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GB814527A - Improvements in or relating to processes for the production of electrodes on semi-conductor surfaces, and semi-conductor arrangements produced by such processes - Google Patents

Improvements in or relating to processes for the production of electrodes on semi-conductor surfaces, and semi-conductor arrangements produced by such processes

Info

Publication number
GB814527A
GB814527A GB18196/55A GB1819655A GB814527A GB 814527 A GB814527 A GB 814527A GB 18196/55 A GB18196/55 A GB 18196/55A GB 1819655 A GB1819655 A GB 1819655A GB 814527 A GB814527 A GB 814527A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
layer
consist
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18196/55A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Publication of GB814527A publication Critical patent/GB814527A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P14/47—
    • H10W74/43—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
GB18196/55A 1954-09-15 1955-06-23 Improvements in or relating to processes for the production of electrodes on semi-conductor surfaces, and semi-conductor arrangements produced by such processes Expired GB814527A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES40844A DE1044286B (de) 1954-09-15 1954-09-15 Verfahren zum Herstellen einer Halbleiteranordnung, beispielsweise Richtleiter oder Transistor
DES0041996 1954-12-17

Publications (1)

Publication Number Publication Date
GB814527A true GB814527A (en) 1959-06-10

Family

ID=25995175

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18196/55A Expired GB814527A (en) 1954-09-15 1955-06-23 Improvements in or relating to processes for the production of electrodes on semi-conductor surfaces, and semi-conductor arrangements produced by such processes

Country Status (3)

Country Link
DE (2) DE1044286B (de)
FR (1) FR1126109A (de)
GB (1) GB814527A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666913A (en) * 1966-09-14 1972-05-30 Texas Instruments Inc Method of bonding a component lead to a copper etched circuit board lead

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL109817C (de) * 1955-12-02
US3099576A (en) * 1960-06-24 1963-07-30 Clevite Corp Selective gold plating of semiconductor contacts
NL128768C (de) * 1960-12-09
DE1194986B (de) * 1961-07-15 1965-06-16 Siemens Ag Tunneldiode mit teilweise fallender Strom-spannungskennlinie

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2402839A (en) * 1941-03-27 1946-06-25 Bell Telephone Labor Inc Electrical translating device utilizing silicon
US2497770A (en) * 1948-12-29 1950-02-14 Bell Telephone Labor Inc Transistor-microphone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666913A (en) * 1966-09-14 1972-05-30 Texas Instruments Inc Method of bonding a component lead to a copper etched circuit board lead

Also Published As

Publication number Publication date
FR1126109A (fr) 1956-11-15
DE1044286B (de) 1958-11-20
DE1067131B (de) 1959-10-15

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