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SG52844A1 - Device and method for perforating printed circuit board - Google Patents

Device and method for perforating printed circuit board

Info

Publication number
SG52844A1
SG52844A1 SG1996010669A SG1996010669A SG52844A1 SG 52844 A1 SG52844 A1 SG 52844A1 SG 1996010669 A SG1996010669 A SG 1996010669A SG 1996010669 A SG1996010669 A SG 1996010669A SG 52844 A1 SG52844 A1 SG 52844A1
Authority
SG
Singapore
Prior art keywords
circuit board
printed circuit
perforating
perforating printed
board
Prior art date
Application number
SG1996010669A
Inventor
Tsutomu Saito
Shinichi Kato
Original Assignee
Seiko Precision Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Kk filed Critical Seiko Precision Kk
Publication of SG52844A1 publication Critical patent/SG52844A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Details Of Cutting Devices (AREA)
  • Control Of Cutting Processes (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
SG1996010669A 1995-09-22 1996-09-20 Device and method for perforating printed circuit board SG52844A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7244377A JP2873439B2 (en) 1995-09-22 1995-09-22 Drilling device and method for printed circuit board

Publications (1)

Publication Number Publication Date
SG52844A1 true SG52844A1 (en) 1998-09-28

Family

ID=17117784

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010669A SG52844A1 (en) 1995-09-22 1996-09-20 Device and method for perforating printed circuit board

Country Status (5)

Country Link
JP (1) JP2873439B2 (en)
KR (1) KR100247266B1 (en)
CN (1) CN1088320C (en)
SG (1) SG52844A1 (en)
TW (1) TW386047B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3802309B2 (en) * 2000-03-28 2006-07-26 株式会社アドテックエンジニアリング Positioning apparatus and exposure apparatus in multilayer circuit board manufacture
JP4343391B2 (en) * 2000-04-07 2009-10-14 株式会社モトロニクス Workpiece processing equipment
JP4502454B2 (en) * 2000-04-28 2010-07-14 株式会社ムラキ Reference hole drilling machine
JP4134503B2 (en) * 2000-10-11 2008-08-20 松下電器産業株式会社 Method for manufacturing circuit-formed substrate
KR20020078472A (en) * 2001-04-03 2002-10-19 디에스테크널러지(주) Operating methods of Printed Circuit Board drilling machine
CN1143763C (en) * 2002-07-29 2004-03-31 应书波 Numerally controlled punching machine with automatic image location
JP4514690B2 (en) * 2005-10-31 2010-07-28 ヤマハファインテック株式会社 Connector part punching device, connector part punching method, and program for realizing connector part punching method
JP4542046B2 (en) * 2006-01-30 2010-09-08 セイコープレシジョン株式会社 Drilling method and drilling device
JP4210692B2 (en) * 2006-05-30 2009-01-21 セイコープレシジョン株式会社 Drilling device
JP5139278B2 (en) * 2006-05-30 2013-02-06 株式会社 ベアック Drilling device
KR100809926B1 (en) 2006-10-09 2008-03-06 주식회사 나래시스 Drilling Machine for Printed Circuit Boards
JP4767180B2 (en) * 2007-01-11 2011-09-07 セイコープレシジョン株式会社 Drilling device
KR100883176B1 (en) 2007-12-03 2009-02-12 세호로보트산업 주식회사 Board punching device
US8947076B2 (en) 2010-01-18 2015-02-03 Bourns, Inc. High resolution non-contacting multi-turn position sensor
CN102145414A (en) * 2011-03-24 2011-08-10 苏州市艾西依钣金制造有限公司 Porous tapping method
JP5466687B2 (en) * 2011-11-08 2014-04-09 セイコープレシジョン株式会社 Wiring board measuring device
JP5512648B2 (en) * 2011-12-28 2014-06-04 セイコープレシジョン株式会社 X-ray processing equipment
JP5952053B2 (en) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 Drilling device
JP5952052B2 (en) * 2012-03-29 2016-07-13 セイコープレシジョン株式会社 Drilling device
CN102699952A (en) * 2012-06-01 2012-10-03 深圳市威利特自动化设备有限公司 Punching method, device and equipment
US9481028B2 (en) * 2013-09-26 2016-11-01 The Boeing Company Automated drilling through pilot holes
CN104260147A (en) * 2014-08-21 2015-01-07 宁波赛特信息科技发展有限公司 Flexible circuit board drilling method
CN104476612B (en) * 2014-12-11 2016-08-24 广州兴森快捷电路科技有限公司 A kind of X-Ray drilling equipment
CN104972511A (en) * 2015-07-08 2015-10-14 沪士电子股份有限公司 Drilling method improving PCB plate counter-drilling precision
CN106270620B (en) * 2016-08-29 2019-08-02 山东莱钢建设有限公司 F type section of track drilling device
CN112454493B (en) * 2020-10-16 2022-06-03 广州裕申电子科技有限公司 Circuit board identification system, method and storage medium

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2561166B2 (en) * 1990-03-26 1996-12-04 株式会社精工舎 Method and device for punching printed circuit board
JPH0657381A (en) * 1992-08-05 1994-03-01 Sumitomo Special Metals Co Ltd Fe-Ni-Co based low thermal expansion alloy

Also Published As

Publication number Publication date
KR970019786A (en) 1997-04-30
KR100247266B1 (en) 2000-03-15
JP2873439B2 (en) 1999-03-24
JPH0985693A (en) 1997-03-31
CN1151676A (en) 1997-06-11
TW386047B (en) 2000-04-01
CN1088320C (en) 2002-07-24

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