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GB2408147B - Bottom electrode of capacitor of semiconductor device and method of forming the same - Google Patents

Bottom electrode of capacitor of semiconductor device and method of forming the same

Info

Publication number
GB2408147B
GB2408147B GB0501339A GB0501339A GB2408147B GB 2408147 B GB2408147 B GB 2408147B GB 0501339 A GB0501339 A GB 0501339A GB 0501339 A GB0501339 A GB 0501339A GB 2408147 B GB2408147 B GB 2408147B
Authority
GB
United Kingdom
Prior art keywords
capacitor
forming
semiconductor device
same
bottom electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0501339A
Other versions
GB2408147A (en
GB0501339D0 (en
Inventor
Si-Youn Kim
Ki-Jae Hur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2003-0000533A external-priority patent/KR100506816B1/en
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB0501339D0 publication Critical patent/GB0501339D0/en
Publication of GB2408147A publication Critical patent/GB2408147A/en
Application granted granted Critical
Publication of GB2408147B publication Critical patent/GB2408147B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/01Manufacture or treatment
    • H10D1/041Manufacture or treatment of capacitors having no potential barriers
    • H10D1/042Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/033Making the capacitor or connections thereto the capacitor extending over the transistor
    • H10B12/0335Making a connection between the transistor and the capacitor, e.g. plug
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/315DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
GB0501339A 2003-01-06 2004-01-05 Bottom electrode of capacitor of semiconductor device and method of forming the same Expired - Fee Related GB2408147B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0000533A KR100506816B1 (en) 2003-01-06 2003-01-06 Storage node of a capacitor in a semiconductor device and method for forming the storage node
GB0400088A GB2399944B (en) 2003-01-06 2004-01-05 Bottom electrode of capacitor of semiconductor device and method of forming the same

Publications (3)

Publication Number Publication Date
GB0501339D0 GB0501339D0 (en) 2005-03-02
GB2408147A GB2408147A (en) 2005-05-18
GB2408147B true GB2408147B (en) 2005-12-07

Family

ID=34466436

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0501339A Expired - Fee Related GB2408147B (en) 2003-01-06 2004-01-05 Bottom electrode of capacitor of semiconductor device and method of forming the same

Country Status (1)

Country Link
GB (1) GB2408147B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020070730A (en) * 2001-03-03 2002-09-11 삼성전자 주식회사 Storage electric terminal layer and method for forming thereof
US20030180995A1 (en) * 2001-12-21 2003-09-25 Woo Sang-Ho Method for forming charge storage node

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020070730A (en) * 2001-03-03 2002-09-11 삼성전자 주식회사 Storage electric terminal layer and method for forming thereof
US20030017677A1 (en) * 2001-03-03 2003-01-23 Yu Young Sub Storage electrode of a semiconductor memory device and method for fabricating the same
US20030180995A1 (en) * 2001-12-21 2003-09-25 Woo Sang-Ho Method for forming charge storage node

Also Published As

Publication number Publication date
GB2408147A (en) 2005-05-18
GB0501339D0 (en) 2005-03-02

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100105