FR2185915B1 - - Google Patents

Abstract

1427588 Component assemblies COMMISSARIAT A L'ENERGIE ATOMIQUE 14 May 1973 [25 May 1972] 22893/73 Heading H1R In a method of interconnecting microcomponents which avoids the use of multilayer printed circuit boards, conducting studs 62, Fig. 1, are deposited on a substrate 60; a single length of insulated wire 64 is stuck to the substrate, the wire being bared and welded to studs 62 where required; then excess wire is removed, leaving a number of interconnection circuits between sets of studs 62 to which microcomponent terminals are connected. Fig. 6 depicts a substrate 30 of polyimide with a layer 32 of thermo-adhesive material on one surface thereof. Wire 36 having a thermo-adhesive coating is paid out by a feed head 34 having a heating coil 40 thereon for activating the adhesive. In modifications, a plurality of rectangular insulation frames 2, Fig. 5, are attached to the substrate each having grooves 4 in its upper surface. Bared wire portions 22 are secured in the grooves by copper studs 24 which are built up by electrodeposition. The studs may protrude finger-like into the space within the frame, to be connected flip-chip-wise to a micro-component therein (Figs. 4, 8, not shown); alternatively the studs may end flush with the inner periphery of the frame, connection to a micro-component therein being by way of beam leads (Fig. 7, not shown). The substrate may be mounted on a further, more rigid, support to strengthen the assembly; the further support may also act as a heat dissipator. Reference has been directed by the Comptroller to Specification 1,352,557.