GB908677A - Improvements relating to electrical printed circuit assemblies - Google Patents
Improvements relating to electrical printed circuit assembliesInfo
- Publication number
- GB908677A GB908677A GB3974060A GB3974060A GB908677A GB 908677 A GB908677 A GB 908677A GB 3974060 A GB3974060 A GB 3974060A GB 3974060 A GB3974060 A GB 3974060A GB 908677 A GB908677 A GB 908677A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit assemblies
- improvements relating
- backing
- nov
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000712 assembly Effects 0.000 title abstract 2
- 238000000429 assembly Methods 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920000151 polyglycol Polymers 0.000 abstract 1
- 239000010695 polyglycol Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
908,677. Mounting electrical equipment. LICENTIA PATENT - VERWALTUNGS - G.m.b.H. Nov. 18, 1960 [Nov. 19, 1959], No. 39740/60. Class 37. Printed circuit assemblies, in which electrical components are mounted on a backing-plate bearing a printed circuit, or are formed thereon by printed circuit methods, are encased, except for terminal parts, in an envelope comprising a cold-setting low-pressure resin containing a hardener and a flexibilizing agent. A backing- plate 1 carrying resistors, capacitors, transistors 2 or the like interconnected by a printed circuit is enclosed, except for terminal members 3, in an envelope 4 which consists of a cold-setting lowpressure castable resin having an epoxy equivalent of 230 and containing 5 to 12% of an amine hardener and between 1% and 60% of polyglycol as a flexibilizing agent.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEL0034742 | 1959-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB908677A true GB908677A (en) | 1962-10-24 |
Family
ID=7266793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3974060A Expired GB908677A (en) | 1959-11-19 | 1960-11-18 | Improvements relating to electrical printed circuit assemblies |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB908677A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10688916B2 (en) | 2018-05-10 | 2020-06-23 | Dura Operating, Llc | Multiple resin over-mold for printed circuit board electronics and light guide |
| US10939544B2 (en) | 2018-05-10 | 2021-03-02 | Dura Operating, Llc | Multiple resin over-mold for printed circuit board electronics and light guide |
-
1960
- 1960-11-18 GB GB3974060A patent/GB908677A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10688916B2 (en) | 2018-05-10 | 2020-06-23 | Dura Operating, Llc | Multiple resin over-mold for printed circuit board electronics and light guide |
| US10939544B2 (en) | 2018-05-10 | 2021-03-02 | Dura Operating, Llc | Multiple resin over-mold for printed circuit board electronics and light guide |
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