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GB902219A - Improvements in or relating to mounting arrangements for semi-conductor devices - Google Patents

Improvements in or relating to mounting arrangements for semi-conductor devices

Info

Publication number
GB902219A
GB902219A GB15687/60A GB1568760A GB902219A GB 902219 A GB902219 A GB 902219A GB 15687/60 A GB15687/60 A GB 15687/60A GB 1568760 A GB1568760 A GB 1568760A GB 902219 A GB902219 A GB 902219A
Authority
GB
United Kingdom
Prior art keywords
plate
casing
clamping plate
heat sink
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15687/60A
Inventor
Robert Charles Ireson
Jack Church
Derek Ernest Burch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB15687/60A priority Critical patent/GB902219A/en
Publication of GB902219A publication Critical patent/GB902219A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W40/611—
    • H10W40/235—

Landscapes

  • Braking Arrangements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

902,219. Mounting semi-conductor devices. WESTINGHOUSE BRAKE & SIGNAL CO. Ltd. April 27, 1961 [May 4, 1960], No. 15687/60. Class 37. [Also in Group XXV] In a semi-conductor device mounting arrangement a clamping plate as an aperture to receive an upstanding part of the casing of the device and beats on a surface of the casing along a line perpendicular to a line through fixing locations on the plate, whereby a plane end surface of the casing is held against a plane mount to which the clamping plate is fixed. Clamping plate 15 is bowed so as to engage along line 17 with surface 13 of casing 10, and the plate is bolted through holes 18 to a heat sink against which plane surface 12 of the casing is held. Plate 15 is preferably of a spring steel material. The laterally extending portions 19 of the clamping plate are preferably arcuate to distribute the stresses on surface 13 evenly, and are bent towards the heat sink but in the unstressed condition of the plate do not extend beyond surface 12. In a modification (Figs. 4 and 5, not shown), the clamping plate has a pair of laterally extending lugs for clamping it to the heat sink. Thermal contact between surface 12 and the heat sink may be improved by the use of a silicone grease therebetween.
GB15687/60A 1960-05-04 1960-05-04 Improvements in or relating to mounting arrangements for semi-conductor devices Expired GB902219A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB15687/60A GB902219A (en) 1960-05-04 1960-05-04 Improvements in or relating to mounting arrangements for semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB15687/60A GB902219A (en) 1960-05-04 1960-05-04 Improvements in or relating to mounting arrangements for semi-conductor devices

Publications (1)

Publication Number Publication Date
GB902219A true GB902219A (en) 1962-08-01

Family

ID=10063632

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15687/60A Expired GB902219A (en) 1960-05-04 1960-05-04 Improvements in or relating to mounting arrangements for semi-conductor devices

Country Status (1)

Country Link
GB (1) GB902219A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0141990A1 (en) * 1983-09-29 1985-05-22 Siemens Aktiengesellschaft Device for detachably attaching a cooling member to an integrated component
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0141990A1 (en) * 1983-09-29 1985-05-22 Siemens Aktiengesellschaft Device for detachably attaching a cooling member to an integrated component
US4660123A (en) * 1983-09-29 1987-04-21 Siemens Aktiengesellschaft Appliance for releasable fastening of a cooling member to an integrated module
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package

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