HK1065995B - A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheel - Google Patents

Description

Scribing method, cutter wheel, scribing apparatus using the cutter wheel, and apparatus for manufacturing the cutter wheel

Technical Field

The present invention generally relates to: a scribing method for forming a scribing line for dividing the brittle material; a cutter wheel which is a scribing cutter for forming a scribing line in a brittle material; a scribing apparatus including such a cutter wheel; and a cutter wheel manufacturing apparatus for manufacturing such a cutter wheel.

The brittle material includes glass, semiconductor wafer, ceramics, etc. used for a glass substrate or a bonded glass substrate.

Background

Fig. 1(a) to 1(d) are cross-sectional views showing a first cutting method of a liquid crystal mother sheet in a stepwise manner as one example of a conventional process of cutting a bonding glass substrate such as a liquid crystal mother sheet at a desired cutting position. In the following description, for convenience of explanation, one of bonded glass substrates formed of a pair of glass substrates which are liquid crystal mother sheets is referred to as an a-side glass substrate, and the other is referred to as a B-side glass substrate.

(1) First, as shown in fig. 1(a), the bonded glass substrate 1 is placed on a first scribing apparatus so that the a-side glass substrate is laid flat on the B-side glass substrate, and the a-side glass substrate is scribed using a glass cutter wheel 2 to form a scribe line Sa.

(2) Next, the bonded glass substrate 1 in which the scribe lines Sa have been formed on the a-side glass substrate is turned over and conveyed to a second scribing apparatus. In this second scribing apparatus, the B-side glass substrate of the bonded glass substrate 1 is scribed using the glass cutter wheel 2 to form a scribe line Sb parallel to the scribe line Sa, as shown in fig. 1 (B). It should be noted here that, in the case of the liquid crystal mother substrate, a plurality of liquid crystal panels are formed from the liquid crystal mother substrate, and in each liquid crystal panel, it is necessary to form terminals at the side edge portions of one glass substrate. Therefore, in many cases, the scribed portions of scribe lines Sa formed in the a-side glass substrate and the scribed portions of scribe lines Sb formed in the B-side glass substrate are horizontally displaced from each other as shown in fig. 1 (B).

(3) Next, the bonded glass substrate 1 in which the scribe lines Sa and Sb have been formed on the a-side glass substrate and the B-side glass substrate, respectively, is conveyed to a first breaking apparatus without being turned over, i.e., without exchanging the positions of the a-side glass substrate and the B-side glass substrate. In this first breaking apparatus, as shown in fig. 1(c), an adhesive glass substrate 1 is placed on a pad 4. A breaking bar 3 is pushed toward the B-side glass substrate of the bonding glass substrate 1 along the scribe line Sa formed on the a-side glass substrate. Accordingly, one crack extends upward from the scribe line Sa, and accordingly, the lower a-side glass substrate is broken along the scribe line Sa.

(4) Next, the bonded glass substrate 1 in which the a-side glass substrate has been broken is turned over so that the a-side glass substrate is positioned above the B-side glass substrate, and the bonded glass substrate is conveyed to a second breaking apparatus. In this second breaking apparatus, as shown in fig. 1(d), an adhesive glass substrate 1 is placed on a pad 4. A breaking bar 3 is pushed toward the a-side glass substrate of the bonded glass substrate 1 along the scribe lines Sb formed on the B-side glass substrate. Thus, the lower B-side glass substrate is broken along the scribe lines Sb.

By performing the above steps (1) to (4), the bonded glass substrate 1 is divided into two pieces at desired positions.

As shown in the above steps (3) and (4), the breaking bar 3 is pushed toward the upper glass substrate, and thus the lower glass substrate is broken. For example, as shown in fig. 1(c), when the breaking bar 3 is pushed to the B-side glass substrate above, the a-side glass substrate and the B-side glass substrate are bent downward at a position opposite to the position pushed by the breaking bar 3, and thus a force is applied to the a-side glass substrate, thereby horizontally widening a crack formed in a vertical direction (vertical crack) of the scribe line Sa formed in the a-side glass substrate. Therefore, the vertical crack extends upward to reach the upper surface of the a-side glass substrate, and thus the a-side glass substrate is broken. On the other hand, in the scribe line Sb formed in the upper B-side glass substrate, a force is applied in the horizontal direction from both ends of the B-side glass substrate to a crack in the direction opposite to the direction of the force generated in the lower glass substrate, thereby compressing the crack (vertical crack). Therefore, the B-side glass substrate is not broken.

In the breaking step performed in steps (3) and (4), when the vertical crack of the scribe line Sa of the underlying a-side glass substrate is shallow, as shown in fig. 1(c), it is necessary to apply a relatively large urging force in order to break the a-side glass substrate. However, when the urging force exerted by the breaking bar 3 is large, the upper B-side glass substrate may be broken simultaneously with the a-side glass substrate. In this case, in the underlying a-side glass substrate, the vertical crack extends in a substantially vertical direction to break the underlying a-side glass substrate, i.e., no problem arises. However, since the position of the force applied by the breaking bar 3 is different from the position where the scribe line Sb is formed in the B-side glass substrate in the above B-side glass substrate, the force is not generated in the direction of breaking the above B-side glass substrate. Therefore, the dividing surface may be formed in an oblique direction. In addition, cracks may be formed so as to contact each other, so that defects (horizontal cracks) are generated at the contact positions. A bonded glass substrate having such a dividing plane or defect formed in an oblique direction is not commercially valuable as a liquid crystal panel.

The applicant of this application proposed a breaking method of a brittle substrate capable of solving such a problem in japanese laid-open patent publication No.6-48755 entitled "breaking method of bonded glass substrate".

Fig. 2(a) to 2(d) are cross-sectional views showing in a stepwise manner the second division method for breaking the brittle material described in the above-mentioned publication. Hereinafter, the method described in this publication will be described with reference to fig. 2(a) to 2 (d). Also, in the following description, for convenience of explanation, as with fig. 1(a) to 1(d), one of bonded glass substrates formed of a pair of glass substrates which are liquid crystal mother sheets is referred to as an a-side glass substrate, and the other is referred to as a B-side glass substrate.

(1) First, as shown in fig. 2(a), the bonded glass substrate 1 is placed on a first scribing apparatus so that the a-side glass substrate is positioned on the B-side glass substrate, and the a-side glass substrate is scribed using the glass cutter wheel 2 to form a scribe line Sa.

(2) Next, the bonded glass substrate 1 in which the scribe lines Sa have been formed on the a-side glass substrate is turned over and conveyed to a first breaking apparatus. In this first breaking apparatus, as shown in fig. 2(b), the adhesive glass substrate 1 is placed on the pad 4. A breaking bar 3 is pushed toward the B-side glass substrate of the bonding glass substrate 1 along the scribe line Sa formed on the a-side glass substrate. Therefore, in the underlying a-side glass substrate, one crack extends upward from the scribe line Sa, and accordingly, the a-side glass substrate is broken along the scribe line Sa.

(3) Next, the bonded glass substrate 1 in which the a-side glass substrate has been broken is conveyed to a second scribing apparatus without being turned over, i.e., without exchanging the positions of the a-side glass substrate and the B-side glass substrate. In the second scribing apparatus, the B-side glass substrate of the bonded glass substrate 1 is scribed using a glass cutter wheel 2 to form a scribe line Sb parallel to the scribe line Sa, as shown in fig. 2 (c). It should be noted here that, in the case of the liquid crystal mother substrate, a plurality of liquid crystal panels are formed from the liquid crystal mother substrate, and in each liquid crystal panel, it is necessary to form terminals at the side edge portions of one glass substrate. Therefore, in many cases, the scribed portions of scribe lines Sa formed in the a-side glass substrate and scribe portions of scribe lines Sb formed in the B-side glass substrate are horizontally offset from each other.

(4) Next, the bonded glass substrate 1 is turned over so that the a-side glass substrate is positioned above the B-side glass substrate, and the bonded glass substrate is conveyed to a second breaking device. In this second breaking apparatus, as shown in fig. 2(d), the adhesive glass substrate 1 is placed on the pad 4. A breaking bar 3 is pushed toward the portion of the a-side glass substrate of the bonded glass substrate 1 corresponding to the scribe line Sb formed on the B-side glass substrate. Thus, the lower B-side glass substrate is broken along the scribe lines Sb.

By performing the above steps (1) to (4), the bonded glass substrate 1 is divided into two pieces at desired positions.

In the second dividing method of the brittle material, as shown in steps (2) and (4), in the breaking step, the lower glass substrate to be broken has a scribe line, whereas the upper glass substrate does not have a scribe line. Therefore, the upper glass substrate is not disconnected at the same time as the disconnection of the lower glass substrate. Therefore, it is possible to avoid the occurrence of problems that may occur in the first dividing method shown in fig. 1(a) to (4), such as dividing planes extending in oblique directions, the formation of defects, and the like.

Fig. 3 is a side view of the glass cutter wheel 2 used in the first and second separation methods, as viewed in a direction perpendicular to the rotational axis of the glass cutter wheel 2. The glass cutter wheel 2 is formed into a disk shape, where Φ represents a diameter of the wheel, w represents a thickness of the wheel, and a blade having a blade angle α is formed along a circumference of the wheel.

In addition, the applicant of this application improved the glass cutter wheel 2 disclosed in japanese laid-open patent publication No.9-188534 entitled "glass cutter wheel" shown in fig. 3 to obtain a glass cutter wheel capable of forming deep vertical cracks.

Fig. 4 shows the glass cutter wheel disclosed in the publication, which is viewed along the rotational axis of the glass cutter wheel.

The glass cutter wheel 5 has a corrugation at the edge line portion of the edge formed at the circumference of the wheel. That is, a U-shaped or V-shaped groove 5b is formed at the edge line portion 5a of the edge. These grooves 5b are formed by cutting notches at a pitch P from the edge line portion 5a by a depth h. By forming these grooves 5b, projections j having a height h are formed at a pitch P.

In fig. 4, the grooves formed at the edge line portions are shown in an enlarged size so that the grooves are easily recognized. However, the actual size of the grooves is a micrometer-scale size, which cannot be recognized by the naked eye.

Table 1 below shows specific values of the wheel diameter Φ, the wheel thickness w, and the like. These values are shown for two examples, type 1 and type 2.

TABLE 1

	Type 1	Type 2
			Wheel diameter Φ wheel thickness w number of edge angles α bump j height pitch P edge load scribe speed of bump j	2.5mm0.65mm125 degree 1255 μm63 μm3.6 Kgf300mm/s	2.0mm0.65mm125 degree 11010 um 63 um 1.8 Kgf400mm/s

A glass cutter wheel having undulations at the edge line portion has significantly improved scribing characteristics, i.e., significantly improved ability to form vertical cracks. By performing the scribing process using the glass cutter wheel, a deep vertical crack reaching almost near the lower surface of the scribed glass substrate can be obtained in the scribing process.

The glass cutter wheel 5 having the waviness at the edge line portion has significantly improved scribing characteristics as compared with the conventional glass cutter wheel. However, since the precision waviness is formed along the entire circumference of the edge line portion of the glass cutter wheel 5, the processing and formation of the waviness at the edge line portion requires a long processing time, and there are some problems in workability.

In the case where the second separation method shown in fig. 2 is performed using the glass cutter wheel 5 having the waviness at the edge portion, a deep vertical crack scribe line Sb is formed in the B-side glass substrate, and in some cases, the B-side glass substrate substantially above the bonding glass substrate 1 is divided when it is scribed in step (3). Therefore, when the bonded glass substrates 1 are conveyed to the second breaking apparatus using a suction pad or the like in the filtering stage between step (3) and step (4), one of the divided bonded glass substrates 1 may be left in the second breaking apparatus. In addition, one of the divided bonded glass substrates 1 may fall off from the suction pad during the conveyance of the bonded glass substrate 1. In such a case, the line equipment for dividing the bonded glass substrate 1 may not be operated in a normal manner.

The present invention is believed to solve the above problems. An object of the present invention is to provide: a glass cutter wheel in which a problem in workability, that is, a problem that may occur in a glass cutter wheel having a ripple over the entire circumference of a bead line portion is solved and a desired scribing characteristic is obtained, that is, a scribing line having a vertical crack of a desired depth can be formed during the glass substrate dividing process; a scribing method for forming a scribing line capable of dividing a brittle material; scribing equipment incorporating such a cutter wheel; and a cutter wheel manufacturing apparatus for manufacturing such a cutter wheel.

Disclosure of Invention

The scribing method of the present invention, which divides a disk-shaped wheel and a plurality of grooves having a predetermined shape formed at a rim line portion at a predetermined pitch using a brittle material having a central portion protruding in a thickness direction in a circumferential direction so as to form a rim at the rim line portion of the wheel, is characterized in that scribing is performed using one wheel in which a ratio of a length of a region occupied by the plurality of grooves with respect to the entire circumference of the rim line portion is less than 1 so that a depth of a vertical crack formed in the scribed brittle material periodically varies.

In the scribing method of the present invention described above, the scribing is preferably performed using a wheel in which the ratio of the length of the region occupied by the plurality of grooves with respect to the entire circumference of the edge line portion is equal to or less than 3/4.

In the scribing method of the present invention described above, it is more preferable that the scribing is performed using a wheel in which the ratio of the length of the region occupied by the plurality of grooves with respect to the entire circumference of the edge line portion is equal to or less than 1/4.

The cutter wheel for dividing brittle material of the present invention, wherein the cutting edge is formed in the rim line portion of the disk-shaped wheel, and a plurality of grooves having a predetermined shape are formed in the rim line portion at a predetermined pitch, is characterized in that a ratio of a length of a region occupied by the plurality of grooves with respect to the entire circumference of the rim line portion is less than 1.

In the cutter wheel of the present invention described above, it is preferable that the ratio of the length of the region occupied by the plurality of grooves with respect to the entire circumference of the edge line portion is greater than 1/4 and equal to or less than 3/4.

In the cutter wheel of the present invention described above, it is more preferable that the ratio of the length of the region occupied by the plurality of grooves with respect to the entire circumference of the edge line portion is equal to or less than 1/4.

In the cutter wheel of the present invention described above, it is preferable that the pitch at which the plurality of grooves are formed corresponds to a wheel diameter of 1 to 20mm is 20 to 200 μm.

In the above-described cutter wheel of the present invention, it is more preferable that the depth of the plurality of grooves corresponds to a wheel diameter of 1 to 20mm of 2 to 200. mu.m.

In the cutter wheel of the present invention described above, it is more preferable that the cutter wheel is integrally formed with a shaft passing through the wheel.

In the cutter wheel of the present invention described above, it is more preferable that at least one groove region is formed in the edge line portion; the grooves have different depths such that the depth of the grooves is deeper at a center portion of the groove region than at end portions of the groove region.

Another cutter wheel of the invention is characterized in that: the groove region is formed over the entire circumference of the edge line portion; a region in which the depth of the groove starts to become deep and a region in which the depth of the groove starts to become shallow are continuously provided.

The scribing installation of the invention, comprising means for moving the head in the X-direction and/or in the Y-direction with respect to a table in which the brittle material is placed, is characterized in that the head is provided with the above-mentioned cutter wheel of the invention.

The method for dividing a bonded glass substrate of the present invention comprises a first scribing step, a second scribing step and a breaking step, and is characterized in that the above-described glass cutter wheel of the present invention is used in the second scribing step.

The method for separating a bonded glass substrate of the present invention comprises a first scribing step, a first breaking step, a second scribing step and a second breaking step, and is characterized in that the above-described glass cutter wheel of the present invention is used in the second scribing step.

A cutter wheel manufacturing apparatus for manufacturing a cutter wheel of the present invention includes: at least one rotatably supported disc-shaped abrasive member; and a grinding mechanism supporting at least one cutter wheel to be ground and advancing/retracting the cutter wheel toward/from the grinding member, characterized in that the grinding mechanism has a rotating means for moving a portion of the cutter wheel to be ground by the grinding member.

The above-described cutter wheel manufacturing apparatus of the present invention preferably further includes: advancing/retracting means for advancing/retracting the cutter wheel to/from the grinding member; and control means for controlling the advancing/retracting means and the rotating means.

In the above-described cutter wheel manufacturing apparatus of the present invention, it is preferable that the control means controls the rotating means based on the number of divisions over the entire circumference of the edge line portion of the cutter wheel and the number of areas, so that the groove is formed at a desired position in the edge line portion.

Drawings

Fig. 1 shows a conventional dividing process of bonding glass plates.

Fig. 2 shows another conventional dividing process of bonding glass plates.

FIG. 3 is a front view of a glass cutter wheel.

FIG. 4 is a side view of a glass cutter wheel in which grooves are formed in the rim line portion of the wheel.

FIG. 5 is a side view of a glass cutter wheel according to one embodiment of the present invention.

FIG. 6 is a side view of a glass cutter wheel according to another embodiment of the invention.

Fig. 7 shows a vertical crack formed when scribing is performed using the glass cutter wheel of the present invention.

Fig. 8 shows a dividing process using a scribing apparatus including the glass cutter wheel of the present invention.

Fig. 9 shows another separation process performed using a scribing apparatus including the glass cutter wheel of the present invention.

Fig. 10 is a side view showing a glass cutter wheel of example 1.

Fig. 11 is a side view showing a glass cutter wheel of example 2.

Fig. 12 is a side view showing a glass cutter wheel of example 3.

Fig. 13 is a side view showing a glass cutter wheel of example 4.

Fig. 14 is a side view showing a glass cutter wheel of example 5.

Fig. 15 is a plan view showing the entire structure of the glass cutter wheel manufacturing apparatus of example 2.

Fig. 16 shows an example of a touch panel included in an operation section of a glass cutter wheel manufacturing apparatus.

Fig. 17 is an example of a schematic lamp included in the glass cutter wheel manufacturing apparatus.

FIG. 18 is a flowchart showing the steps of the glass cutter wheel grinding process.

Fig. 19 is a front view of the scribing apparatus used in example 1.

Fig. 20 is a side view of the scribing apparatus used in example 1.

Detailed Description

FIG. 5 is a side view showing the glass cutter wheel 6 according to example 1 of the present invention.

As shown in fig. 5, the glass cutter wheel 6 has a region a in which a groove is formed in the edge line portion and a region B in which no groove is formed in the edge line portion.

The ratio of the portion of the edge line of the region a in which the groove is formed with respect to the entire edge line portion (region a + region B) (hereinafter referred to as "the ratio of the region a to the entire circumference") is preferably 3/4 or less in view of the workability of forming the groove in the edge line of the glass cutter wheel 6. By such a ratio, the step of forming the groove does not take a long time, and good workability can be obtained.

In the case where the ratio of the area a to the entire circumference is 3/4 or less but more than 1/4, a vertical crack whose depth varies periodically can be obtained as shown in fig. 7 as will be described below. When the ratio of the area a to the entire circumference is within such a range, a restriction condition needs to be imposed in order to obtain the above-described periodic cracks.

Alternatively, in the case where the ratio of the area a to the entire circumference is 1/4 or less, vertical cracks whose depth varies periodically can be stably obtained under a wide condition. Setting the ratio of the area a to the entire circumference within this range is suitable for preventing problems that may occur during conveyance of the brittle substrate in which the dicing lines have been formed, such as a divided piece of the brittle substrate falling down during conveyance.

The grooves 6b formed in the region a in the edge line portion are intentionally formed periodically on a micron-scale basis. These grooves 6b should be considered as being different from the grinding cracks of the submicron order that are inevitably formed in the grinding process of forming the edge line.

Fig. 6 shows another example of the glass cutter wheel according to example 1. In fig. 6(a), the entire edge is divided into six regions, so that the regions a and B are alternately formed. In fig. 6(B), the entire edge is divided into eight regions, so that the regions a and B are alternately formed.

In fig. 6(B), a region a in which grooves are formed is formed as several regions a1 to a4, and a region B in which grooves are not formed is formed as several regions B1 to B4. The length of each of the regions a1 to a4 and the regions B1 to B4 is set, for example, so as to satisfy the following relationship:

A1＝A2＝A3＝A4； A1+A2+A3+A4＝A；

b1 ═ B2 ═ B3 ═ B4; b1+ B2+ B3+ B4 ═ B; and

A/B＝1。

in this case, the lengths of the regions a1 through a4 are all equal, and the lengths of the regions B1 through B4 are all equal. In addition, since a/B is 1, the ratio of the area a to the entire circumference is 2/4.

In one example of choice, the following relationship is satisfied:

A1＝A2≠A3≠A4； A1+A2+A3+A4＝A；

b1 ≠ B2 ≠ B3 ≠ B4; b1+ B2+ B3+ B4 ═ B; and

A/B＝1。

in this case, for a1 to a4 and B1 to B4, the length of region A3 and the length of region a4 are different from the length of region a1 and the length of region a2, and the length of region B3 and the length of region B4 are different from the length of region B1 and the length of region B2. In addition, since a/B is 1 for the entire circumference, the ratio of the area a to the entire circumference is 2/4.

In one example of choice, the following relationship is satisfied:

A1＝A2≠A3≠A4； A1+A2+A3+A4＝A；

b1 ≠ B2 ≠ B3 ≠ B4; b1+ B2+ B3+ B4 ═ B; and

A/B＝3/1。

in this case, for a1 to a4 and B1 to B4, the length of region A3 and the length of region a4 are different from the length of region a1 and the length of region a2, and the length of region B3 and the length of region B4 are different from the length of region B1 and the length of region B2. In addition, since a/B is 3/1 satisfied for the entire circumference, the ratio of the area a to the entire circumference is 3/4.

The glass cutter wheel 6 may be formed integrally with a shaft inserted in the wheel 6. A method of integrally forming the glass cutter wheel 6, a method of integrally grinding the wheel 6 and the shaft, a method of joining the blade edge and the shaft with an adhesive and/or by welding or the like may be used.

Fig. 7 is a schematic view generally showing a vertical crack generated in a glass substrate when a scribe line is formed in the glass substrate using the above-described glass cutter wheel 6.

In a scribe line formed by scribing glass using the glass cutter wheel 6, the depth of a vertical crack is set at a scribe line S formed by a region A having a groove_ANeutralizing scribe line S formed in region a having no groove_BAre different. In such a scribe line, a change in depth can be found. I.e. on the scribe line S_AIn which a deep vertical crack D is formed due to a groove formed in the edge line portion_AOn the scribe line S_BDue to the fact that the cutting line S is_BHas no groove formed therein and has a shallow vertical crack D_B。

Therefore, the scribing ability of the glass cutter wheel 6 is between that of the conventional glass cutter wheel 2 of fig. 2 and that of the conventional glass cutter wheel 2 of fig. 4 due to the periodic variation in the depth of the vertical cracks in the case of performing scribing using the glass cutter wheel 6 of example 1. In addition, by appropriately changing the ratio of the region a in which the groove is formed and the region B in which the groove is not formed corresponding to the entire circumference of the glass cutter wheel, an ideal vertical score line (score line) for dividing the glass substrate can be obtained.

Examples 1 to 5 showing specific examples of the glass cutter wheel of example 1 are explained below.

(example 1)

Fig. 10 shows an embodiment of the glass cutter wheel of example 1. Table 2 below shows the dimensions of the glass cutter wheel of example 1, such as the wheel diameter and the like.

TABLE 2

Wheel diameter phi wheel thickness w knife edge angle alpha groove depth

2.0mm0.65mm135°7μm

The glass cutter wheel 6 of example 1 was designed such that grooves having an equal depth (7 μm) were continuously formed over 1/10 portions (8 divisions/80 divisions) of the entire circumferential length of the edge line portion.

The glass cutter wheel 6 was used to score alkali-free glass sheets having a thickness of 0.7mm at a cutting edge load of 0.16 to 0.40MPa and a scoring speed of 400 mm/s. In the scribing process using the glass cutter wheel 6 of example 1, a scribing line in which the depth of the vertical crack periodically varies was formed as shown in fig. 7. Deep vertical crack D shown in FIG. 7 in the case of using a load of 0.18MPa_AAbout 400 μm, a shallow vertical crack D as shown in FIG. 7_BApproximately 100 μm.

(example 2)

Fig. 11 shows an embodiment of the glass cutter wheel 6 of example 2. Table 3 below shows the dimensions of the glass cutter wheel shown in fig. 11, such as the wheel diameter and the like.

TABLE 3

Wheel diameter phi wheel thickness w knife edge angle alpha groove depth

2.0mm0.65mm135°7μm

The glass cutter wheel 6 of example 2 has regions a1 and a2 at two separate positions on the circumference of the glass cutter wheel 6, each of which is 1/10 parts (8 divisions/80 divisions) of the entire circumferential length of the edge line part, where grooves having equal depths (7 μm) are continuously formed. The regions a1 and a2 in which the grooves are formed are disposed on opposite sides of the glass cutter wheel 6 with respect to the central axis of the glass cutter wheel 6.

The glass cutter wheel 6 was used to score alkali-free glass sheets having a thickness of 0.7mm at a cutting edge load of 0.16 to 0.40MPa and a scoring speed of 400 mm/s. In the scribing process using the glass cutter wheel 6 of example 2, a scribing line in which the depth of the vertical crack periodically varies was formed as shown in fig. 7. Deep vertical crack D shown in FIG. 7 in the case of using a load of 0.20MPa_AAbout 400 μm, a shallow vertical crack D as shown in FIG. 7_BApproximately 100 μm.

(example 3)

Fig. 12 shows an embodiment of the glass cutter wheel 6 of example 3. Table 4 below shows the dimensions of the glass cutter wheel 6 of example 3, such as the wheel diameter and the like.

TABLE 4

Wheel diameter phi wheel thickness w knife edge angle alpha groove depth

2.0mm0.65mm135°7μm

The glass cutter wheel 6 of example 3 has regions a1, a2, and A3 at three separate positions on the circumference of the glass cutter wheel 6, each of which is 1/10 portions (8 divisions/80 divisions) of the entire circumferential length of the edge line portion, where grooves having equal depths (7 μm) are continuously formed. The regions a1, a2, and A3 are disposed at uniform intervals.

The glass cutter wheel 6 was used to score alkali-free glass sheets having a thickness of 0.7mm at a cutting edge load of 0.16 to 0.40MPa and a scoring speed of 400 mm/s. In the scribing process using the glass cutter wheel 6 of example 3, a scribing line in which the depth of the vertical crack periodically varies was formed as shown in fig. 7. Deep vertical crack D shown in FIG. 7 in the case of using a load of 0.20MPa_AAbout 400 μm, a shallow vertical crack D as shown in FIG. 7_BApproximately 100 μm.

(example 4)

Fig. 13 shows an embodiment of the glass cutter wheel 6 of example 4. Table 5 below shows the dimensions of the glass cutter wheel 6 of example 4, such as the wheel diameter and the like.

TABLE 5

Wheel diameter phi wheel thickness w knife edge angle alpha groove depth

2.0mm0.65mm135°3、5、7、7、7、5、3μm

The glass cutter wheel 6 of example 4 has a region a, which is 1/10 parts (8 divisions/80 divisions) of the entire circumferential length of the edge line part, at a position on the circumference of the glass cutter wheel 6, in which seven grooves are formed. The grooves are designed such that they have different depths 3, 5, 7, 5, 3 μm in order.

The glass cutter wheel 6 was used to score alkali-free glass sheets having a thickness of 0.7mm at a cutting edge load of 0.16 to 0.40MPa and a scoring speed of 400 mm/s. In the scribing process using the glass cutter wheel 6 of example 4, a scribing line in which the depth of the vertical crack periodically varies was formed as shown in fig. 7.Deep vertical crack D shown in FIG. 7 in the case of using a load of 0.22MPa_AAbout 400 μm, a shallow vertical crack D as shown in FIG. 7_BApproximately 100 μm.

(example 5)

Fig. 14 shows an embodiment of the glass cutter wheel 6 of example 5. Table 6 below shows the dimensions of the glass cutter wheel 6 of example 5, such as the wheel diameter and the like.

TABLE 6

Wheel diameter phi wheel thickness w knife edge angle alpha division number groove depth

2.0mm0.65mm140°1063、5、7、7、7、5、3μm

In the glass cutter wheel 6 of example 5, the entire circumferential length of the edge line portion was divided into 106 divisions, thereby repeating formation with different depths 3, 5, 7, 5, 3 μm in order along the entire circumference.

The glass cutter wheel 6 was used to score alkali-free glass sheets having a thickness of 0.7mm at a cutting edge load of 0.16 to 0.40MPa and a scoring speed of 400 mm/s. In the scribing process using the glass cutter wheel 6 of example 5, a scribing line in which the depth of the vertical crack periodically varies was formed as shown in fig. 7. Deep vertical crack D shown in FIG. 7 in the case of using a load of 0.29MPa_AAbout 400 μm, a shallow vertical crack D as shown in FIG. 7_BApproximately 100 μm.

From the results of the above examples 1 to 5, it was found that the pitch of the plurality of grooves formed continuously is preferably 20 to 200 μm in accordance with the wheel diameter of 1 to 20mm, and the depth of the plurality of grooves is preferably 2 to 200 μm in accordance with the wheel diameter of 1 to 20 mm.

In the drawings for illustrating the above-described cutter wheel of the present invention, the grooves formed at the edge line of the cutter wheel are shown in an enlarged size so that the grooves are easily recognized. However, the actual size of the grooves is a micrometer-scale size, which cannot be recognized by the naked eye.

Next, a method of dividing the bonded glass substrate 1 using the dividing apparatus having the glass cutter wheel 6 of example 1 is explained. The scribing apparatus used in the following description is a scribing apparatus having a mechanism for effecting θ rotation of a table on which a glass plate is mounted and for moving the table in X and Y directions with respect to a tool bit.

Fig. 19 and 20 show an example of a scribing apparatus in which the table performs θ rotation and moves in the Y direction and the tool head moves in the X direction. Fig. 19 is a front view of the scribing apparatus, and fig. 20 is a side view of the scribing apparatus.

As shown in fig. 19 and 20, the scribing apparatus has a table 41 on which a glass plate is mounted. The table 41 is supported by a rotary table 42 so as to be rotatable in the horizontal direction, and is movable in the Y direction (leftward/rightward direction in fig. 19) by rotation of a ball screw 44. Further, a cutter head 46, to which the above-described glass cutter wheel 11 of the present invention is rotatably attached so that the glass cutter wheel 11 can rotate about its axis, is movably supported along a rail 47 so as to be movable in the X direction (leftward/rightward direction in fig. 20).

In the case of performing scribing using this scribing apparatus, the tool bit 46 is moved in the X direction each time the table 41 is moved in the Y direction at a predetermined pitch, thereby scribing the glass sheet mounted on the table 41 in the X direction. Thereafter, the table 41 is rotated by 90 ° by the rotary table 42, and scribing is performed in the same manner as described above, so that a scribing line intersecting the previously formed scribing line at right angles can be formed on the glass sheet.

In the above scribing apparatus, reference numeral 43 denotes a table feed motor for moving the table 41 in the Y direction; reference numeral 45 denotes a rail for supporting the rotary table 42 so that the rotary table 42 is movable in the Y direction; reference numeral 48 denotes a cutter shaft motor for rotating the rotatably supported glass cutter wheel 11; reference numerals 49 and 50 denote CCD (charge coupled device) cameras for monitoring the glass substrate scribed on the stage 41; and reference numeral 51 denotes a camera support metal member for supporting the CCD cameras 49 and 50.

Fig. 8(a) to 8(c) are cross-sectional views showing in a stepwise manner a method of separating the bonded glass substrate 1 using a separation apparatus including the glass cutter wheel 6 of example 1. In the following description, for convenience of explanation, one of bonded glass substrates formed of a pair of glass substrates which are liquid crystal mother sheets is referred to as an a-side glass substrate, and the other is referred to as a B-side glass substrate.

(1) First, as shown in fig. 8(a), the bonded glass substrate 1 is placed on a first scribing apparatus so that the a-side glass substrate is laid flat on the B-side glass substrate, and the a-side glass substrate is scribed using a glass cutter wheel 5 to form a scribe line Sa. The first scribing apparatus uses a glass cutter wheel 5 shown in fig. 4 having a groove along its entire circumference. In the scribe line Sa formed using this glass cutter wheel 5, a deep vertical crack indicated by Va in the drawing is formed to reach the vicinity of the lower surface of the a-side glass substrate.

(2) Next, the bonded glass substrate 1 in which the scribe lines Sa have been formed on the a-side glass substrate is turned over and conveyed to a second scribing apparatus. In this second scribing apparatus, the B-side glass substrate of the bonded glass substrate 1 is scribed using the glass cutter wheel 6 to form a scribe line Sb parallel to the scribe line Sa, as shown in fig. 8 (B). The second scoring apparatus used a glass cutter wheel 6 as described in any of examples 1-5. In the scribe line Sb formed using this glass cutter wheel 6, a vertical crack Vb alternately including shallow portions or deep portions on a periodic basis is formed. It should be noted here that, in the case of the liquid crystal mother substrate, a plurality of liquid crystal panels are formed from the liquid crystal mother substrate, and in each liquid crystal panel, it is necessary to form terminals at the side edge portions of one glass substrate. Therefore, in many cases, the scribed portions of scribe lines Sa formed in the a-side glass substrate and scribe portions of scribe lines Sb formed in the B-side glass substrate are horizontally offset from each other.

(3) Next, the bonded glass substrate 1 in which the scribe lines Sa and Sb have been formed on the a-side glass substrate and the B-side glass substrate, respectively, is turned over so that the a-side glass substrate is positioned on the B-side glass substrate, and the bonded glass substrate is conveyed to a breaking apparatus. In this breaking apparatus, as shown in fig. 8(c), the adhesive glass substrate 1 is placed on the pad 4. A breaking bar 3 is pushed toward the a-side glass substrate of the bonded glass substrate 1 along the scribe line Sb formed on the B-side glass substrate. Therefore, in the underlying B-side glass substrate, one crack extends upward from the scribe line Sb, and accordingly, the B-side glass substrate is broken along the scribe line Sb.

By sequentially performing the above steps (1) to (3), the bonded glass substrate 1 is divided.

As previously mentioned, in the scribing process using the glass cutter wheel 6 of the present invention, the vertical cracks Vb alternately including shallow portions or deep portions on a periodic basis are formed so that the vertical cracks Vb do not completely penetrate the glass substrate in the thickness direction of the glass substrate. Therefore, even when the a-side glass substrate is completely divided during the transfer of the bonded glass substrate 1 from the second scribing apparatus to the breaking apparatus in step (2), there is no possibility that the bonded glass substrate 1 is divided because the a-side glass substrate remains bonded to the B-side glass substrate.

Fig. 9(a) to 9(d) are cross-sectional views showing in a stepwise manner a second method of separating the bonded glass substrate 1 using a separation apparatus incorporating the glass cutter wheel 6 of example 1. In the following description, for convenience of explanation, one of bonded glass substrates formed of a pair of glass substrates which are liquid crystal mother sheets is referred to as an a-side glass substrate, and the other is referred to as a B-side glass substrate.

(1) First, as shown in fig. 9(a), the bonded glass substrate 1 is placed on a first scribing apparatus so that the a-side glass substrate is laid flat on the B-side glass substrate, and the a-side glass substrate is scribed using a glass cutter wheel 2 to form a scribe line Sa. The vertical crack Va formed using the glass cutter wheel does not cause a deep vertical crack reaching the vicinity of the lower surface of the glass substrate.

(2) Next, the bonded glass substrate 1 in which the scribe lines Sa have been formed on the a-side glass substrate is turned over and conveyed to a first breaking apparatus. In this breaking apparatus, as shown in fig. 9(b), the adhesive glass substrate 1 is placed on the pad 4. A breaking bar 3 is pushed toward the B-side glass substrate of the bonding glass substrate 1 along the scribe line Sa formed on the a-side glass substrate. Therefore, in the underlying a-side glass substrate, one crack extends upward from the scribe line Sa, and accordingly, the a-side glass substrate is broken along the scribe line Sa.

(3) Next, the bonded glass substrate 1 in which the a-side glass substrate has been divided is conveyed to a second scribing apparatus without being turned over, i.e., without exchanging the positions of the a-side glass substrate and the B-side glass substrate. In the second scribing apparatus, the B-side glass substrate of the bonded glass substrate 1 is scribed using a glass cutter wheel 6 to form a scribe line Sb parallel to the scribe line Sa, as shown in fig. 9 (c). It should be noted here that, in the case of the liquid crystal mother substrate, a plurality of liquid crystal panels are formed from the liquid crystal mother substrate, and in each liquid crystal panel, it is necessary to form terminals at the side edge portions of one glass substrate. Therefore, in many cases, the scribed portion of scribe line Sb formed in the B-side glass substrate and the scribed portion of scribe line Sa formed in the a-side glass substrate are horizontally offset from each other.

(4) Next, the obtained bonded glass substrate 1 was turned over so that the a-side glass substrate was positioned above the B-side glass substrate, and the bonded glass substrate was conveyed to a second breaking apparatus. In this second breaking apparatus, as shown in fig. 9(d), the adhesive glass substrate 1 is placed on the pad 4. A breaking bar 3 is pushed toward the a-side glass substrate of the bonded glass substrate 1 along the scribe line Sb formed on the B-side glass substrate. Therefore, in the underlying B-side glass substrate, one crack extends upward from the scribe line Sb, and accordingly, the B-side glass substrate is broken along the scribe line Sb. A vertical crack formed while the scribe line Sb is formed in the B-side glass substrate in step (3) is denoted by Vd in fig. 9 (d).

As described above, in the scribing process using the glass cutter wheel 6 of the present invention, the vertical cracks Vb alternately including shallow portions or deep portions on a periodic basis are formed so that the vertical cracks Vb do not completely penetrate the glass substrate in the thickness direction of the glass substrate. Therefore, even when the a-side glass substrate is completely divided during the transfer of the bonded glass substrate 1 from the second scribing apparatus to the breaking apparatus in step (4), there is no possibility that the bonded glass substrate 1 is divided because the B-side glass substrate is not completely divided.

In the above, the scribing method for bonding the glass substrate has been described. As a specific case, different brittle materials may be scribed using the scribing method of the present invention. In this case, it is also possible to form vertical cracks in the different brittle materials, which alternately comprise shallow portions or deep portions. By forming such vertical fractures with a periodically deformed depth, the brittle material can be transported to the next step without causing complete separation during transport.

Next, a glass cutter wheel manufacturing apparatus for manufacturing a glass cutter wheel in which a corrugation is formed at a blade edge portion as shown in fig. 5 is explained.

FIG. 15 is a plan view showing the entire structure of a glass cutter wheel manufacturing apparatus according to embodiment 2 of the invention.

The glass cutter wheel manufacturing apparatus 10 has a structure for grinding the edge line portion of the edge of the glass cutter wheel to form a groove in the edge.

The glass cutter wheel manufacturing apparatus 10 has a housing 13 in which a grinding wheel 12 is rotatably supported and fixed to a spindle motor 11 placed in the housing. On the front side of the housing 13, a door section 14 is provided, which can be opened in order to introduce or remove the glass cutter wheel to be ground. The door portion 14 serves as a safety door in which a safety control device (not shown) is provided to interrupt the grinding step when the door is opened during grinding of the glass cutter wheel.

A grinding mechanism 15 is provided in the housing 13 so as to be advanced toward and retracted from the grinding wheel 12. Advancement/retraction of the grinding mechanism 15 to/from the grinding wheel 12 may be effected by a feed motor 18. The feed motor 18 regulates the movement of the grinding mechanism 15 to and from a certain position by rotating a ball screw (not shown).

The grinding mechanism 15 has a wheel supporting portion 19 for supporting the glass cutter wheel during grinding. At the rear of the wheel supporting portion 19, there is provided a blade edge rotating motor 20 for rotating the glass cutter wheel at a predetermined angle. In addition, the grinding mechanism 15 has a handle 21 for alignment in the horizontal direction and a handle 22 for alignment in the vertical direction. By means of these handles the alignment in the horizontal and vertical direction can be adjusted manually or automatically using a control mechanism (not shown).

Outside the housing 13, a control device 25 for controlling the position and operation of the grinding mechanism 15 is provided. In addition, the control device 25 has a control section 26 for indicating the grinding state of the glass cutter wheel by the grinding mechanism 15.

In the actuating section 26, for example, a contact plate 30 shown in fig. 16 is provided. In the touch panel 30 shown as an example in fig. 16, a touch panel manipulation portion 31 is provided on which various operation modes, setting conditions, alarms, and the like for the entire apparatus are displayed. In the lower portion of the touch panel 30, there are provided a power switch 32 for manipulating the on and off of the operation power, a lamp-type button switch 33 for designating the start of the operation preparation, a warning buzzer 34 for issuing a warning message, and an emergency stop button switch 35 for providing an instruction to stop the operation in an emergency.

Further, a signal tower 40 is provided on the housing 13. The beacon 40 is an indicator light showing the state of the inside of the housing, such as that an abnormal condition has occurred, that the apparatus is in automatic operation, that there is no problem in opening/closing the door, and the like. Fig. 17 shows an example of a signal tower 40. In this example, there are provided a "red" indicator lamp 41 indicating that an abnormal condition has occurred in the housing 13, a "green" indicator lamp 42 indicating that an operation performed in the housing 13 is automatic, and a "yellow" indicator lamp 43 indicating that there is no problem in opening/closing the door.

Next, the glass cutter wheel manufacturing apparatus 10 having the above-described structure is explained.

First, the manipulation section 26 is manipulated to perform initial setting of the grinding condition of the glass cutter wheel to be ground.

In this initial setting, for example, the following conditions are input:

in the first region, the rotation angle ratio F₁(ii) a Depth of groove, D₁₁，……，D_1n；

In the second region, the rotation angle ratio F₂(ii) a Depth of groove, D₁₁，……，D_2n；

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Rotation angle ratio F in the m-th region_m(ii) a Depth of groove, D₁₁，……，D_mn；

Number of turns: l is

Number of divisions in a region: n is a radical of

Depth of groove: d1, D2, … … Dn

Number of regions: r

After the initial setting is entered, the grinding step of the glass cutter wheel is started. FIG. 18 is a flowchart showing the steps of grinding a glass cutter wheel. Next, the procedure of grinding the glass cutter wheel will be described based on this flowchart.

First, in step 1, the number of divisions is set to 0(n is 0), and then in step 2, the number of areas is set to 1(r is 1).

Next, at step 3, the glass cutter wheel to be ground is attached to the wheel supporting portion 19.

Next, the operating section 26 is manipulated to start the automatic operation of the grinding mechanism 15.

Next, the position where the edge of the glass cutter wheel contacts the end of the grinding wheel 12 is detected. An optical mechanism, a mechanical mechanism, or an electrical mechanism may be used in the detection of the contact position. Contact detection of the edge of the glass cutter wheel with the grinding wheel 12 is performed every time the edge comes into contact with the grinding wheel 12.

When the position where the tip of the grinding wheel 12 is in contact with the edge of the glass cutter wheel is detected, the grinding mechanism 15 is moved back to the standby position by the feed motor 18 at step 6.

Next, at step 7, the edge rotating motor 20 is rotated, so that the glass cutter wheel supported by the wheel supporting portion 19 is rotated by a predetermined angle.

Next, in step 8, the number of divisions n is updated to (n +1) by increasing 1 to n.

Next, at step 9, the grinding mechanism 15 is moved toward the grinding wheel 12 so that the edge is brought into contact with the grinding wheel 12, and the nth groove is processed so as to have a depth of Dmn.

In step 9, the grooves are formed such that the nth groove in the mth region R has a depth of Dmn corresponding to the input value set in advance in the above-described initial setting step. Similarly, in order to form these grooves, the number of rotation angles in the m-th region R is previously determined in accordance with the rotation angle ratio F in the m-th region_mSetting, the rotation angle ratio being an input value set in the above-described initial setting step.

Next, in step 10, the grinding mechanism 15 is moved to the standby position.

Next, in step 11, the number of divisions N and the number of divisions N are compared to check whether N < N is satisfied. If N < N is satisfied, the routine proceeds to step 12. If N < N is not satisfied, the routine proceeds to step 13.

When it is confirmed that N < N is satisfied and the routine proceeds to step 12, the edge rotating motor is rotated by a very small angle at step 12. The process then returns to step 6 and the grinding process is performed at a position where the edge has rotated by a very small angle.

When it is confirmed that N < N is not satisfied at step 11, which means that when the index number N has reached the index degree N, the routine proceeds to step 13, and it is checked at step 13 whether R < R is satisfied.

When it is confirmed that R < R is satisfied in step 13, the routine proceeds to step 14. At step 14, the knife edge is rotated by a set angle by the knife edge rotating motor 20.

Next, the routine proceeds to step 15. In step 15, the number of regions to be set r is updated to (r +1) by increasing 1. After the number of areas is updated at step 15, the process returns to step 6, and the grinding process is performed again.

When it is confirmed that R < R is not satisfied at step 13, which means that when the number of regions R has reached the number of regions, the routine proceeds to step 16, and the grinding mechanism 15 is moved back to its initial position.

Next, at step 17, the glass cutter wheel in which the edge has been ground is removed, and the grinding process is terminated.

By using the above-described glass cutter wheel manufacturing apparatus 10 of embodiment 2, it is possible to form the groove having a desired depth at a desired position of the entire circumference of the edge with satisfactory accuracy.

In the cutter wheel manufacturing apparatus shown in fig. 15, a grinding mechanism 15 for the grinding wheel 12 is provided. However, in a structure in which the grinding wheel is located at substantially the center of the housing, a plurality of grinding mechanisms may be provided so that the grinding wheel is surrounded by the grinding mechanisms. With such a structure, the processing efficiency of the cutter wheel can be significantly increased with respect to the number of grinding mechanisms provided.

Alternatively, the plurality of grinding wheels may be vertically stacked and arranged such that the cutting edges of the plurality of cutter wheels face the respective grinding wheels. Alternatively, a structure may be used in which a plurality of cutter wheels may be attached to one cutter wheel supporting portion of the grinding mechanism, and the plurality of cutter wheels may be ground simultaneously in one grinding step. By such a structure, the physical efficiency of the cutter wheel can be remarkably increased.

Industrial applicability

As described above, according to the present invention, in the glass cutter wheel in which the cutting edge is formed in the disk wheel, the groove having the predetermined shape is formed at the predetermined pitch of 3/4 or less of the cutting edge line portion of the entire circumference of the cutting edge. Such a glass cutter wheel has good workability as compared with a glass cutter wheel in which a groove is formed over the entire circumference of the blade edge.

Another glass cutter wheel in which the grooves are formed at a predetermined pitch of 1/4 or less of the entire circumference of the blade edge can prevent the formation of vertical cracks reaching the vicinity of the lower surface of the substrate. By varying the ratio of the grooves about the entire circumferential length, the desired scribing characteristics can be achieved. Therefore, by changing the scribing characteristics, the division of the glass substrate at the scribing line position and the falling off of the divided glass substrate, which may occur during the conveyance of the glass substrate, can be avoided.

Claims (15)

1. A scribing method using a brittle material dividing disk wheel having a center portion protruding in a circumferential direction in a thickness direction to form a rim at a rim line portion of the wheel, and a plurality of grooves having a predetermined shape formed at the rim line portion at a predetermined pitch,

wherein the scribing is performed using a brittle material dividing disk-shaped wheel in which a ratio of a length of a region occupied by the plurality of grooves with respect to the entire circumference of the edge line portion is equal to or less than 3/4, so that a depth of a vertical crack formed in the scribed brittle material varies periodically.

2. Scribing method according to claim 1, characterized in that scribing is performed using a brittle material dividing disc wheel in which the ratio of the length of the area occupied by the grooves relative to the entire circumference of the edge line portion is equal to or less than 1/4.

3. A cutter wheel for dividing brittle material, wherein a cutting edge is formed on a rimline portion of a disk wheel, and a plurality of grooves having a predetermined shape are formed in the rimline portion at a predetermined pitch,

wherein a ratio of a length of a region occupied by the plurality of grooves with respect to the entire circumference of the edge line portion is equal to or less than 3/4.

4. The cutter wheel of claim 3 wherein the ratio of the length of the area occupied by the plurality of grooves relative to the entire circumference of the rim line portion is greater than 1/4 and equal to or less than 3/4.

5. The cutter wheel of claim 3, wherein the ratio of the length of the area occupied by the plurality of grooves to the entire circumference of the rim line portion is equal to or less than 1/4.

6. The cutter wheel according to any of claims 3 to 5, wherein the pitch at which said plurality of grooves are formed corresponds to a wheel diameter of 1 to 20mm of 20 to 200 μm.

7. The cutter wheel according to any of claims 3 to 5, wherein the depth of the plurality of grooves corresponds to a wheel diameter of 1 to 20mm of 2 to 200 μm.

8. A cutter wheel according to any of claims 3 to 5, wherein the cutter wheel is integrally formed with a shaft passing through the wheel.

9. The cutter wheel according to any of claims 3 to 5, wherein at least one groove area is formed in the edge line portion; the grooves have different depths such that the depth of the grooves is deeper at a center portion of the groove region than at end portions of the groove region.

10. A scribing installation comprising a mechanism for moving a tool bit in an X-direction and/or a Y-direction relative to a table in which brittle material is placed,

wherein the cutter head is provided with a cutter wheel according to any one of claims 3-9.

11. A method for separating a bonded glass substrate comprising a first scribing step, a second scribing step and a breaking step, wherein the glass cutter wheel of any one of claims 3 to 9 is used in the second scribing step.

12. A method for separating a bonded glass substrate, comprising a first scribing step, a first breaking step, a second scribing step and a second breaking step, wherein the glass cutter wheel according to any one of claims 3 to 9 is used in the second scribing step.

13. A cutter wheel manufacturing apparatus for manufacturing the cutter wheel according to any one of claims 3 to 9, comprising: at least one rotatably supported disc-shaped abrasive member; and a grinding mechanism supporting at least one cutter wheel to be ground and advancing/retracting the cutter wheel toward/from the grinding member,

wherein the grinding mechanism is provided with a rotating device used for moving the part of the knife flywheel to be ground by the grinding piece.

14. The cutter wheel manufacturing apparatus of claim 13, further comprising: advancing/retracting means for advancing/retracting the cutter wheel to/from the grinding member; and control means for controlling the advancing/retracting means and the rotating means.

15. The apparatus of claim 14 wherein the control means controls the rotating means in accordance with the number of divisions and the number of zones over the entire circumference of the rimline portion of the cutter wheel to form the grooves in the rimline portion at desired locations.