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GB2370040A - Thermally conductive materials in a hydrophobic compound for thermal management - Google Patents

Thermally conductive materials in a hydrophobic compound for thermal management

Info

Publication number
GB2370040A
GB2370040A GB0204971A GB0204971A GB2370040A GB 2370040 A GB2370040 A GB 2370040A GB 0204971 A GB0204971 A GB 0204971A GB 0204971 A GB0204971 A GB 0204971A GB 2370040 A GB2370040 A GB 2370040A
Authority
GB
United Kingdom
Prior art keywords
thermally conductive
heat source
hydrophobic compound
present
moisture resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0204971A
Other versions
GB2370040A8 (en
GB2370040B (en
GB0204971D0 (en
Inventor
Susan E Bowser
Thomas M Clere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of GB0204971D0 publication Critical patent/GB0204971D0/en
Publication of GB2370040A8 publication Critical patent/GB2370040A8/en
Publication of GB2370040A publication Critical patent/GB2370040A/en
Application granted granted Critical
Publication of GB2370040B publication Critical patent/GB2370040B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W40/251—
    • H10W72/325—
    • H10W72/353—
    • H10W72/354—
    • H10W90/736—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

The present invention is directed to a moisture resistant, thermally conductive material (16) comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink.
GB0204971A 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management Expired - Fee Related GB2370040B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40016999A 1999-09-21 1999-09-21
PCT/US2000/025811 WO2001021393A1 (en) 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management

Publications (4)

Publication Number Publication Date
GB0204971D0 GB0204971D0 (en) 2002-04-17
GB2370040A8 GB2370040A8 (en) 2002-06-19
GB2370040A true GB2370040A (en) 2002-06-19
GB2370040B GB2370040B (en) 2003-10-29

Family

ID=23582496

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0204971A Expired - Fee Related GB2370040B (en) 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management

Country Status (5)

Country Link
JP (2) JP2003509578A (en)
AU (1) AU3886801A (en)
DE (1) DE10085011T1 (en)
GB (1) GB2370040B (en)
WO (1) WO2001021393A1 (en)

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US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7101565B2 (en) 2002-02-05 2006-09-05 Corpak Medsystems, Inc. Probiotic/prebiotic composition and delivery method
US20050016714A1 (en) 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
EP1692219B1 (en) 2003-11-05 2007-03-21 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
EP1568733A1 (en) * 2004-02-20 2005-08-31 Abb Research Ltd. Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions
JP5114111B2 (en) * 2006-09-07 2013-01-09 日東シンコー株式会社 Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
JP5114112B2 (en) * 2006-09-07 2013-01-09 日東シンコー株式会社 Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
US7527859B2 (en) * 2006-10-08 2009-05-05 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
US8093713B2 (en) 2007-02-09 2012-01-10 Infineon Technologies Ag Module with silicon-based layer
DE102007023555A1 (en) * 2007-05-21 2008-11-27 Siemens Ag Hydrophobic surface coating for electronic and electrical components as well as uses for it
WO2010107516A1 (en) 2009-03-16 2010-09-23 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP5152108B2 (en) * 2009-06-18 2013-02-27 Ｊｓｒ株式会社 Thermally conductive resin composition and thermally conductive film
WO2013089861A1 (en) * 2011-12-12 2013-06-20 Texas State University-San Marcos Varistor-transistor hybrid devices
EP2839507A4 (en) * 2012-04-17 2015-12-02 Momentive Performance Mat Inc THERMALLY CONDUCTIVE POLYMER COMPOSITIONS FOR REDUCING MOLDING CYCLE TIME
KR101412774B1 (en) * 2012-07-27 2014-07-02 서울대학교산학협력단 Porous boron nitride and method for preparing the same
JP5934064B2 (en) * 2012-09-06 2016-06-15 ダイセルポリマー株式会社 Additive for thermoplastic resin
WO2014065910A1 (en) * 2012-10-26 2014-05-01 Laird Technologies, Inc. Thermally conductive polymer composites containing magnesium silicate and boron nitride
WO2015105106A1 (en) * 2014-01-08 2015-07-16 Jnc株式会社 Resin composition for heat-conductive sheet, heat-conductive sheet, resin-coated metal, and electronic device
JP2017520633A (en) * 2014-04-30 2017-07-27 ロジャーズ コーポレーション Thermally conductive composite material, method for producing the same, and article containing the composite material
TWI631179B (en) * 2014-05-21 2018-08-01 Toyobo Co., Ltd. Polyamine resin composition and method for improving heat aging resistance of polyamine resin
US10392499B2 (en) * 2014-06-19 2019-08-27 Lg Innotek Co., Ltd. Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition
EP3023456B1 (en) * 2014-11-18 2019-06-19 Miba Gleitlager Austria GmbH Sliding bearing element
JP6802527B2 (en) * 2015-11-19 2020-12-16 東洋紡株式会社 High melt viscosity polyamide resin composition
CN108884267B (en) 2016-02-01 2022-02-22 卡博特公司 Thermally conductive polymer compositions containing carbon black
PT3839005T (en) * 2016-10-12 2023-09-07 Honeywell Int Inc Thermal interface materials including coloring agent
CN106385161B (en) * 2016-10-31 2018-10-12 江苏科岭能源科技有限公司 A kind of high-power air-cooled permanent-magnet speed governor
CN108638608A (en) * 2018-05-09 2018-10-12 苏州明上系统科技有限公司 A kind of high-hardness metal material
CN109439188B (en) * 2018-11-15 2020-09-11 北京林业大学 Super-hydrophobic photo-thermal coating and preparation method thereof
CN109880043B (en) * 2019-01-07 2021-04-20 江苏大学 Preparation method and anti-ultraviolet application of nano iron titanate modified polyurethane prepolymer
CN111669956B (en) * 2019-03-06 2024-04-02 天津莱尔德电子材料有限公司 Thermal management and/or electromagnetic interference mitigation materials and related devices and methods
JP7435294B2 (en) * 2020-06-17 2024-02-21 株式会社豊田中央研究所 High thermal conductivity grease composition
JP7153828B1 (en) * 2021-03-12 2022-10-14 タツタ電線株式会社 thermally conductive sheet
TW202407077A (en) * 2022-06-22 2024-02-16 德商漢高股份有限及兩合公司 Thermal interface materials with soft filler dispersions
WO2025220309A1 (en) * 2024-04-17 2025-10-23 住友電気工業株式会社 Powder, composite material, and method for producing powder

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US4882225A (en) * 1985-07-29 1989-11-21 Shiseido Company Ltd. Modified powder or particulate material
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US5234712A (en) * 1992-06-08 1993-08-10 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby

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US4849284A (en) * 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
JPH08183906A (en) * 1994-12-28 1996-07-16 Shin Etsu Chem Co Ltd Boron nitride suspension
DE19620942A1 (en) * 1995-06-05 1996-12-12 Gen Electric Efficient process for hydrophobicizing inorganic powder
JPH11134944A (en) * 1997-10-28 1999-05-21 Fujikura Ltd High thermal conductive insulating material and superconducting cable
JP3290127B2 (en) * 1998-01-27 2002-06-10 松下電工株式会社 Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4882225A (en) * 1985-07-29 1989-11-21 Shiseido Company Ltd. Modified powder or particulate material
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US5234712A (en) * 1992-06-08 1993-08-10 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby

Also Published As

Publication number Publication date
JP2003509578A (en) 2003-03-11
WO2001021393A1 (en) 2001-03-29
GB2370040A8 (en) 2002-06-19
GB2370040B (en) 2003-10-29
JP2006241470A (en) 2006-09-14
AU3886801A (en) 2001-04-24
DE10085011T1 (en) 2003-01-16
GB0204971D0 (en) 2002-04-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110920