GB859848A - Improvements in or relating to the formation of conductors on insulating supports - Google Patents
Improvements in or relating to the formation of conductors on insulating supportsInfo
- Publication number
- GB859848A GB859848A GB1319356A GB1319356A GB859848A GB 859848 A GB859848 A GB 859848A GB 1319356 A GB1319356 A GB 1319356A GB 1319356 A GB1319356 A GB 1319356A GB 859848 A GB859848 A GB 859848A
- Authority
- GB
- United Kingdom
- Prior art keywords
- powder
- insulating support
- conductors
- layer
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 title abstract 5
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000000843 powder Substances 0.000 abstract 5
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229920001800 Shellac Polymers 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 abstract 1
- 229940113147 shellac Drugs 0.000 abstract 1
- 235000013874 shellac Nutrition 0.000 abstract 1
- 239000004208 shellac Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
859,848. Printed circuits. ELECTRIC & MUSICAL INDUSTRIES Ltd. April 30, 1957 [April 30, 1956], No. 13193/56. Drawings to Specification. Class 93. [Also in Group XXXVI] - A method of forming conductors on an insulating support such as the material sold under the Registered Trade Mark "Paxolin" provided with a thin layer of an adhesive substance such as an elastomeric bonding resin comprises applying to said adhesive substance a thin layer of a finely divided metallic powder, e.g. bronze powder, applying to those areas of said layer of metallic powder between the positions of the required conductors a resist of insulating material such as shellac, wax, gum, or a bituminous compound or mixture which can be applied by silk screen printing, electrolytically depositing a conducting material, e.g. copper, on the exposed areas of the metal powder layer, and subsequently removing the resist and the metal powder thereunder, e.g. by immersion in a bath of solvent such as acetone which also penetrates the powder and softens and removes the adhesive. The insulating support may initially have holes drilled in it so that the inner walls of these holes may be coated in the same way as the surface. After washing, the conductor may be consolidated on the insulating support by heat and presssure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1319356A GB859848A (en) | 1956-04-30 | 1956-04-30 | Improvements in or relating to the formation of conductors on insulating supports |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1319356A GB859848A (en) | 1956-04-30 | 1956-04-30 | Improvements in or relating to the formation of conductors on insulating supports |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB859848A true GB859848A (en) | 1961-01-25 |
Family
ID=10018539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1319356A Expired GB859848A (en) | 1956-04-30 | 1956-04-30 | Improvements in or relating to the formation of conductors on insulating supports |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB859848A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0996319A3 (en) * | 1998-10-19 | 2002-02-20 | Mitsui Mining & Smelting Co., Ltd. | Composite material used in making printed wiring boards |
-
1956
- 1956-04-30 GB GB1319356A patent/GB859848A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0996319A3 (en) * | 1998-10-19 | 2002-02-20 | Mitsui Mining & Smelting Co., Ltd. | Composite material used in making printed wiring boards |
| US6548153B2 (en) | 1998-10-19 | 2003-04-15 | Mitsui Mining & Smelting Co., Ltd. | Composite material used in making printed wiring boards |
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