[go: up one dir, main page]

GB2465591B - Method and device for separating sliced wafers - Google Patents

Method and device for separating sliced wafers

Info

Publication number
GB2465591B
GB2465591B GB0821357A GB0821357A GB2465591B GB 2465591 B GB2465591 B GB 2465591B GB 0821357 A GB0821357 A GB 0821357A GB 0821357 A GB0821357 A GB 0821357A GB 2465591 B GB2465591 B GB 2465591B
Authority
GB
United Kingdom
Prior art keywords
sliced wafers
separating sliced
separating
wafers
sliced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0821357A
Other versions
GB0821357D0 (en
GB2465591A (en
Inventor
Hilel Richman
Oded Hamburger
Ariel Hildeshem
Eyal Shpilberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CoreFlow Ltd
Original Assignee
CoreFlow Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CoreFlow Ltd filed Critical CoreFlow Ltd
Priority to GB0821357A priority Critical patent/GB2465591B/en
Publication of GB0821357D0 publication Critical patent/GB0821357D0/en
Priority to EP09827257A priority patent/EP2358618A1/en
Priority to CN2009801550928A priority patent/CN102292275A/en
Priority to KR1020117012769A priority patent/KR20110086722A/en
Priority to PCT/IL2009/001040 priority patent/WO2010058388A1/en
Publication of GB2465591A publication Critical patent/GB2465591A/en
Application granted granted Critical
Publication of GB2465591B publication Critical patent/GB2465591B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H10P72/0416—
    • H10P72/3308—
    • H10P72/7602—
    • H10P72/78—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB0821357A 2008-11-21 2008-11-21 Method and device for separating sliced wafers Expired - Fee Related GB2465591B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB0821357A GB2465591B (en) 2008-11-21 2008-11-21 Method and device for separating sliced wafers
EP09827257A EP2358618A1 (en) 2008-11-21 2009-11-05 Method and device for separating sliced wafers
CN2009801550928A CN102292275A (en) 2008-11-21 2009-11-05 Method and device for separating sliced wafers
KR1020117012769A KR20110086722A (en) 2008-11-21 2009-11-05 Method and apparatus for separating sliced wafers
PCT/IL2009/001040 WO2010058388A1 (en) 2008-11-21 2009-11-05 Method and device for separating sliced wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0821357A GB2465591B (en) 2008-11-21 2008-11-21 Method and device for separating sliced wafers

Publications (3)

Publication Number Publication Date
GB0821357D0 GB0821357D0 (en) 2008-12-31
GB2465591A GB2465591A (en) 2010-05-26
GB2465591B true GB2465591B (en) 2011-12-07

Family

ID=40230670

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0821357A Expired - Fee Related GB2465591B (en) 2008-11-21 2008-11-21 Method and device for separating sliced wafers

Country Status (1)

Country Link
GB (1) GB2465591B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5632897B2 (en) * 2012-11-09 2014-11-26 パナソニック株式会社 Wafer peeling apparatus and wafer peeling method
JP5849201B2 (en) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 Uncut portion removal device
WO2020197544A1 (en) * 2019-03-25 2020-10-01 Kla-Tencor Corporation Vacuum hold-down apparatus for flattening bowed semiconductor wafers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028745A1 (en) * 1999-10-16 2001-04-26 Acr Automation In Cleanroom Gmbh Method and device for isolating plate-like substrates
WO2006125559A1 (en) * 2005-05-21 2006-11-30 Aci-Ecotec Gmbh & Co. Kg Device for the separation of substrates from a stack
WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers
US20080286947A1 (en) * 2005-11-09 2008-11-20 Wolfgang Coenen Process for Separating Disk-Shaped Substrates with the Use of Adhesive Powers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028745A1 (en) * 1999-10-16 2001-04-26 Acr Automation In Cleanroom Gmbh Method and device for isolating plate-like substrates
WO2006125559A1 (en) * 2005-05-21 2006-11-30 Aci-Ecotec Gmbh & Co. Kg Device for the separation of substrates from a stack
US20080286947A1 (en) * 2005-11-09 2008-11-20 Wolfgang Coenen Process for Separating Disk-Shaped Substrates with the Use of Adhesive Powers
WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers

Also Published As

Publication number Publication date
GB0821357D0 (en) 2008-12-31
GB2465591A (en) 2010-05-26

Similar Documents

Publication Publication Date Title
GB2465592B (en) Method and device for facilitating separation of sliced wafers
TWI369717B (en) Method for forming semiconductor device
EP2249668A4 (en) Apparatus and method for slicing vegetables
TWI562245B (en) Semiconductor device and method for manufacturing the same
GB201122197D0 (en) Semiconductor device and method for producing the same
PL2304020T3 (en) Method and apparatus for sorting cells
PL2446246T3 (en) Device and method for selecting particles
GB0814828D0 (en) Chuck device and method
TWI366892B (en) Method for fabricating semiconductor device
IL207139A0 (en) Method and device for monitoring breastfeeding
EP2374516A4 (en) Method for extracting materials and device for implementing same
PT2286974E (en) Forming device and method for removing an object
IL214829A0 (en) Device and method for inspecting semiconductor wafers
GB201000409D0 (en) Device and method for separating adhesive
GB0822993D0 (en) Semiconductor device and fabrication method
PL2283456T3 (en) Method and device for identifying objects
PL2475486T3 (en) Cutting device and cutting method
TWI367339B (en) Test apparatus and test method for semiconductor
KR20180085071A (en) Device and method for processing wafers
PL2275750T3 (en) Method and device for cooling
ZA201003714B (en) Method and device for mechanically processing diamond
EP2301738A4 (en) Forming device and forming method for rubber member
GB2465591B (en) Method and device for separating sliced wafers
IL215114A0 (en) Method and device for gassing
PL2265404T3 (en) Cutting method and apparatus

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20231121