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GB2391116B - Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board - Google Patents

Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board

Info

Publication number
GB2391116B
GB2391116B GB0315957A GB0315957A GB2391116B GB 2391116 B GB2391116 B GB 2391116B GB 0315957 A GB0315957 A GB 0315957A GB 0315957 A GB0315957 A GB 0315957A GB 2391116 B GB2391116 B GB 2391116B
Authority
GB
United Kingdom
Prior art keywords
conductor paste
printing
circuit board
ceramic circuit
fabricating ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0315957A
Other versions
GB2391116A (en
GB0315957D0 (en
Inventor
Masashi Fukaya
Yoshihiro Nakamura
Kazushige Onozumi
Satoru Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUMITOMO METAL
Tanaka Kikinzoku Kogyo KK
Murata Manufacturing Co Ltd
Original Assignee
SUMITOMO METAL
Tanaka Kikinzoku Kogyo KK
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002205152A external-priority patent/JP2004047856A/en
Priority claimed from JP2002326959A external-priority patent/JP2004165274A/en
Application filed by SUMITOMO METAL, Tanaka Kikinzoku Kogyo KK, Murata Manufacturing Co Ltd filed Critical SUMITOMO METAL
Priority to GB0327735A priority Critical patent/GB2393332B/en
Publication of GB0315957D0 publication Critical patent/GB0315957D0/en
Publication of GB2391116A publication Critical patent/GB2391116A/en
Application granted granted Critical
Publication of GB2391116B publication Critical patent/GB2391116B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H10P74/277—
    • H10W70/098—
    • H10W70/666—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB0315957A 2002-07-15 2003-07-08 Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board Expired - Lifetime GB2391116B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0327735A GB2393332B (en) 2002-07-15 2003-07-08 Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002205152A JP2004047856A (en) 2002-07-15 2002-07-15 Conductive paste, printing method, and method for manufacturing ceramic multilayer circuit board
JP2002326959A JP2004165274A (en) 2002-11-11 2002-11-11 Method for manufacturing low-temperature fired ceramic circuit board

Publications (3)

Publication Number Publication Date
GB0315957D0 GB0315957D0 (en) 2003-08-13
GB2391116A GB2391116A (en) 2004-01-28
GB2391116B true GB2391116B (en) 2006-02-22

Family

ID=27759763

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0315957A Expired - Lifetime GB2391116B (en) 2002-07-15 2003-07-08 Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board

Country Status (2)

Country Link
DE (1) DE10331811A1 (en)
GB (1) GB2391116B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9240526B2 (en) * 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727506A (en) * 1980-07-25 1982-02-13 Central Glass Co Ltd Conductive paste
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPH01232797A (en) * 1988-03-11 1989-09-18 Narumi China Corp Ceramic multilayer circuit board
JPH06216617A (en) * 1993-01-18 1994-08-05 Ngk Insulators Ltd Dielectric filter and its manufacture and dielectric wiring board
JP2002026528A (en) * 2000-07-12 2002-01-25 Hitachi Metals Ltd Conductive paste and multilayer ceramic substrate
JP2002141625A (en) * 2000-10-30 2002-05-17 Kyocera Corp Circuit board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727506A (en) * 1980-07-25 1982-02-13 Central Glass Co Ltd Conductive paste
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPH01232797A (en) * 1988-03-11 1989-09-18 Narumi China Corp Ceramic multilayer circuit board
JPH06216617A (en) * 1993-01-18 1994-08-05 Ngk Insulators Ltd Dielectric filter and its manufacture and dielectric wiring board
JP2002026528A (en) * 2000-07-12 2002-01-25 Hitachi Metals Ltd Conductive paste and multilayer ceramic substrate
JP2002141625A (en) * 2000-10-30 2002-05-17 Kyocera Corp Circuit board

Also Published As

Publication number Publication date
GB2391116A (en) 2004-01-28
GB0315957D0 (en) 2003-08-13
DE10331811A1 (en) 2004-02-05

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Expiry date: 20230707