in the process of conveying the brittle material.

Other bonded substrate dividing method (1)

(example 1)

Fig. 26(a) to (i) are process diagrams for explaining example 1 of the present invention. Fig. 27 is a schematic configuration diagram of an apparatus used in accordance with this step. Fig. 27(a) shows an example in which devices corresponding to the process sequence are arranged substantially in a row. Fig. 27(b) shows an example in which the corresponding devices are arranged around the transfer robot. The present invention is applied to a cutting method for cutting a mother glass substrate 80 of a flat display panel in which glass substrates, which are one of brittle material substrates, are bonded to each other in an opposed manner. One glass substrate of the flat display panel mother glass substrate 80 is a glass substrate 80A, the other glass substrate is a glass substrate 80B, and the glass material of the glass substrates 80A and 80B is, for example, alkali-free glass. Further, as the cutter roller, the cutter roller 16 of fig. 8, which can obtain vertical cracks of periodically changing depths on the glass substrate, was used.

(1) First, the 1 st film processing apparatus 201 has the same mechanism as the attaching mechanism used in the polarizing plate attaching device in the liquid crystal mother glass substrate manufacturing process; as shown in fig. 26(a), thin films 85 are bonded to both surfaces of a flat display panel mother glass substrate 80. The thin film 85 is preferably attached before the substrate is cut, and has a thickness of about 10 μm. Further, a1 st protective film 86 having a smaller thickness than the thin film 85 and a weaker adhesive force is attached to the thin film 85 on the lower glass substrate 80B side. The thickness of the 1 st protective film 86 is 40 to 80 μm.

(2) Next, the flat display panel mother glass substrate 80 is transferred into the 1 st scoring apparatus 202 by the transfer robot R1, and as shown in fig. 26(b), a thin film 85 side of the upper glass substrate is scored by the cutter roller 16, thereby forming shallow vertical cracks Ve having a depth periodically changing on the upper glass substrate 80A. By forming the vertical crack Ve, when the mother glass substrate of the flat display panel is conveyed to a subsequent apparatus, a part of the glass substrate is prevented from falling off the mother glass substrate, and the breaking operation in the breaking step can be simplified.

(3) Thereafter, the flat display panel mother glass substrate 80 to which the 1 st protective film 86 is attached is conveyed to the 2 nd film processing apparatus 203 by the conveying robot R2. The 2 nd thin film processing apparatus 203 has a mechanism similar to the attaching mechanism used in the polarizing plate attaching device in the liquid crystal mother glass substrate manufacturing process; as shown in fig. 26(c), a2 nd protective film 87 having a larger thickness than the thin film 85 and a strong adhesive force is attached to the glass substrate 80A on the upper layer. The 2 nd protective film 87 has a thickness of 40 to 80 μm, as the 1 st protective film 86.

(4) Further, the flat display panel mother glass substrate 80 is inverted so that the glass substrate 80A becomes a lower layer, and is carried into the 1 st breaking device 204 by the carrying robot R3, and as shown in fig. 26(d), the glass substrate 80B side is pressed by the breaking bar 39, so that the shallow vertical cracks Ve formed in the glass substrate 80A and having a periodically changing depth are extended to vertical cracks Ve.

(5) Thereafter, the mother glass substrate 80 is transferred to the 3 rd thin film processing apparatus 205 by the transfer robot R4, one corner of the 1 st protective film 86 is sucked by a suction cup by a robot having at least one suction cup, and the suction cup is raised while moving in a diagonal direction of the mother glass substrate 80 to peel off the 1 st protective film 86.

(6) Next, the flat display panel mother glass substrate 80 is conveyed to the 2 nd scoring device 206 by the conveyance robot R5, and as shown in fig. 26(e), the glass substrate 80B of the flat display panel mother glass substrate 80 from which the 1 st protective film 86 is peeled is scored from the thin film 85 side by the cutter roller 16, so that a shallow vertical crack Vf whose depth changes periodically is formed on the glass substrate 80B located on the upper layer. By forming the vertical crack Vf, when the flat display panel mother glass substrate is conveyed to a subsequent apparatus, a part of the glass substrate can be prevented from falling off the mother glass substrate.

(7) Thereafter, the flat display panel mother glass substrate 80 is conveyed to the 4 th thin film processing apparatus 207 by the conveying robot R6. The 4 th film processing apparatus 207 has the same mechanism as the attaching mechanism used in the polarizing plate attaching device in the manufacturing process of the liquid crystal mother glass substrate; as shown in fig. 26(f), a2 nd protective film 87 is further attached to the thin film 85 on the upper glass substrate 80B.

(8) Further, the flat display panel mother glass substrate 80 is inverted to make the glass substrate 80B a lower layer, and is conveyed to the 2 nd breaking device 208 by the conveying robot R7, and as shown in fig. 26(g), the side of the glass substrate 80A positioned on the upper layer is pressed by the breaking bar 39, so that the periodically changing shallow vertical cracks Vf formed in the glass substrate 80B are extended to vertical cracks Vf.

(9) Next, the mother glass substrate 80 is conveyed to the 5 th film processing apparatus 209 by a conveyance robot R8, and as shown in fig. 26(h), the 2 nd protective film 87 attached to the glass substrate 80A is lifted up while being moved in the diagonal direction of the mother glass substrate by a robot having at least one suction cup by sucking one corner of the 2 nd protective film 87 with the suction cup by the robot having at least one suction cup, thereby peeling the same together with the thin film 85 from the glass substrate 80A positioned on the upper layer.

(10) Next, the flat display panel mother glass substrate 80 is conveyed to the separating device 210 by the conveying robot R9. The separating device 210 has a spherical table, an adsorption unit capable of adsorbing and fixing a substrate placed on the table to the table, a lift pin capable of lifting the substrate above the table, and a robot r capable of taking out a product; as shown in fig. 26(i), a flat display panel mother glass substrate 80 is placed on a spherical table (in fig. 26, the table is drawn in a flat shape to clearly show a state where the substrates are separated), and is separated into individual products 110 along vertical cracks VE and VF after being fixed by suction. Further, although not shown, the adhesion of the 2 nd protective film 87 and the thin film 85 stuck on the glass substrate 80B is weakened by irradiation with ultraviolet rays, and the product 110 is taken out while being held by the robot arm r while being pushed up from below the table having a spherical shape by the pins.

In the above step of example 1, the thin film 85 is bonded to both surfaces of the flat display panel mother glass substrate 80 in the step (1), and the scoring in the step (2) is performed on the thin film 85. At this time, even if glass chips are generated, the glass chips are scattered only on the thin film 85 and do not adhere to the glass substrate 80A, so that the glass substrate 80A can be prevented from being scratched. In addition, the 1 st protective film 86 is bonded to the lower glass substrate, and when the notch is made, the glass substrate 80B is not brought into direct contact with the table holding the mother glass substrate for a flat display panel by the 1 st protective film 86 on the lower surface of the mother glass substrate 80 for a flat display panel, thereby protecting the substrate surface from being scratched. In step (3), the 2 nd protective film is attached to the glass substrate 80A, and in step (4), the flat display panel mother glass substrate is turned upside down so that the glass substrate 80A becomes a lower layer, and then placed on a stage of the 1 st breaking device, and the glass substrate 80A is divided by the breaking bar 39. Even if the protective film 86 is peeled off in the step (5), the adhesion of the 1 st protective film 86 is smaller than that of the thin film 85 thereunder, and therefore the thin film 85 is not peeled off from the glass substrate 80B. In the step (7), the 2 nd protective film 87 is attached to the glass substrate 80B, and in this state, the 2 nd protective film 87 is positioned on the lower surface of the flat display panel mother glass substrate 80 by turning the flat display panel mother glass substrate 80 upside down, and the presence of the 2 nd protective film 87 prevents the glass substrate 80A from coming into direct contact with the table holding the flat display panel mother glass substrate, thereby protecting the substrate surface from being scratched. In the step (9), when the 2 nd protective film 87 is peeled off after being bonded to the glass substrate 80A, the 2 nd protective film 87 is peeled off together with the thin film 85 therebelow from the glass substrate 80A because the adhesive force of the 2 nd protective film 87 is larger than that of the thin film 85 therebelow. In this step, the glass cullet remaining on the glass substrate 80A is removed together with the 2 nd protective film 87.

(example 2)

An example of a dividing method according to the present invention applied to dividing a reflection type projector substrate in which a glass substrate, which is one of brittle material substrates, and a silicon substrate are bonded to each other in an opposed manner will be described. One glass substrate of the reflection type projector substrate is a glass substrate 80A, the other glass substrate is a glass substrate 80C, and the glass of the glass substrate 80A is, for example, alkali-free glass. Further, the cutter roller used was the cutter roller 16 of fig. 8 that could obtain vertical cracks in which the depth of the vertical crack periodically changed in the glass substrate.

The vertical crack obtained when the silicon substrate 80C is scored by the cutter roller 16 of fig. 8 is a continuous shallow crack.

Therefore, the breaking step performed under the above-described conditions is the same as the breaking step shown in fig. 26 showing embodiment 1, except that the glass substrate 80B shown in fig. 26 is replaced with the silicon substrate 80C. Therefore, the explanation of the dividing step is omitted here.

(example 3)

An embodiment of the present invention applied to a cutting method for cutting a transmission type projector substrate in which a glass substrate, which is one of brittle material substrates, and a glass substrate are bonded to each other in an opposed manner will be described. One glass substrate of the transmission type projector substrate is a glass substrate 80A, the other is a glass substrate 80B, and the glass material of the glass substrates 80A and 80B is, for example, quartz glass. In addition, the cutter roller uses the cutter roller 11 of fig. 2 or the cutter roller 16 of fig. 8.

Since the glass substrates 80A and 80B in fig. 26 are made of hard brittle materials such as quartz, the vertical cracks formed during scoring are continuous shallow cracks, unlike the shallow cracks in example 1 in which the depth changes periodically.

The separation step performed under the above-described conditions is the same as the separation step shown in fig. 26 of example 1. Therefore, the explanation of the dividing step is omitted here.

(example 4)

An embodiment of the present invention applied to a dividing method for dividing a reflection type projector substrate in which a glass substrate, which is one of brittle material substrates, and a silicon substrate are bonded to each other in an opposed manner will be described. One glass substrate of the reflection type projector substrate is a glass substrate 80A, the other glass substrate is a glass substrate 80C, and the glass of the glass substrate 80A is made of, for example, quartz glass. In addition, the cutter roller uses the cutter roller 11 of fig. 2 or the cutter roller 16 of fig. 8.

Since the glass substrate 80A in fig. 26 is made of a hard brittle material such as quartz, the vertical crack formed in the glass substrate 80A at the time of scribing is a continuous shallow crack unlike the shallow crack in which the depth periodically changes in example 1, and the vertical crack formed in the silicon substrate 80C is also a continuous shallow crack.

Therefore, the dividing step performed under the above-described conditions is the same as the dividing step shown in fig. 26 showing embodiment 1. Therefore, the explanation of the dividing step is omitted here.

(example 5)

An embodiment of the present invention applied to a cutting method of a mother glass substrate 80 for a flat display panel in which glass substrates, which are one of brittle material substrates, are bonded to each other in an opposed manner will be described. One of the glass substrates of the flat display panel mother glass substrate 80 is a glass substrate 80A, the other glass substrate is a glass substrate 80B, and the glass material of the glass substrates 80A and 80B is, for example, alkali-free glass. The cutter roller 11 of fig. 2, which can obtain a long vertical crack that penetrates substantially through the glass substrate in the thickness direction of the glass substrate, was used.

The dividing process performed under the above conditions does not require the processes (d) and (g) as compared with fig. 26 showing the dividing process of example 1, and the glass substrates 80A and 80B are switched up and down in the processes (h) and (i), the glass substrate 80B becomes an upper substrate, and the glass substrate 80A becomes a lower substrate. In the steps (B) and (e) (the scoring step), a long vertical crack that penetrates approximately through the glass substrate in the thickness direction can be obtained in the glass substrate 80A and the glass substrate 80B.

(example 6)

An embodiment of the present invention applied to a dividing method for dividing a reflection type projector substrate in which a glass substrate, which is one of brittle material substrates, and a silicon substrate are bonded to each other in an opposed manner will be described. One substrate of the reflection type projector substrate is a glass substrate 80A, the other glass substrate is a silicon substrate 80C, and the glass of the glass substrate 80A is, for example, alkali-free glass. Further, as the cutter roller, the cutter roller 11 of fig. 2 was used, which was capable of obtaining a long vertical crack penetrating approximately through the glass substrate in the plate thickness direction.

When the glass substrate 80A is scored under the above conditions, a long vertical crack penetrating approximately through the glass substrate in the plate thickness direction is obtained, and when the other silicon substrate 80C is scored, a continuous shallow vertical crack is obtained.

The dividing process performed under the aforementioned conditions is that in fig. 26 showing the dividing process of example 1, the glass substrate 80B is changed to the silicon substrate 80C, and in the process of (a), the thin film 85 and the 1 st protective film 86 attached to the silicon substrate 80C are omitted. Further, the steps (d), (f) and (h) are not required, and the projector substrate is placed on the stage of the separating device after being turned over from the step (g).

In example 6, the example was given in which silicon substrate 80C was notched and broken after glass substrate 80A was notched, but silicon substrate 80C may be notched and broken first and then glass substrate 80A may be notched.

In order to minimize the influence of the glass dust generated during the notching, a thin film or a protective film is preferably bonded to the surface of the silicon substrate 80C as appropriate in accordance with the process.

In the present invention, polyethylene is used as the material of the thin film 85, the 1 st protective film 86, and the 2 nd protective film 87, but the material is not limited to polyethylene as long as it is a film material having stretchability.

Fig. 27(a) shows a cutting apparatus for a brittle material-bonded substrate, which is arranged in line with the apparatuses included in the cutting process, in accordance with the cutting process for a mother glass substrate for a flat display panel shown in example 1. The operation principle of the dividing apparatus is described in the description of the process of example 1, and thus is omitted.

In addition, in the case where the processes such as embodiment 5 and embodiment 6 may be unnecessary, the processing apparatus corresponding to the unnecessary processes and the conveyance robot for conveying to the processing apparatus should be removed from the automatic dividing line apparatus shown in fig. 27 (a).

FIG. 27(b) shows that the respective processing units of the dividing apparatus of FIG. 27(a) are arranged in a star shape, and 8 processing units of the 1 st scoring unit 202 to the 5 th thin film processing unit 209 are arranged in a circular shape. The conveyance between the 8 processing apparatuses is performed by one conveyance robot R, the conveyance from the 1 st thin film processing apparatus 201 to the 1 st scoring apparatus 202 is performed by the conveyance robot R1, and the conveyance from the 5 th thin film processing apparatus 209 to the separating apparatus 210 is performed by the conveyance robot R9.

In fig. 27(b), 8 processing units of the 1 st scoring device 202 to the 5 th film processing device 209 are arranged in a counterclockwise sequence, but when it is necessary to increase the processing tact time of the line of the automatic dividing device or the installation space of each component of the line is limited, the 8 processing units are not necessarily arranged in sequence.

In addition, in the case where the processes are unnecessary as in embodiments 5 and 6, the processing device corresponding to the unnecessary processes and the transport robot for transporting the processing device may be excluded from the configuration of the automatic cutting device line shown in fig. 27 (b).

In the dividing method according to the embodiment of the present invention, the bonded substrate is scribed from the outer substrate surface which has not been subjected to the special processing in the step of dividing the large-sized mother substrate, which is obtained by bonding two substrates, into a plurality of small-sized flat display panels. However, the substrate surface on the inner side subjected to special processing may be scored. Examples of the special processing include an aluminum film or a resist film which is used when forming an electronic control circuit formed on the side of the surface of the bonded substrate facing each other, and an ITO film or a chromium plating film which is formed inside the substrate at a terminal portion which is a current-carrying means for supplying a power source or a signal to the panel of the bonded substrate. In addition, as another example, an aluminum film, a thin film-like polyimide film, or the like is formed in advance on the side of the opposite surface of the bonded substrate in order to exhibit a necessary display function. In order to avoid the peeling of the film due to the position of the portion subjected to the film formation process being at the dividing position, the division needs to be performed at the predetermined position with good accuracy, and the side on which the film is formed needs to be scored. The blade disclosed in the present application is effective to meet this need.

Cutter roller manufacturing device

Next, a cutter roller manufacturing apparatus for manufacturing the cutter rollers 11 and 16 having the concave and convex portions formed on the edge line portions of the cutting edges shown in fig. 2 and 8 will be described.

Fig. 19 is a plan view showing a schematic configuration of an embodiment of the cutter roller manufacturing apparatus.

The cutter roller manufacturing apparatus 400 is configured such that, for a cutter roller having a blade formed on a ridge line portion, the ridge line portion of the blade is ground to form irregularities on the blade.

The cutter wheel manufacturing apparatus 400 includes a housing 93 in which a grinding wheel 92 supported and fixed by a spindle motor 111 is rotatably disposed, and an openable door 94 for feeding and taking out a cutter wheel to be ground is provided on a front surface of the housing 93. The door 94 is a safety door, and is provided with a safety control device (not shown) that can interrupt the grinding process when the door is opened during the grinding of the cutter roller.

Inside the housing 93, a grinding mechanism 102 is provided that can be moved toward and away from the grinding wheel 92. The approaching or separating of the grinding mechanism 102 with respect to the grinding wheel 92 is operated by the feed motor 98. The feed motor 98 can move the grinding mechanism 102 forward or backward to adjust it to a predetermined position by driving a ball screw, not shown, to rotate.

The grinding mechanism 102 has a roller support portion 99 that supports the cutter roller during grinding. A blade rotating motor 120 for rotating the cutter roller by a predetermined angle is provided at the rear of the roller support portion 99. The grinding mechanism 102 is provided with a horizontal positioning hand wheel 101 and a vertical positioning hand wheel 103, and the positioning in the horizontal direction and the positioning in the vertical direction are manually adjusted by these hands, or may be automatically adjusted by a control mechanism not shown.

A control device 95 for controlling the position and operation of the grinding mechanism 102 is provided outside the housing 93. The control device 95 is further provided with an operation unit 97 capable of specifying the grinding conditions of the grinding cutter roller by the grinding mechanism 102.

The operation unit 97 is constituted by a touch panel shown in fig. 20, for example. The touch panel shown in fig. 20 is an example of the touch panel, and includes a touch panel operation unit 31 capable of displaying a predetermined condition workbook including various operation modes, setting conditions, alarms, and the like of the entire apparatus, a power switch 32 for controlling the on and off of the power supply, an illumination type button switch 33 for designating the preparation for entering into operation, an alarm buzzer 34 for giving an alarm message, and an emergency stop button switch 35 for stopping the operation in an emergency.

Further, in an upper portion of the cabinet 93, a signal panel 100 having an indicator lamp for indicating a state in the cabinet such as an abnormality, an automatic operation, and an openable/closable door is provided. Fig. 21 shows an example of the signal panel 100, which includes a "red" indicator lamp 41 indicating that the inside of the housing 93 is abnormal, a "green" indicator lamp 42 indicating that the inside of the housing 93 is automatically operated, and a "yellow" indicator lamp 43 indicating that no problem occurs even when the door is opened or closed.

Next, the operation principle of the cutter roller manufacturing apparatus 400 configured as above will be described.

First, the operation unit 97 is operated to initially set the grinding conditions of the cutter roller to be ground.

As the initial setting, for example, the following conditions are input.

Rotation angle F of the 1 st region₁(ii) a Depth of groove, D₁₁、…、D_1n。

Rotation angle F of the 2 nd region₂(ii) a Depth of groove, D₂₁、…、D_2n。

Rotation angle F of the m-th region_m(ii) a Depth of groove, D_m1、…、D_mn。

Number of divisions of a region: n is a radical of

Number of regions: r

After the input of the initial setting is finished, the grinding process of the cutter roller is started.

Fig. 22 is a flowchart for explaining a grinding process of the cutter roller. Next, the grinding process of the cutter roller will be described with reference to the flowchart.

First, the number of divided copies n is set to 0(S1), and then the number of regions m is set to 1 (S2).

Next, the cutter roller to be ground is attached to the roller support portion 99 (S3).

Next, the operation unit 97 is operated to start the automatic operation of the grinding mechanism 102 (S4). Further, after the table is moved to the standby position (S5), n +1 is calculated (S6). Secondly, determine whether D_mn0 (S7). If it is judged as D here_mnIf not equal to 0, the routine proceeds to step 8(S8), and if D is determined_mnWhen the cutting edge position is 0, the process does not need to be performed at the cutting edge position, and the process proceeds to step 12(S12) described later. In step 8, the position where the front end of the grinding wheel 92 contacts the blade of the cutter roller is detected. The contact position can be detected optically, mechanically or electrically. In order to improve the machining accuracy of machining with the grindstone 92, the contact between the blade of the cutter roller and the grindstone 92 is detected every time the blade contacts the grindstone.

After the position where the tip of the grinding wheel 92 contacts the blade is detected, the grinding mechanism 102 is moved to the blade machining position by the feed motor 98 (S9).

Next, the grinding mechanism 102 is moved in the direction of the grinding wheel 92 so that the cutting edge strongly contacts the grinding wheel 92, and the depth of the m-th and n-th grooves is machined to the depth of Dmn (S10).

In step 10, the depth of the nth groove in the mth area is formed as required to reach the depth Dmn of the groove of the input value set in advance in the initial setting. Similarly, the rotation angle of the m-th region is also set in advance by the rotation angle Fm of the input value set by the initial setting.

Next, the grinding mechanism 102 is moved to the standby position (S11).

Next, the number of divided parts N and the number of divided parts N are compared to determine whether N < N (S12). If N is less than N, the process proceeds to step 13, otherwise, the process proceeds to step 14.

In step 13, the blade rotation motor 120 is rotated by a slight angle Fm. Then, the process returns to step 9 after passing through step 6, step 7, and step 8, and grinding is performed at the blade position rotated by a slight angle.

If it is determined in step 12 that N < N does not mean that the number of divided parts N has reached the preset number of divided parts N, the routine proceeds to step 14, where it is determined whether m < R (S14).

Here, if m < R is determined, the blade is rotated by the set angle by the blade-rotating motor 120 (S15). Next, 1 is added to the set number of regions m, and the number is updated to the number of regions (m + 1). Further, an initial setting is made such that n is 0 (S16). Thereafter, the process returns to step 9 after passing through step 6, step 7, and step 8, and the grinding process is continued.

If it is determined in step 14 that m < R is not present and the number of regions m has reached the number of regions R set initially, the process proceeds to step 17, where the grinding mechanism 102 is returned to the original position (S17).

Next, the glass cutter with the edge ground is taken out (S18), and the grinding process is completed.

By using the above-described cutter roller manufacturing apparatus 400, the groove having a desired depth can be formed at a desired position over the entire circumference of the blade with good accuracy.

In the cutter wheel manufacturing apparatus shown in fig. 19, one grinding mechanism 102 is provided for the grinding wheel 92, but a grinding wheel may be provided near the center of the machine case, and a plurality of grinding mechanisms surrounding the grinding wheel may be provided around the grinding wheel. In this way, the machining efficiency of the cutter roller can be greatly improved in proportion to the number of the grinding mechanisms provided.

Further, the grinding wheels may be arranged in a vertically overlapping manner, and the cutting edges of the cutter rollers to be processed may be arranged to face the grinding wheels.

Further, it is possible to mount a plurality of cutter rollers on one cutter roller support portion of the grinding mechanism, and to grind a plurality of cutter rollers simultaneously in a single grinding process. By doing so, the machining efficiency of the cutter roller can be further improved.

Further, although the above embodiment has described the apparatus structure in which the mounting portion 112 for rotatably supporting the grinding wheel is fixed and the grinding mechanism 102 is movable as the structure of the manufacturing apparatus, the apparatus structure in which the grinding mechanism 102 is fixed and the grinding wheel mounting portion 112 is movable is also adopted, and the vicinity of the ridge line of the cutter roller can be processed similarly to manufacture the cutting edge having the uneven shape.

Possibility of industrial utilization

As described above, the cutter roller of the present invention can score a portion close to the convex portion or the film of the device with a roller thickness required for securing strength. That is, by making the roller side surface closer to the edge line of the blade to be closer to the convex portion or the film of the device, the edge line of the blade can be made closer to the convex portion or the film than the conventional cutter roller, and when dicing the substrate, the portion of each device adjacent to the convex portion or the film can be scored without damaging the convex portion or the film.

In addition, when the edge ridge of the cutter roller is provided with the protrusion, even if the blade load is increased, the horizontal crack is not generated, and the long vertical crack with the depth proportional to the load can be obtained. If the vertical crack is long, the vertical crack can be accurately broken along the score line in the breaking operation in the next step, and the yield can be improved. Further, since the breaking work is facilitated, the breaking process can be reduced or simplified, and in some cases, the breaking process can be omitted.

Further, the cutter roller of the present invention is a cutter roller in which the edge line of the blade is deviated from the center between both side surfaces of the roller toward one of the side surfaces, and grooves of a predetermined shape are formed at a predetermined pitch in the edge line portion in a range of 3/4 not more than the entire circumference of the blade, and the workability is better than that of a cutter roller in which a groove portion is formed over the entire circumference of the blade.

The cutter roller formed by forming the groove portions with a predetermined shape at a predetermined pitch in the range of 1/4 not more than the entire circumference of the blade on the glass cutter roller can prevent the formation of the vertical crack up to the vicinity of the lower surface of the substrate. By varying the ratio of the groove portion to the entire circumference length, the desired scoring characteristics can be obtained. Therefore, by changing the score characteristics, it is possible to prevent a phenomenon in which the glass substrate is partially dropped due to being cut from the score line when the glass substrate is conveyed.

Further, according to the dividing method of the present invention, since the scoring step is performed in a state where a thin film is bonded to the surface of the glass substrate to which the substrate is bonded, the glass cullet generated in the scoring step does not adhere to the glass substrate, and the glass substrate can be prevented from being scratched.

In addition, in the case of the method including a step of attaching a protective film to the thin film on the upper glass substrate after the scoring step and then peeling the protective film together with the thin film from the upper glass substrate, glass cullet generated in the scoring step can be closely attached to the protective film and removed together with the thin film when the protective film is peeled.

The device and the method of the invention can supply products with good quality and high reliability, and have practicability.

Claims (31)

1. A cutter roller in which a cutting edge line is deviated from the center between both side surfaces of the roller to one side surface, characterized in that a position where a score line formed on a brittle substrate is deviated is defined as a position where the cutting edge line is deviated, and a vertical crack extending from the score line to a lower side is formed.

2. The cutter roller as claimed in claim 1, wherein the blade ridge line is formed with protrusions of a predetermined shape at predetermined intervals over the entire circumference thereof.

3. The cutter roller according to claim 2, wherein the pitch of the protrusions is 20 to 200 μm corresponding to a roller diameter of 1 to 20 mm.

4. The cutter roller according to claim 2 or 3, wherein the height of the protrusion is 2 to 20 μm corresponding to a roller diameter of 1 to 20 mm.

5. The cutter roll according to claim 1, wherein a plurality of grooves having a predetermined shape are formed at a predetermined pitch in a ridge portion of the cutter roll for cutting the brittle material, and a ratio of a length of a region occupied by the plurality of grooves to a whole circumference of the ridge portion is less than 1.

6. The cutter wheel of claim 5, wherein a ratio of a length of an area occupied by the plurality of groove portions with respect to a whole circumference of the ridge line portion is greater than 1/4 and less than 3/4.

7. The cutter roll according to claim 5, wherein a ratio of a length of an area occupied by the plurality of groove portions to a whole circumference of the ridge line portion is 1/4 or less.

8. A cutter wheel according to any one of claims 5 to 7, wherein the pitch of each of the plurality of grooves is 20 to 200 μm corresponding to a wheel diameter of 1 to 20 mm.

9. A cutter wheel according to any one of claims 5 to 7, wherein the depth of the plurality of grooves is 2 to 200 μm corresponding to a wheel diameter of 1 to 20 mm.

10. A cutter wheel according to any one of claims 1 to 3 and 6 to 8, wherein a shaft is provided integrally with the wheel on both sides of the wheel.

11. A cutter wheel according to any one of claims 5 to 7, wherein at least one groove portion is formed in the ridge portion, and the depth of each groove is different from each other, i.e. the depth of each groove portion gradually increases from the groove at the end portion to the groove at the central portion.

12. The cutter wheel according to claim 1, wherein the groove portion is formed over the entire circumference of the ridge portion, and the sequentially deeper regions of the groove and the sequentially shallower regions of the groove are continuous.

13. A scoring device is characterized in that,

comprising: a table on which a brittle substrate is placed, a scribing head disposed above the table, and a mechanism for moving the scribing head in an X direction and/or a Y direction with respect to the table;

a cutter roller as claimed in any one of claims 1 to 12 provided on the scoring head.

14. The scoring apparatus as recited in claim 13 wherein there is a cutter roller reversing assembly for reversing the orientation of the cutter roller through 180 degrees each time the formation of one score line is completed.

15. The scoring apparatus of claim 13, wherein there are two cutter rollers arranged side-by-side with the knife edge edges of each other at the furthest distance.

16. A scribing method using the cutter roller according to claim 5, wherein the depth of the vertical crack formed in the brittle material to be scribed is periodically changed by scribing using a roller in which the ratio of the length of the region occupied by the plurality of groove parts to the entire circumference of the ridge part is less than 1.

17. The scoring method according to claim 16, wherein the scoring is performed by using a roller in which a ratio of a length of an area occupied by the plurality of groove portions to a whole circumference of the ridge line portion is below 3/4.

18. The scoring method according to claim 16, wherein the scoring is performed by using a roller in which a ratio of a length of an area occupied by the plurality of groove portions to a whole circumference of the ridge line portion is below 1/4.

19. A cutting method of a bonded glass substrate, comprising a1 st scoring step, a2 nd scoring step and a breaking step, wherein the cutter roller according to any one of claims 1 to 12 is used in the 2 nd scoring step.

20. A cutting method of a bonded glass substrate, comprising a1 st scoring step, a1 st breaking step, a2 nd scoring step and a2 nd breaking step, wherein the 2 nd scoring step uses a cutter roller according to any one of claims 1 to 12.

21. A method of cutting a bonded substrate in which a pair of glass substrates are bonded to each other, characterized by comprising a step of scoring the bonded substrate in a state where thin films are bonded to both surfaces of the bonded substrate, wherein the method comprises using a cutter roll according to any one of claims 1 to 12.

22. A method for dividing a bonded substrate according to claim 21, wherein the method comprises a step of bonding a protective film having a larger thickness and a higher adhesive force than the thin film to the thin film on the upper glass substrate after the scoring step, and then peeling the protective film together with the thin film from the upper glass substrate after a predetermined step.

23. A cutting method of a bonded substrate according to claim 21 or 22, wherein a thin film is pasted on both sides of the bonded substrate, a1 st protective film having a thickness larger than that of the thin film and weak adhesion is pasted on the thin film on the lower glass substrate side, a vertical crack is formed on the upper glass substrate from the thin film side to the lower surface thereof, a2 nd protective film having a thickness larger than that of the thin film and strong adhesion is pasted on the thin film on the upper glass substrate, the 1 st protective film is peeled off, the bonded substrate is inverted so that the lower glass substrate becomes the upper layer, a glass substrate positioned on the upper layer is scratched from the thin film side thereof to form a vertical crack reaching the lower surface of the glass substrate positioned on the upper layer, after that, a2 nd protective film is attached to the thin film located on the upper layer, and then the 2 nd protective film is peeled off together with the thin film from the glass substrate located on the upper layer.

24. A method of dividing a bonded substrate in which a glass substrate and a silicon substrate are bonded to each other in an opposed manner, comprising a step of scoring the glass substrate in a state where a thin film is bonded thereto, wherein the method comprises using a cutter roll according to any one of claims 1 to 12.

25. A method for dividing a bonded substrate according to claim 24, wherein the method comprises a step of bonding a protective film having a larger thickness and a higher adhesive force than the thin film on the upper glass substrate after the scoring step, and then peeling the protective film together with the thin film from the glass substrate after a predetermined step.

26. A cutting method of the bonded substrate according to claim 24 or 25, wherein after a thin film is pasted on the glass substrate, a vertical crack is formed to a lower surface of the upper glass substrate by notching from a thin film surface side of the upper glass substrate in a state where the silicon substrate is positioned at a lower layer, then a protective film having a larger thickness than the thin film and strong adhesion is pasted on the thin film on the upper glass substrate, the bonded substrate is turned over to change the silicon substrate at the lower layer to an upper layer, after notching the silicon substrate positioned at the upper layer, the bonded substrate is turned over to change the silicon substrate to a lower layer, and a pressure is applied to a glass substrate side positioned at the upper layer to form a vertical crack on the silicon substrate.

27. A cutting method of a bonded substrate according to any one of claims 21 to 26, wherein a cutter roller is used as a means for performing the scribing, and the cutter roller is a1 st cutter roller in which a cutting edge line portion is formed with a groove over an entire circumference, or a2 nd cutter roller in which a region formed with a groove is formed in a predetermined ratio to a region not formed with a groove.

28. A cutter roller manufacturing apparatus for manufacturing a cutter roller as claimed in any one of claims 2 to 12,

comprising: at least one supported and rotatable disk-shaped grinding member, and a grinding mechanism for supporting at least one cutter roller as a grinding object and moving the cutter roller closer to or away from the grinding member; the grinding mechanism includes a rotating unit for moving a portion of the cutter roller to be ground by the grinding member.

29. The cutter roll manufacturing apparatus as claimed in claim 28, further comprising an approaching/separating unit for approaching and separating said grinding means to and from said grinding member, and a control unit for controlling the approaching/separating unit and said rotating unit.

30. The apparatus for manufacturing a cutter roller according to claim 29, wherein the control means controls the rotating means so that the groove is formed at a desired position of the ridge portion of the cutter roller, based on the number of divided portions and the number of areas of the ridge portion.

31. A method of manufacturing a cutter roller for use in manufacturing a cutter roller according to any one of claims 2 to 12,

the outer periphery of the cutter roller is machined at a predetermined position and at a predetermined depth by using at least one supported and rotatable disk-shaped grinding member and a grinding mechanism that supports at least one cutter roller to be ground and relatively moves the grinding member and the cutter roller toward and away from each other.