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GB2393332B - Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board - Google Patents

Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board

Info

Publication number
GB2393332B
GB2393332B GB0327735A GB0327735A GB2393332B GB 2393332 B GB2393332 B GB 2393332B GB 0327735 A GB0327735 A GB 0327735A GB 0327735 A GB0327735 A GB 0327735A GB 2393332 B GB2393332 B GB 2393332B
Authority
GB
United Kingdom
Prior art keywords
conductor paste
printing
circuit board
ceramic circuit
fabricating ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0327735A
Other versions
GB2393332A (en
GB0327735D0 (en
Inventor
Masashi Fukaya
Yoshihiro Nakamura
Kazushige Onozumi
Satoru Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUMITOMO METAL
Tanaka Kikinzoku Kogyo KK
Murata Manufacturing Co Ltd
Original Assignee
SUMITOMO METAL
Tanaka Kikinzoku Kogyo KK
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002205152A external-priority patent/JP2004047856A/en
Priority claimed from JP2002326959A external-priority patent/JP2004165274A/en
Application filed by SUMITOMO METAL, Tanaka Kikinzoku Kogyo KK, Murata Manufacturing Co Ltd filed Critical SUMITOMO METAL
Priority claimed from GB0315957A external-priority patent/GB2391116B/en
Publication of GB0327735D0 publication Critical patent/GB0327735D0/en
Publication of GB2393332A publication Critical patent/GB2393332A/en
Application granted granted Critical
Publication of GB2393332B publication Critical patent/GB2393332B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H10P74/277—
    • H10W70/098—
    • H10W70/666—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB0327735A 2002-07-15 2003-07-08 Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board Expired - Lifetime GB2393332B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002205152A JP2004047856A (en) 2002-07-15 2002-07-15 Conductive paste, printing method, and method for manufacturing ceramic multilayer circuit board
JP2002326959A JP2004165274A (en) 2002-11-11 2002-11-11 Method for manufacturing low-temperature fired ceramic circuit board
GB0315957A GB2391116B (en) 2002-07-15 2003-07-08 Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board

Publications (3)

Publication Number Publication Date
GB0327735D0 GB0327735D0 (en) 2003-12-31
GB2393332A GB2393332A (en) 2004-03-24
GB2393332B true GB2393332B (en) 2006-03-08

Family

ID=31950334

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0327735A Expired - Lifetime GB2393332B (en) 2002-07-15 2003-07-08 Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board

Country Status (1)

Country Link
GB (1) GB2393332B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008043763A1 (en) 2007-11-16 2009-08-13 DENSO CORPORATION, Kariya-shi Connecting material and method for producing a ceramic joint body

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216617A (en) * 1985-07-15 1987-01-24 Nec Corp Pll frequency synthesizer
US4749665A (en) * 1985-10-25 1988-06-07 Narumi China Corporation Low temperature fired ceramics
JPS6441626A (en) * 1987-08-04 1989-02-13 Toyota Motor Corp Compression ratio control device for internal combustion engine
US5468445A (en) * 1992-05-29 1995-11-21 International Business Machines Corporation Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
US6086793A (en) * 1994-12-02 2000-07-11 Murata Manufacturing Co., Ltd. Method of producing electrically conductive pastes and materials using same
JP2002141625A (en) * 2000-10-30 2002-05-17 Kyocera Corp Circuit board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216617A (en) * 1985-07-15 1987-01-24 Nec Corp Pll frequency synthesizer
US4749665A (en) * 1985-10-25 1988-06-07 Narumi China Corporation Low temperature fired ceramics
JPS6441626A (en) * 1987-08-04 1989-02-13 Toyota Motor Corp Compression ratio control device for internal combustion engine
US5468445A (en) * 1992-05-29 1995-11-21 International Business Machines Corporation Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
US6086793A (en) * 1994-12-02 2000-07-11 Murata Manufacturing Co., Ltd. Method of producing electrically conductive pastes and materials using same
JP2002141625A (en) * 2000-10-30 2002-05-17 Kyocera Corp Circuit board

Also Published As

Publication number Publication date
GB2393332A (en) 2004-03-24
GB0327735D0 (en) 2003-12-31

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Expiry date: 20230707