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GB831929A - Improvements in or relating to copper plating - Google Patents

Improvements in or relating to copper plating

Info

Publication number
GB831929A
GB831929A GB17404/58A GB1740458A GB831929A GB 831929 A GB831929 A GB 831929A GB 17404/58 A GB17404/58 A GB 17404/58A GB 1740458 A GB1740458 A GB 1740458A GB 831929 A GB831929 A GB 831929A
Authority
GB
United Kingdom
Prior art keywords
copper
sodium
cyanide
plating
sulphonic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB17404/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB831929A publication Critical patent/GB831929A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • C25D3/40Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

831,929. Copper-plating baths. DU PONT DE NEMOURS & CO., F. I. May 30, 1958 [June 20, 1957], No. 17404/58. Class 41. A copper-plating bath contains free alkali cyanide together with small amounts of a water-soluble selenate or selenite, a selenide, and also the alkali metal salt of methylene-bis-α- naphthalene sulphonic acid. In an example, to a solution containing copper cyanide, free sodium or potassium cyanide, sodium or potassium hydroxide or carbonate and a little of the naphthalene sulphonic acid compound, there is added (a) 10 to 250 parts by weight per 10<SP>6</SP> of sodium selenate and (b) 0.01 to 0.1 part of a solution of copper selenoide in KCN. Parts are calculated as by weight of selenium metal contained. Plating preferably proceeds with periodic current reversal, and using a moving cathode. Specification 630,165 and U.S.A. Specifications 2,701,234 and 2,770,587 are referred to.
GB17404/58A 1957-06-20 1958-05-30 Improvements in or relating to copper plating Expired GB831929A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US667015A US2861929A (en) 1957-06-20 1957-06-20 Copper plating with addition agents

Publications (1)

Publication Number Publication Date
GB831929A true GB831929A (en) 1960-04-06

Family

ID=24676459

Family Applications (2)

Application Number Title Priority Date Filing Date
GB6470/57A Expired GB817037A (en) 1957-06-20 1957-02-26 Improvements in process and compositions for the electroposition of copper
GB17404/58A Expired GB831929A (en) 1957-06-20 1958-05-30 Improvements in or relating to copper plating

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB6470/57A Expired GB817037A (en) 1957-06-20 1957-02-26 Improvements in process and compositions for the electroposition of copper

Country Status (4)

Country Link
US (2) US2854389A (en)
DE (2) DE1101087B (en)
FR (2) FR1172733A (en)
GB (2) GB817037A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955992A (en) * 1957-08-08 1960-10-11 Macdermid Inc Bright copper plating process
DE1209843B (en) * 1960-04-16 1966-01-27 Hesse & Cie Cyanidic bright copper bath
US3219560A (en) * 1961-10-12 1965-11-23 Allied Res Products Inc Process and bath for electrolytic copper deposition
DE1195321B (en) * 1962-03-16 1965-06-24 Troponwerke Dinklage & Co Process for the preparation of substituted quinazolone (4) derivatives
US3480524A (en) * 1967-09-21 1969-11-25 Kewanee Oil Co Selenium compound and its use as a brightener in a copper plating bath
US3532610A (en) * 1967-10-27 1970-10-06 Kewanee Oil Co Selenium compounds as brighteners in copper plating baths

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732336A (en) * 1956-01-24 Electroplating composition for copper
US2701234A (en) * 1951-07-11 1955-02-01 Du Pont Addition agent for copper plating
US2770587A (en) * 1956-06-04 1956-11-13 Elechem Corp Bath for plating bright copper

Also Published As

Publication number Publication date
GB817037A (en) 1959-07-22
DE1101087B (en) 1961-03-02
US2854389A (en) 1958-09-30
FR1172733A (en) 1959-02-13
FR73696E (en) 1960-09-05
DE1104282B (en) 1961-04-06
US2861929A (en) 1958-11-25

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