HK1058172B - 電子活性底漆層在材料熱型中的應用 - Google Patents
電子活性底漆層在材料熱型中的應用 Download PDFInfo
- Publication number
- HK1058172B HK1058172B HK03109443.1A HK03109443A HK1058172B HK 1058172 B HK1058172 B HK 1058172B HK 03109443 A HK03109443 A HK 03109443A HK 1058172 B HK1058172 B HK 1058172B
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- HK
- Hong Kong
- Prior art keywords
- receptor
- active
- transfer
- layer
- materials
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/662,845 | 2000-09-15 | ||
| US09/662,845 US6358664B1 (en) | 2000-09-15 | 2000-09-15 | Electronically active primer layers for thermal patterning of materials for electronic devices |
| PCT/US2001/002017 WO2002022372A1 (en) | 2000-09-15 | 2001-01-19 | Use of electronically active primer layers in thermal patterning of materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1058172A1 HK1058172A1 (zh) | 2004-05-07 |
| HK1058172B true HK1058172B (zh) | 2007-03-09 |
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