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GB2400236B - Semiconductor device having a capacitor and method of fabricating same - Google Patents

Semiconductor device having a capacitor and method of fabricating same

Info

Publication number
GB2400236B
GB2400236B GB0324534A GB0324534A GB2400236B GB 2400236 B GB2400236 B GB 2400236B GB 0324534 A GB0324534 A GB 0324534A GB 0324534 A GB0324534 A GB 0324534A GB 2400236 B GB2400236 B GB 2400236B
Authority
GB
United Kingdom
Prior art keywords
capacitor
semiconductor device
fabricating same
fabricating
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0324534A
Other versions
GB2400236A (en
GB0324534D0 (en
Inventor
Tae-Young Chung
Jae-Goo Lee
Je-Min Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB0324534D0 publication Critical patent/GB0324534D0/en
Publication of GB2400236A publication Critical patent/GB2400236A/en
Application granted granted Critical
Publication of GB2400236B publication Critical patent/GB2400236B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/01Manufacture or treatment
    • H10D1/041Manufacture or treatment of capacitors having no potential barriers
    • H10D1/042Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/033Making the capacitor or connections thereto the capacitor extending over the transistor
    • H10B12/0335Making a connection between the transistor and the capacitor, e.g. plug
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/315DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
    • H10W20/0698

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
GB0324534A 2003-04-03 2003-10-21 Semiconductor device having a capacitor and method of fabricating same Expired - Lifetime GB2400236B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0020989A KR100522544B1 (en) 2003-04-03 2003-04-03 Semiconductor device having a capacitor and method of fabricating same

Publications (3)

Publication Number Publication Date
GB0324534D0 GB0324534D0 (en) 2003-11-26
GB2400236A GB2400236A (en) 2004-10-06
GB2400236B true GB2400236B (en) 2005-09-14

Family

ID=29707778

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0324534A Expired - Lifetime GB2400236B (en) 2003-04-03 2003-10-21 Semiconductor device having a capacitor and method of fabricating same

Country Status (6)

Country Link
JP (1) JP2004311918A (en)
KR (1) KR100522544B1 (en)
CN (1) CN100468738C (en)
DE (1) DE10348200A1 (en)
GB (1) GB2400236B (en)
TW (1) TWI291231B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034198A (en) * 2008-07-28 2010-02-12 Elpida Memory Inc Semiconductor device and method of manufacturing the same
JP5641681B2 (en) 2008-08-08 2014-12-17 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. Manufacturing method of semiconductor device
JP2011061067A (en) 2009-09-11 2011-03-24 Elpida Memory Inc Method for manufacturing semiconductor device and semiconductor device
KR101877878B1 (en) 2012-06-11 2018-07-13 에스케이하이닉스 주식회사 Semiconductor device with multi―layered storage node and method for fabricating the same
US9252205B2 (en) 2014-02-05 2016-02-02 Coversant Intellectual Property Management Inc. DRAM memory device with manufacturable capacitor
CN107845633B (en) * 2017-10-30 2023-05-12 长鑫存储技术有限公司 Memory and its manufacturing method
CN107887388B (en) * 2017-11-27 2023-06-20 长鑫存储技术有限公司 Transistor structure, memory cell, memory array and preparation method thereof
CN114188282B (en) * 2020-09-14 2022-10-28 长鑫存储技术有限公司 Semiconductor device and method for manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6459112B1 (en) * 1999-01-22 2002-10-01 Fujitsu Limited Semiconductor device and process for fabricating the same
US6461911B2 (en) * 2000-05-26 2002-10-08 Samsung Electronics Co., Ltd. Semiconductor memory device and fabricating method thereof
US6482696B2 (en) * 2000-07-10 2002-11-19 Samsung Electronics Co., Ltd. Method of forming storage nodes in a DRAM
US20030001268A1 (en) * 2001-06-30 2003-01-02 Samsung Electronics Co., Ltd. Semiconductor device including cylinder-type capacitor and a manufacturing method thereof
GB2386471A (en) * 2001-12-11 2003-09-17 Samsung Electronics Co Ltd One-cylinder stack capacitor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6459112B1 (en) * 1999-01-22 2002-10-01 Fujitsu Limited Semiconductor device and process for fabricating the same
US6461911B2 (en) * 2000-05-26 2002-10-08 Samsung Electronics Co., Ltd. Semiconductor memory device and fabricating method thereof
US6482696B2 (en) * 2000-07-10 2002-11-19 Samsung Electronics Co., Ltd. Method of forming storage nodes in a DRAM
US20030001268A1 (en) * 2001-06-30 2003-01-02 Samsung Electronics Co., Ltd. Semiconductor device including cylinder-type capacitor and a manufacturing method thereof
GB2386471A (en) * 2001-12-11 2003-09-17 Samsung Electronics Co Ltd One-cylinder stack capacitor

Also Published As

Publication number Publication date
GB2400236A (en) 2004-10-06
KR20040086649A (en) 2004-10-12
GB0324534D0 (en) 2003-11-26
DE10348200A1 (en) 2004-11-04
JP2004311918A (en) 2004-11-04
CN1536669A (en) 2004-10-13
TW200421609A (en) 2004-10-16
CN100468738C (en) 2009-03-11
KR100522544B1 (en) 2005-10-19
TWI291231B (en) 2007-12-11

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20231020