GB2408147B - Bottom electrode of capacitor of semiconductor device and method of forming the same - Google Patents
Bottom electrode of capacitor of semiconductor device and method of forming the sameInfo
- Publication number
- GB2408147B GB2408147B GB0501339A GB0501339A GB2408147B GB 2408147 B GB2408147 B GB 2408147B GB 0501339 A GB0501339 A GB 0501339A GB 0501339 A GB0501339 A GB 0501339A GB 2408147 B GB2408147 B GB 2408147B
- Authority
- GB
- United Kingdom
- Prior art keywords
- capacitor
- forming
- semiconductor device
- same
- bottom electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/041—Manufacture or treatment of capacitors having no potential barriers
- H10D1/042—Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
- H10B12/0335—Making a connection between the transistor and the capacitor, e.g. plug
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/716—Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0000533A KR100506816B1 (en) | 2003-01-06 | 2003-01-06 | Storage node of a capacitor in a semiconductor device and method for forming the storage node |
| GB0400088A GB2399944B (en) | 2003-01-06 | 2004-01-05 | Bottom electrode of capacitor of semiconductor device and method of forming the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0501339D0 GB0501339D0 (en) | 2005-03-02 |
| GB2408147A GB2408147A (en) | 2005-05-18 |
| GB2408147B true GB2408147B (en) | 2005-12-07 |
Family
ID=34466436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0501339A Expired - Fee Related GB2408147B (en) | 2003-01-06 | 2004-01-05 | Bottom electrode of capacitor of semiconductor device and method of forming the same |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2408147B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020070730A (en) * | 2001-03-03 | 2002-09-11 | 삼성전자 주식회사 | Storage electric terminal layer and method for forming thereof |
| US20030180995A1 (en) * | 2001-12-21 | 2003-09-25 | Woo Sang-Ho | Method for forming charge storage node |
-
2004
- 2004-01-05 GB GB0501339A patent/GB2408147B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020070730A (en) * | 2001-03-03 | 2002-09-11 | 삼성전자 주식회사 | Storage electric terminal layer and method for forming thereof |
| US20030017677A1 (en) * | 2001-03-03 | 2003-01-23 | Yu Young Sub | Storage electrode of a semiconductor memory device and method for fabricating the same |
| US20030180995A1 (en) * | 2001-12-21 | 2003-09-25 | Woo Sang-Ho | Method for forming charge storage node |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2408147A (en) | 2005-05-18 |
| GB0501339D0 (en) | 2005-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100105 |