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GB903476A - Electrical semiconductor device - Google Patents

Electrical semiconductor device

Info

Publication number
GB903476A
GB903476A GB10593/59A GB1059359A GB903476A GB 903476 A GB903476 A GB 903476A GB 10593/59 A GB10593/59 A GB 10593/59A GB 1059359 A GB1059359 A GB 1059359A GB 903476 A GB903476 A GB 903476A
Authority
GB
United Kingdom
Prior art keywords
welding
wire
plate
ball
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB10593/59A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB903476A publication Critical patent/GB903476A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07141—
    • H10W72/07532—
    • H10W72/536—
    • H10W72/552—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/923—
    • H10W72/952—

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
GB10593/59A 1958-03-29 1959-03-26 Electrical semiconductor device Expired GB903476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEST13591A DE1190580B (de) 1958-03-29 1958-03-29 In ein Gehaeuse eingebauter Hochleistungsgleichrichter

Publications (1)

Publication Number Publication Date
GB903476A true GB903476A (en) 1962-08-15

Family

ID=7456090

Family Applications (1)

Application Number Title Priority Date Filing Date
GB10593/59A Expired GB903476A (en) 1958-03-29 1959-03-26 Electrical semiconductor device

Country Status (3)

Country Link
BE (1) BE577149R (de)
DE (1) DE1190580B (de)
GB (1) GB903476A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2362510B (en) * 1999-12-20 2003-07-02 Lucent Technologies Inc Wire bonding method for copper interconnects in semiconductor devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19722507B4 (de) * 1997-05-30 2007-06-14 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrtrisch leitend mit einer integrierten Schaltung verbundenen Litze integrierte Schaltung mit einem Anschluss und Drehzahlsensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2362510B (en) * 1999-12-20 2003-07-02 Lucent Technologies Inc Wire bonding method for copper interconnects in semiconductor devices
US6790757B1 (en) 1999-12-20 2004-09-14 Agere Systems Inc. Wire bonding method for copper interconnects in semiconductor devices

Also Published As

Publication number Publication date
DE1190580B (de) 1965-04-08
BE577149R (fr) 1959-09-28

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