HK1058741B - Flexible printed wiring board - Google Patents
Flexible printed wiring board Download PDFInfo
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- HK1058741B HK1058741B HK04101491.8A HK04101491A HK1058741B HK 1058741 B HK1058741 B HK 1058741B HK 04101491 A HK04101491 A HK 04101491A HK 1058741 B HK1058741 B HK 1058741B
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Description
Technical Field
The present invention relates to a flexible printed circuit board having a polyimide resin layer formed on a copper foil, and more particularly to a flexible printed circuit board having a good bonding strength between a copper foil and a polyimide resin layer, having a good flatness, and capable of performing fine patterning of wiring.
Technical Field
A flexible printed wiring board in which an insulating polyimide resin layer is directly provided on a copper foil without a bonding layer is produced by applying a polyamic acid varnish obtained by addition polymerization of an aromatic acid dianhydride and an aromatic diamine in a solvent such as dimethylacetamide to a copper foil having a roughened surface so as to obtain a high bonding strength, drying the polyamic acid varnish to form a polyamic acid layer, and imidizing the polyamic acid layer by heating to form a polyimide resin layer on the copper foil.
Here, as the copper foil, rolled copper foil and electrolytic copper foil are mainly cited, but from the viewpoint of being difficult to curl (カ - ル), electrolytic copper foil is widely used. Here, in order to improve the adhesion between the electrolytic copper foil and the polyimide resin layer, the surface of the electrolytic copper foil (untreated copper foil) produced by an electrolytic foil production apparatus is roughened to deposit fine particulate copper. Further, the surface of the electrolytic copper foil is usually roughened and then subjected to rust prevention treatment.
However, in the printed wiring board processed from the flexible printed wiring board as described above, further fine patterning of the wiring is required for the printed wiring board for mounting semiconductor devices, various electronic chip components, and the like, in accordance with the development of a small-scale integration technology for mounting components. However, the electrolytic copper foil suffers from deterioration of the etching property of the copper foil due to roughening treatment, and it is difficult to perform etching with a high aspect ratio (high アスペクト ratio), and there is a problem that edge sagging occurs during etching, and thus sufficiently fine patterning cannot be performed.
Therefore, in order to meet the demand for fine patterning, a method of suppressing the occurrence of edge collapse during etching while securing the insulation between patterns and a method of making the degree of roughening treatment of the electrolytic copper foil low in profile (reducing the roughness) are considered for a flexible printed circuit board for a printed wiring board. For example, in Japanese unexamined patent publication Hei 3-30938, the arithmetic average surface roughness Ra (roughness measured by a stylus type roughness tester according to JIS B0601) of an electrolytic copper foil is reduced to about 0.3 to 0.8. mu.m.
However, the method of reducing the roughening degree of the electrolytic copper foil has a problem of reducing the adhesion strength between the electrolytic copper foil and the insulating polyimide layer. Therefore, in recent years, it has been difficult to maintain a desired adhesive strength for the demand of high-level fine pattern processing. In the processing stage, a defect such as peeling of the wiring from the polyimide layer occurs.
The present invention solves the above problems of the prior art, and provides a flexible printed circuit board in which a polyimide resin layer derived from polyamic acid is formed on a copper foil, which has excellent adhesion strength between the copper foil and the polyimide layer, has good flatness, and can realize fine patterning of wiring.
Disclosure of the invention
According to the present invention, it has been found that when an electrolytic copper foil which is hard to curl is used as a copper foil and a zinc-based metal layer is provided on the electrolytic copper foil instead of roughening the electrolytic copper foil, the etching characteristics of the copper foil can be improved and the adhesive strength between the electrolytic copper foil and a polyimide-based resin layer can be improved, and the present invention has been completed.
Namely, the present invention provides an electrolytic copper foil without surface roughening treatment and a metallic zinc alloy containing 0.25 to 0.40mg/dm in terms of metallic zinc2The zinc-based metal layer having a treatment amount of 0.03 to 0.05mg/dm in terms of metallic chromium2And a polyimide resin layer formed by imidizing a polyamic acid layer, the polyimide resin layer being provided on the chromium oxide layer.
Best mode for carrying out the invention
The present invention is described in detail below.
A flexible printed wiring board of the present invention comprises an electrolytic copper foil, a zinc-based metal layer (Zn-based metal layer) provided on the electrolytic copper foil, and a polyimide-based resin layer provided on the zinc-based metal layer.
The electrolytic copper foil used in the present invention is formed by an electroplating method, and is a copper foil which is less likely to curl than a rolled copper foil, and therefore can suppress curling of the flexible printed circuit board. The electrolytic copper foil is preferably one which is not subjected to roughening treatment, specifically, one having an arithmetic average surface roughness Ra (roughness measured by a stylus type roughness tester conforming to JIS B0601) of less than 0.03 μm.
The thickness of the electrolytic copper foil varies depending on the purpose of use of the flexible printed wiring board, but from the viewpoint of fine patterning of the wiring, the electrolytic copper foil is preferably as thin as possible, and is usually 3 to 35 μm, preferably 3 to 18 μm, and more preferably 3 to 12 μm.
The zinc-based metal layer provided on the electrolytic copper foil is a layer for improving the adhesive strength between the polyimide-based resin layer and the electrolytic copper foil. Such a zinc-based metal layer is a layer containing metallic zinc or a zinc compound (for example, zinc oxide or zinc hydroxide), and can be formed by an electroplating method, an electroless plating method, a vapor deposition method, a sputtering method, or the like. Examples of the plating bath include a zinc sulfate plating bath, a zinc chloride plating bath, a zinc cyanide plating bath, and a zinc pyrophosphate plating bath. Among them, a zinc sulfate plating bath which is inexpensive to form can be preferably used, and the plating conditions described in Japanese patent publication No. Sho 61-33906, column 4, line 39 to column 5, line 2 can be adopted.
When the amount of treatment (amount of adhesion) of the zinc-based metal layer is too small, the adhesive strength of the polyimide-based resin layer after heat aging is lowered, and when the amount is too large, the interface between the polyimide-based resin layer and the electrolytic copper foil is damaged by a chemical solution such as an acid used in the processing step, and the adhesive strength is lowered, so that the amount is at least 0.25 to 0.40mg/dm in terms of metallic zinc2Preferably 0.26 to 0.34mg/dm2。
In the flexible printed wiring board of the present invention, a chromium oxide layer (Cr) is further provided on the zinc-based metal layer between the zinc-based metal layer and the polyimide resin layer2O3Layer) is good. This can further improve the adhesion strength between the polyimide resin layer and the electrolytic copper foil and prevent the electrolytic copper foil from rusting. The chromium oxide layer is a layer containing chromium oxide and can be formed by a general chromate treatment (Japanese patent publication No. 61-33906, column 5, lines 17 to 38).
When the amount of chromium oxide layer to be treated (amount of chromium oxide to be adhered) is too large, the chromium oxide layer is excessively treated with a polyimide resin layerThe bonding strength of (2) is lowered, and it is usually preferably 0.001 to 0.1mg/dm in terms of chromium metal2Preferably 0.005 to 0.08mg/dm2More preferably 0.03 to 0.05mg/dm2。
The polyimide resin layer of the flexible printed wiring board of the present invention is a layer formed of a heat-resistant resin such as polyimide, polyamideimide, polybenzimidazole, polyesterimide (ポリイミドエステル), polyetherimide, or the like, but is not a layer in which a polyimide resin film is laminated through an adhesive layer, but a layer formed by forming a polyamic acid varnish, which is a polyimide precursor, on a zinc metal layer or a chromium oxide layer on an electrolytic copper foil by a conventional method, and heating to imidize the film.
The linear expansion coefficient of the polyimide resin layer must be 10 to 30 x 10-6(1/K), preferably 18 to 28X 10-6(1/K). Thus, the linear expansion coefficient of the polyimide resin layer can be brought close to the range of the linear expansion coefficient of the electrolytic copper foil, and the occurrence of curling of the flexible printed wiring board can be suppressed. In addition, the polyimide resin layer must have a softening point at the imidization temperature (usually 300 to 400 ℃) when the polyamic acid varnish is formed into a film and imidized. This is presumed to have an effect of relaxing the residual stress generated during the film formation of the polyamic acid.
Here, the "linear expansion coefficient" and the "softening point" of the polyimide resin layer in the present invention can be measured by using a thermomechanical analyzer (TMA, manufactured by the fine electronics industry). As a specific example of the measurement conditions, a polyimide film having a thickness of 20 μm/a width of 4 mm/a length of 20mm was used as a sample, and TMA curve was measured by a 5g load-draw method at a temperature range of 80 ℃ to 400 ℃ at a temperature rise rate of 5 ℃/min.
In the present invention, "softening point" can be defined as: an intersection point of a straight line extending from a straight line portion visible on the low temperature side to the high temperature side and an extension line extending from a tangent line of a portion where the displacement rate increases due to softening to the low temperature side (method for determining the penetration temperature according to JIS K7196).
In the present invention, the order of obtaining 10 to 30X 10-8Specific examples of the polyimide resin layer having a linear expansion coefficient of (1/K) and a softening point at an imidization temperature include a method of selecting and adjusting the type and the ratio of an aromatic acid dianhydride component and an aromatic diamine component of a polyamic acid constituting a polyamic acid in a polyamic acid varnish (a mixture containing a polyamic acid obtained by addition polymerization of an aromatic diamine and an aromatic acid dianhydride in a solution state) used for forming a polyimide resin layer.
As the aromatic acid dianhydride component, conventionally known aromatic acid dianhydrides can be used, and examples thereof include pyromellitic dianhydride (PMDA), 3, 4, 3 ', 4' -biphenyltetracarboxylic dianhydride (BPDA), 9, 4, 9 ', 4' -benzophenonetetracarboxylic dianhydride (BTDA), 9, 4, 3 ', 4' -diphenylsulfonetetracarboxylic dianhydride (DSDA), and the like.
As the aromatic diamine component, conventionally known aromatic diamines can be used, and examples thereof include 4, 4-diaminodiphenyl ether, p-phenylenediamine, 4 '-diaminobenzanilide, 4' -bis (p-aminophenoxy) diphenyl sulfone, and 2, 2-bis [4- (4-aminophenoxy) phenyl ] propane.
Preferred combinations of the aromatic acid dianhydride component and the aromatic diamine component include a combination of an aromatic acid dianhydride component containing at least 80 mol% of biphenyltetracarboxylic dianhydride and an aromatic diamine component containing at least 50 mol% of p-phenylenediamine.
The molar ratio of the aromatic acid dianhydride component and the aromatic diamine component constituting the polyamic acid may be equal to each other, but the aromatic acid dianhydride component may be in excess or the aromatic acid diamine component may be in excess. The excess range is preferably within 5 mol%. If any of the components is used in excess of the above range, the mechanical strength of the resulting polyimide resin layer may be reduced. The most preferable molar ratio is in the range of (1.00 to 1.03): (1.00) the aromatic acid dianhydride component to the aromatic diamine component.
Further, as the solvent used for the synthesis of the polyamic acid, a conventionally known solvent can be used, and N-methyl-2-pyrrolidone is preferably used. The amount of the solvent used is not particularly limited.
It is preferable to further add an imidazolyl-diaminoazine to the polyamic acid varnish. This can further improve the adhesive strength of the polyimide resin layer.
Examples of the imidazolyl-diaminoazines that can be used in the present invention include compounds represented by formula (1).
(wherein A is represented by the formula (1a), (1b) or (1c)
An imidazolyl group is shown. R1Is an alkylene group, and m is 0 or 1. R2Is an alkyl group, n is 0, 1 or 2. R3And R4Is alkylene, p and q are each 0 or 1. B is an azine radical, a diazine radical or a triazine radical. )
Further, in the imidazolyl-diaminoazine of the formula (1), when m is 0, R is not present1And the imidazole ring is directly bonded to an azine radical, a diazine radical or a triazine radical. As R when m is 11Examples of the alkylene group in (b) include a methylene group, an ethylene group, and a propylene group.
When n is 0, R is absent2The alkyl group and the hydrogen atom of (2) are bonded to the imidazole ring. As R when n is 12Examples of the alkyl group of (b) include a methyl group and an ethyl group. When n is 2, 2R2Radicals bound to imidazole rings as respective R2Examples of the alkyl group of (b) include methyl and ethyl. Further, R2If necessary, the imidazole ring may be bonded directly to the nitrogen atom of the imidazole ring.
When p is 0, R is absent3With amino groups directly bound to azine, diazine or triazine residues, as R when p is 13Examples of the alkylene group include a methylene group and an ethylene group.
When q is 0, R is absent4Is directly bonded to an azine radical, diazine radical or triazine radical, as R when q is 14Examples of the alkylene group include a methylene group and an ethylene group.
B is an azine radical, a diazine radical or a triazine radical. Among them, diamines having a triazine residue are preferable from the viewpoint of easy synthesis and easy industrial availability.
Preferred specific examples of the imidazolyl-diaminoazines of the formula (1) include those having p and q both equal to 0 or less.
2, 4-diamino-6- [2- (2-methyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [2- (2-ethyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [1- (2-undecyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [2- (2-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [2- (1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6-2-ethyl-4-imidazolyl) -s-triazine;
2, 4-diamino-6- [2- (4-methyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- (2-ethyl-5-methyl-4-imidazolyl) -s-triazine;
2, 4-diamino-6- (4-ethyl-2-methyl-1-imidazolyl) -s-triazine;
2, 4-diamino-6- [3- (2-methyl-1-imidazolyl) propyl ] -s-triazine;
2, 4-diamino-6- [4- (2-imidazolyl) butyl ] -s-triazine;
2, 4-diamino-6- [2- (2-methyl-1-imidazolyl) propyl ] -s-triazine;
2, 4-diamino-6- [ 1-methyl-2- (2-methyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [2- (2, 5-dimethyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [2- (2, 4-dimethyl-1-imidazolyl) ethyl ] -s-triazine;
or
2, 4-diamino-6- [2- (2-ethyl-4-methyl-1-imidazolyl) ethyl ] -s-triazine.
Among these, the following compounds are preferred.
2, 4-diamino-6- [2- (2-ethyl-4-methyl-1-imidazolyl) ethyl ] -s-triazine;
2, 4-diamino-6- [2- (2-methyl-1-imidazolyl) ethyl ] -s-triazine; or
2, 4-diamino-6- [1- (2-undecyl-1-imidazolyl) ethyl ] -s-triazine.
The amount of the imidazolyl-diaminoazine group of the formula (1) blended in the polyamic acid varnish composition is preferably 0.1 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the polyamic acid as a solid component, because the adhesive strength of the polyimide insulating layer is insufficient when the amount is too small or too large, and the mechanical strength and heat resistance are lowered when the amount is too large.
The polyamic acid varnish used in the present invention may be blended with conventionally known additives as needed.
The thickness of the polyimide resin layer constituting the present invention is not particularly limited, and is usually 10 to 50 μm.
The flexible printed wiring board of the present invention can be manufactured as described below. First, an aromatic diamine component and an aromatic acid dianhydride component are addition-polymerized in a solvent. The conditions for addition polymerization can be set appropriately according to the conditions for addition polymerization of polyamic acid which have been carried out in the past. Specifically, first, an aromatic diamine component is dissolved in a solvent (for example, N-methyl-2-pyrrolidone) under heating, and then, in an inert atmosphere such as nitrogen, an aromatic acid dianhydride is slowly added thereto at 0 to 90 ℃, preferably 5 to 50 ℃, to conduct addition polymerization for several hours. Thus, a polyamic acid solution can be obtained. The imidazolyl-diaminoazine group of the formula (1) is added to the solution, and sufficiently mixed to obtain a polyamic acid varnish.
Then, the polyamic acid varnish is applied to the electrolytic copper foil using a general-purpose coater or the like, and dried to form a polyamic acid layer as a polyimide precursor layer. In order to prevent the occurrence of bubbles during imidization in the subsequent step, the drying is preferably carried out so that the residual volatilization amount (the content of "undried solvent and water produced by imidization") in the polyamic acid layer is 70% or less.
The obtained polyamic acid layer is heated to 300 to 400 ℃ in an inert atmosphere (for example, nitrogen atmosphere) to perform imidization, thereby forming a polyimide resin layer. Thus, the flexible printed circuit board of the present invention was prepared.
In the flexible printed wiring board thus obtained, the adhesion strength between the electrolytic copper foil and the polyimide resin layer is good. And substantially no curling occurs before and after the electrolytic copper foil is etched. Further, since there is an imidazole residue having an anticorrosive effect, corrosion and discoloration do not occur on the surface of the electrolytic copper foil (polyimide-based resin layer forming surface), and electromigration due to copper ions does not occur even when a flexible printed wiring board is used as a wiring board.
Examples
The present invention will be described in detail below.
Examples 1 to 5 and comparative examples 1 to 4
In a 5-liter reactor having a temperature control function, 83.3g (0.77 mol) of p-phenylenediamine (PDA, manufactured by Dai Seisaku Kogyo Co., Ltd.) and 46.0g (0.23 mol) of 4, 4' -diaminodiphenyl ether (DPE, manufactured by Hill Seisakusho Co., Ltd.) were dissolved in about 3kg of N-methyl-2-pyrrolidone (NMP, manufactured by Mitsubishi chemical Co., Ltd.) as a solvent under a nitrogen atmosphere and maintained at 50 ℃. Then, 3, 4, 3 ', 4' -biphenyltetracarboxylic dianhydride (BPDA, Mitsubishi chemical) 297.1g (1.01 mol) was slowly added thereto and reacted for 3 hours, and then the reaction mixture was cooled to room temperature to obtain a polyamic acid having a solid content of about 14% and a viscosity of 15Pa · S (25 ℃).
To the obtained polyamic acid solution was added 21.3g (5 parts by weight based on 100 parts by weight of polyamic acid) of 2, 4-diamino-6- [2- (2-methyl-1-imidazolyl) ethyl ] -s-triazine as an imidazolyl-diaminoazine group, and the mixture was dissolved to obtain a polyamic acid varnish.
Then, electrolytic copper foils (WS foil, M-plane surface roughness Ra of 0.23 μ M, Rz of 1.15 μ M (measured by a stylus roughness tester conforming to JIS B0601 standard)) having a thickness of 12 μ M and not subjected to roughening treatment manufactured by kogawa サ - キットフォイル (circuit foil) were subjected to surface treatment, and electrolytic copper foils a to I having different surface treatments shown in table 1 (here, electrolytic copper foils a to G were copper foils in which a zinc-based metal layer was provided on a copper foil surface not subjected to roughening treatment in the amount of metal zinc shown in the table, and a chromium oxide layer was provided on a zinc-based metal layer in the amount of metal chromium shown in the table) were prepared.
First, prepared polyamic acid varnish was applied to each of these electrolytic copper foils, and was dried stepwise so as not to generate bubbles, and then imidized at 350 ℃ (30 minutes) in a nitrogen atmosphere to obtain a flexible printed wiring board having a 25 μm-thick polyimide resin layer (table 2).
The peel strength (N/cm) of the polyimide resin of the flexible printed wiring board obtained was measured as the adhesion strength at 23 ℃ in accordance with JIS C6471 (peeling in the direction of 90 degrees with a width of 1.59 mm). The obtained flexible printed wiring board was subjected to a heat resistance test of heat aging at 150 ℃ for 240 hours, and then the same peel strength was measured, and the rate of decrease in adhesive strength after the heat resistance test was determined from the difference in peel strength between before and after heat aging. Similarly, the obtained flexible printed wiring board was subjected to an acid resistance test by immersing in 18% hydrochloric acid for 1 hour, and then the peel strength was measured in the same manner, and the decrease rate of the adhesive strength after the acid resistance test was determined from the difference between the peel strengths before and after the acid resistance test. The results are shown in Table 2.
Further, the curl evaluation of the flexible printed circuit board was performed as described below. That is, the electrolytic copper foil was etched and removed from the entire surface of the flexible printed wiring board obtained by using a commercially available copper chloride etching solution, thereby obtaining a polyimide resin film.
The polyimide resin film and the flexible printed wiring board before etching were cut into a 10cm square, the test pieces were placed on a flat plate at 23 ℃ and 60% RH, and the average value of the distances between the flat plate and the four corners was calculated. When the average value is 5mm or less, the value is evaluated as almost flat (approximately フラット). The results are shown in Table 2.
Table 1
| Kind of electrolytic copper foil | Presence or absence of roughening treatment | Mg/dm of Zn-based metal layer2 | Cr2O3Layer mg/dm2 |
| ABCDEFGHI | None, none | 0.2010.2100.2590.2600.3050.3400.4210.310 none | 0.0310.0410.0320.0450.0440.0500.040 none or none |
Table 2
| Electrolytic copper foil (table 1) | Peel strength (N/cm) | Curl (etching) | Bond Strength decrease (%) | ||
| Front side | Rear end | After heat resistance test | After acid resistance test | ||
| Example 1C 2D 3E 4F 5H | 8.68.28.28.37.9 | Substantially flat, substantially straight, and substantially straight | Substantially flat, substantially straight, and substantially straight | -1-3-1-3-5 | -2-2+1-2-7 |
| Comparative example 1A 2B 3G 4I | 8.28.37.5 | Substantially straight, substantially straight and substantially straight | Substantially straight, substantially straight and substantially straight | -44-47-4 | -3-3-32 |
| (partial exfoliation occurred at the imidization stage) | |||||
As can be seen from the results in Table 2, the zinc-based metal layer was treated at a rate of 0.25 to 0.40mg/dm2The flexible printed wiring boards of examples 1 to 5 were excellent in adhesive strength, free from curling, and excellent in heat resistance and acid resistance. In particular, the flexible printed wiring boards of examples 1 to 4 using the electrodeposited copper foils with a further chromium oxide layer were improved in adhesive strength by providing a further chromium oxide layer, as compared with the flexible printed wiring board of example 5 using the electrodeposited copper foil without a chromium oxide layer on the zinc-based metal layer.
Furthermore, it can be seen from the results of comparative examples 1 to 3 that the zinc-based metal layer was treated at a dose of 0.25 to 0.4mg/dm2In the range of (3), the heat resistance is lowered.
Further, the flexible printed wiring board of comparative example 4, which did not have a zinc-based metal layer, was peeled off in the imidization step, and was not practically usable.
Industrial applicability of the invention
The present invention provides a flexible printed circuit board in which a polyimide resin layer derived from polyamic acid is formed on a copper foil, and provides a flexible printed circuit board which has excellent bonding strength between the copper foil and the polyimide layer, has good flatness, and can realize fine patterning of wiring.
Claims (3)
1. A flexible printed wiring board comprising an electrolytic copper foil without surface roughening treatment and a zinc metal in an amount of 0.25 to 0.40mg/dm in terms of zinc metal2The zinc-based metal layer having a treatment amount of 0.03 to 0.05mg/dm in terms of metallic chromium2A chromium oxide layer formed on the zinc-based metal layer and a polyimide-based resin layer formed on the chromium oxide layer and imidized with a polyamic acid layer,
and the polyimide resin layer has a thickness of 10 to 30 x 10-6Coefficient of linear expansion of (D), unit thereofIs 1/K, and exhibits a softening point in a temperature range of 300 to 400 ℃,
the electrolytic copper foil without surface roughening has an arithmetic average surface roughness Ra of less than 0.3 μm.
2. The flexible printed wiring board of claim 1, wherein the polyamic acid layer is obtained by forming a film of a polyamic acid varnish obtained by polymerizing an aromatic acid dianhydride component containing at least 80 mol% of biphenyltetracarboxylic acid dianhydride and an aromatic diamine component containing at least 50 mol% of p-phenylenediamine at a molar ratio of 1.00 to 1.03: 1.00.
3. The flexible printed wiring board of claim 2, wherein the polyamic acid varnish contains imidazolyl-diaminoazines.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12899/2001 | 2001-01-22 | ||
| JP2001012899A JP3768104B2 (en) | 2001-01-22 | 2001-01-22 | Flexible printed circuit board |
| PCT/JP2002/000033 WO2002058442A1 (en) | 2001-01-22 | 2002-01-09 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1058741A1 HK1058741A1 (en) | 2004-05-28 |
| HK1058741B true HK1058741B (en) | 2007-02-23 |
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