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GB202203657D0 - Power semiconductor package - Google Patents

Power semiconductor package

Info

Publication number
GB202203657D0
GB202203657D0 GBGB2203657.8A GB202203657A GB202203657D0 GB 202203657 D0 GB202203657 D0 GB 202203657D0 GB 202203657 A GB202203657 A GB 202203657A GB 202203657 D0 GB202203657 D0 GB 202203657D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor package
power semiconductor
package
power
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GBGB2203657.8A
Other versions
GB2616837A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuzhou CRRC Times Electric Co Ltd
Original Assignee
Zhuzhou CRRC Times Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuzhou CRRC Times Electric Co Ltd filed Critical Zhuzhou CRRC Times Electric Co Ltd
Priority to GB2203657.8A priority Critical patent/GB2616837A/en
Publication of GB202203657D0 publication Critical patent/GB202203657D0/en
Publication of GB2616837A publication Critical patent/GB2616837A/en
Pending legal-status Critical Current

Links

Classifications

    • H10W40/70—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H10W40/037—
    • H10W40/47—
    • H10W70/611—
    • H10W70/644—
    • H10W70/658—
    • H10W72/00—
    • H10W90/00—
    • H10W90/401—
    • H10W90/701—
    • H10W40/255—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2203657.8A 2022-03-16 2022-03-16 Power semiconductor package Pending GB2616837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2203657.8A GB2616837A (en) 2022-03-16 2022-03-16 Power semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2203657.8A GB2616837A (en) 2022-03-16 2022-03-16 Power semiconductor package

Publications (2)

Publication Number Publication Date
GB202203657D0 true GB202203657D0 (en) 2022-04-27
GB2616837A GB2616837A (en) 2023-09-27

Family

ID=81254999

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2203657.8A Pending GB2616837A (en) 2022-03-16 2022-03-16 Power semiconductor package

Country Status (1)

Country Link
GB (1) GB2616837A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117673068A (en) * 2023-12-07 2024-03-08 海信家电集团股份有限公司 Intelligent power module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296764A (en) * 2003-03-27 2004-10-21 Toshiba Corp Stack for flat type semiconductor element and power conversion device using the same
JP6797760B2 (en) * 2017-07-11 2020-12-09 株式会社日立製作所 Semiconductor module and manufacturing method of semiconductor module
US20220238413A1 (en) * 2021-01-22 2022-07-28 Infineon Technologies Ag Double sided cooling module with power transistor submodules
CN113745181B (en) * 2021-09-29 2025-06-27 锦州市圣合科技电子有限责任公司 Double-sided water-cooled power module and combined double-sided water-cooled power module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117673068A (en) * 2023-12-07 2024-03-08 海信家电集团股份有限公司 Intelligent power module

Also Published As

Publication number Publication date
GB2616837A (en) 2023-09-27

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