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GB2593674B - Layer structure comprising a semiconductor package - Google Patents

Layer structure comprising a semiconductor package Download PDF

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Publication number
GB2593674B
GB2593674B GB2004245.3A GB202004245A GB2593674B GB 2593674 B GB2593674 B GB 2593674B GB 202004245 A GB202004245 A GB 202004245A GB 2593674 B GB2593674 B GB 2593674B
Authority
GB
United Kingdom
Prior art keywords
layer structure
semiconductor package
package
semiconductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2004245.3A
Other versions
GB2593674A (en
GB202004245D0 (en
Inventor
John Lynch Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Prevayl Innovations Ltd
Original Assignee
Prevayl Innovations Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prevayl Innovations Ltd filed Critical Prevayl Innovations Ltd
Priority to GB2004245.3A priority Critical patent/GB2593674B/en
Publication of GB202004245D0 publication Critical patent/GB202004245D0/en
Priority to PCT/GB2020/053005 priority patent/WO2021105676A1/en
Priority to US17/772,242 priority patent/US12288736B2/en
Publication of GB2593674A publication Critical patent/GB2593674A/en
Priority to US19/177,284 priority patent/US20250266329A1/en
Application granted granted Critical
Publication of GB2593674B publication Critical patent/GB2593674B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W74/10—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/28—Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/296—Bioelectric electrodes therefor specially adapted for particular uses for electromyography [EMG]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H10W70/458—
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
    • A61B2560/04—Constructional details of apparatus
    • A61B2560/0462—Apparatus with built-in sensors
    • A61B2560/0468—Built-in electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H10W70/411—
    • H10W70/421—
    • H10W70/479—
    • H10W72/07553—
    • H10W72/354—
    • H10W72/537—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W74/121—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Cardiology (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
GB2004245.3A 2019-11-28 2020-03-24 Layer structure comprising a semiconductor package Active GB2593674B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB2004245.3A GB2593674B (en) 2020-03-24 2020-03-24 Layer structure comprising a semiconductor package
PCT/GB2020/053005 WO2021105676A1 (en) 2019-11-28 2020-11-26 Sensor semiconductor package, article comprising the same and manufacturing method thereof
US17/772,242 US12288736B2 (en) 2019-11-28 2020-11-26 Sensor package, article comprising the same and manufacturing method thereof
US19/177,284 US20250266329A1 (en) 2019-11-28 2025-04-11 Sensor semiconductor package, article comprising the same and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2004245.3A GB2593674B (en) 2020-03-24 2020-03-24 Layer structure comprising a semiconductor package

Publications (3)

Publication Number Publication Date
GB202004245D0 GB202004245D0 (en) 2020-05-06
GB2593674A GB2593674A (en) 2021-10-06
GB2593674B true GB2593674B (en) 2025-05-14

Family

ID=70546784

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2004245.3A Active GB2593674B (en) 2019-11-28 2020-03-24 Layer structure comprising a semiconductor package

Country Status (1)

Country Link
GB (1) GB2593674B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2589359A (en) 2019-11-28 2021-06-02 Prevayl Ltd Sensor device, system and wearable article
WO2021105676A1 (en) 2019-11-28 2021-06-03 Prevayl Limited Sensor semiconductor package, article comprising the same and manufacturing method thereof
GB2589568B (en) 2019-11-28 2025-10-10 Prevayl Innovations Ltd Sensor device, system and wearable article
WO2021170994A1 (en) 2020-02-26 2021-09-02 Prevayl Limited Signal measuring apparatus and system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150015249A1 (en) * 2013-07-10 2015-01-15 Infineon Technologies Ag Current Sensor Device
US9138191B1 (en) * 2014-07-09 2015-09-22 Qualcomm Incorporated Integrated circuit module with lead frame micro-needles
US20180295720A1 (en) * 2015-09-24 2018-10-11 Intel Corporation Stretchable electronic assembly
WO2019020550A2 (en) * 2017-07-25 2019-01-31 Smith & Nephew Plc Biocompatible encapsulation and component stress relief for sensor enabled negative pressure wound therapy dressings

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150015249A1 (en) * 2013-07-10 2015-01-15 Infineon Technologies Ag Current Sensor Device
US9138191B1 (en) * 2014-07-09 2015-09-22 Qualcomm Incorporated Integrated circuit module with lead frame micro-needles
US20180295720A1 (en) * 2015-09-24 2018-10-11 Intel Corporation Stretchable electronic assembly
WO2019020550A2 (en) * 2017-07-25 2019-01-31 Smith & Nephew Plc Biocompatible encapsulation and component stress relief for sensor enabled negative pressure wound therapy dressings

Also Published As

Publication number Publication date
GB2593674A (en) 2021-10-06
GB202004245D0 (en) 2020-05-06

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Free format text: REGISTERED BETWEEN 20211007 AND 20211013