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GB2314700B - Method and apparatus for detecting overheating of printed circuit boards - Google Patents

Method and apparatus for detecting overheating of printed circuit boards

Info

Publication number
GB2314700B
GB2314700B GB9613533A GB9613533A GB2314700B GB 2314700 B GB2314700 B GB 2314700B GB 9613533 A GB9613533 A GB 9613533A GB 9613533 A GB9613533 A GB 9613533A GB 2314700 B GB2314700 B GB 2314700B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
detecting overheating
overheating
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9613533A
Other versions
GB2314700A (en
GB9613533D0 (en
Inventor
Mark John Hockin
Thomas Paul Groves
Andrew Pinnell-Hutchison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions UK Ltd
Original Assignee
Motorola Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Ltd filed Critical Motorola Ltd
Priority to GB9613533A priority Critical patent/GB2314700B/en
Publication of GB9613533D0 publication Critical patent/GB9613533D0/en
Publication of GB2314700A publication Critical patent/GB2314700A/en
Application granted granted Critical
Publication of GB2314700B publication Critical patent/GB2314700B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/02—Details
    • H02H3/04—Details with warning or supervision in addition to disconnection, e.g. for indicating that protective apparatus has functioned
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Protection Of Static Devices (AREA)
GB9613533A 1996-06-27 1996-06-27 Method and apparatus for detecting overheating of printed circuit boards Expired - Fee Related GB2314700B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9613533A GB2314700B (en) 1996-06-27 1996-06-27 Method and apparatus for detecting overheating of printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9613533A GB2314700B (en) 1996-06-27 1996-06-27 Method and apparatus for detecting overheating of printed circuit boards

Publications (3)

Publication Number Publication Date
GB9613533D0 GB9613533D0 (en) 1996-08-28
GB2314700A GB2314700A (en) 1998-01-07
GB2314700B true GB2314700B (en) 2000-06-21

Family

ID=10796014

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9613533A Expired - Fee Related GB2314700B (en) 1996-06-27 1996-06-27 Method and apparatus for detecting overheating of printed circuit boards

Country Status (1)

Country Link
GB (1) GB2314700B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10247238B4 (en) * 2002-10-09 2004-08-26 Klaus Bruchmann Switch fuse arrangement with circuit board
CN100514050C (en) * 2005-07-29 2009-07-15 华为技术有限公司 Circuit board pollution detection alarm method
US11251603B2 (en) * 2018-11-14 2022-02-15 Hewlett Packard Enterprise Development Lp Power backplane with distributed hotspot detection grid

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812037A (en) * 1988-03-11 1989-03-14 Westinghouse Electric Corp. Method and apparatus for optically detecting circuit malfunctions
EP0446061A2 (en) * 1990-03-08 1991-09-11 Nec Corporation Abnormal temperature detector for electronic apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812037A (en) * 1988-03-11 1989-03-14 Westinghouse Electric Corp. Method and apparatus for optically detecting circuit malfunctions
EP0446061A2 (en) * 1990-03-08 1991-09-11 Nec Corporation Abnormal temperature detector for electronic apparatus

Also Published As

Publication number Publication date
GB2314700A (en) 1998-01-07
GB9613533D0 (en) 1996-08-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080627