GB2370040A8 - Thermally conductive materials in a hydrophobic compound for thermal management - Google Patents

Thermally conductive materials in a hydrophobic compound for thermal management

Info

Publication number: GB2370040A8
Authority: GB; United Kingdom
Prior art keywords: thermally conductive; conductive materials; thermal management; hydrophobic compound; hydrophobic
Prior art date: 1999-09-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

GB0204971A

Other versions

GB2370040A (en

GB2370040B (en

GB0204971D0 (en

Inventor

Susan E Bowser

Thomas M Clere

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Saint Gobain Ceramics and Plastics Inc

Original Assignee

Saint Gobain Ceramics and Plastics Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-09-21

Filing date

2000-09-20

Publication date

2002-06-19

2000-09-20 Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc

2002-04-17 Publication of GB0204971D0 publication Critical patent/GB0204971D0/en

2002-06-19 Publication of GB2370040A8 publication Critical patent/GB2370040A8/en

2002-06-19 Publication of GB2370040A publication Critical patent/GB2370040A/en

2003-10-29 Application granted granted Critical

2003-10-29 Publication of GB2370040B publication Critical patent/GB2370040B/en

2020-09-20 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W40/251—
- H10W72/325—
- H10W72/353—
- H10W72/354—
- H10W90/736—

GB0204971A 1999-09-21 2000-09-20 Thermally conductive materials in a hydrophobic compound for thermal management Expired - Fee Related GB2370040B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US40016999A	1999-09-21	1999-09-21
PCT/US2000/025811 WO2001021393A1 (en)	1999-09-21	2000-09-20	Thermally conductive materials in a hydrophobic compound for thermal management

Publications (4)

Publication Number	Publication Date
GB0204971D0 GB0204971D0 (en)	2002-04-17
GB2370040A8 true GB2370040A8 (en)	2002-06-19
GB2370040A GB2370040A (en)	2002-06-19
GB2370040B GB2370040B (en)	2003-10-29

Family

ID=23582496

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB0204971A Expired - Fee Related GB2370040B (en)	1999-09-21	2000-09-20	Thermally conductive materials in a hydrophobic compound for thermal management

Country Status (5)

Country	Link
JP (2)	JP2003509578A (en)
AU (1)	AU3886801A (en)
DE (1)	DE10085011T1 (en)
GB (1)	GB2370040B (en)
WO (1)	WO2001021393A1 (en)

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US7101565B2 (en)	2002-02-05	2006-09-05	Corpak Medsystems, Inc.	Probiotic/prebiotic composition and delivery method
US20050016714A1 (en)	2003-07-09	2005-01-27	Chung Deborah D.L.	Thermal paste for improving thermal contacts
EP1692219B1 (en)	2003-11-05	2007-03-21	Dow Corning Corporation	Thermally conductive grease and methods and devices in which said grease is used
EP1568733A1 (en) *	2004-02-20	2005-08-31	Abb Research Ltd.	Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions
JP5114111B2 (en) *	2006-09-07	2013-01-09	日東シンコー株式会社	Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
JP5114112B2 (en) *	2006-09-07	2013-01-09	日東シンコー株式会社	Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
US7527859B2 (en) *	2006-10-08	2009-05-05	Momentive Performance Materials Inc.	Enhanced boron nitride composition and compositions made therewith
US8093713B2 (en)	2007-02-09	2012-01-10	Infineon Technologies Ag	Module with silicon-based layer
DE102007023555A1 (en) *	2007-05-21	2008-11-27	Siemens Ag	Hydrophobic surface coating for electronic and electrical components as well as uses for it
WO2010107516A1 (en)	2009-03-16	2010-09-23	Dow Corning Corporation	Thermally conductive grease and methods and devices in which said grease is used
JP5152108B2 (en) *	2009-06-18	2013-02-27	Ｊｓｒ株式会社	Thermally conductive resin composition and thermally conductive film
WO2013089861A1 (en) *	2011-12-12	2013-06-20	Texas State University-San Marcos	Varistor-transistor hybrid devices
EP2839507A4 (en) *	2012-04-17	2015-12-02	Momentive Performance Mat Inc	THERMALLY CONDUCTIVE POLYMER COMPOSITIONS FOR REDUCING MOLDING CYCLE TIME
KR101412774B1 (en) *	2012-07-27	2014-07-02	서울대학교산학협력단	Porous boron nitride and method for preparing the same
JP5934064B2 (en) *	2012-09-06	2016-06-15	ダイセルポリマー株式会社	Additive for thermoplastic resin
WO2014065910A1 (en) *	2012-10-26	2014-05-01	Laird Technologies, Inc.	Thermally conductive polymer composites containing magnesium silicate and boron nitride
WO2015105106A1 (en) *	2014-01-08	2015-07-16	Jnc株式会社	Resin composition for heat-conductive sheet, heat-conductive sheet, resin-coated metal, and electronic device
JP2017520633A (en) *	2014-04-30	2017-07-27	ロジャーズコーポレーション	Thermally conductive composite material, method for producing the same, and article containing the composite material
TWI631179B (en) *	2014-05-21	2018-08-01	Toyobo Co., Ltd.	Polyamine resin composition and method for improving heat aging resistance of polyamine resin
US10392499B2 (en) *	2014-06-19	2019-08-27	Lg Innotek Co., Ltd.	Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition
EP3023456B1 (en) *	2014-11-18	2019-06-19	Miba Gleitlager Austria GmbH	Sliding bearing element
JP6802527B2 (en) *	2015-11-19	2020-12-16	東洋紡株式会社	High melt viscosity polyamide resin composition
CN108884267B (en)	2016-02-01	2022-02-22	卡博特公司	Thermally conductive polymer compositions containing carbon black
PT3839005T (en) *	2016-10-12	2023-09-07	Honeywell Int Inc	Thermal interface materials including coloring agent
CN106385161B (en) *	2016-10-31	2018-10-12	江苏科岭能源科技有限公司	A kind of high-power air-cooled permanent-magnet speed governor
CN108638608A (en) *	2018-05-09	2018-10-12	苏州明上系统科技有限公司	A kind of high-hardness metal material
CN109439188B (en) *	2018-11-15	2020-09-11	北京林业大学	Super-hydrophobic photo-thermal coating and preparation method thereof
CN109880043B (en) *	2019-01-07	2021-04-20	江苏大学	Preparation method and anti-ultraviolet application of nano iron titanate modified polyurethane prepolymer
CN111669956B (en) *	2019-03-06	2024-04-02	天津莱尔德电子材料有限公司	Thermal management and/or electromagnetic interference mitigation materials and related devices and methods
JP7435294B2 (en) *	2020-06-17	2024-02-21	株式会社豊田中央研究所	High thermal conductivity grease composition
JP7153828B1 (en) *	2021-03-12	2022-10-14	タツタ電線株式会社	thermally conductive sheet
TW202407077A (en) *	2022-06-22	2024-02-16	德商漢高股份有限及兩合公司	Thermal interface materials with soft filler dispersions
WO2025220309A1 (en) *	2024-04-17	2025-10-23	住友電気工業株式会社	Powder, composite material, and method for producing powder

Family Cites Families (10)

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Publication number	Priority date	Publication date	Assignee	Title
DE3684836D1 (en) *	1985-07-29	1992-05-21	Shiseido Co Ltd	POWDER COVERED WITH SILICONE POLYMER OR PARTICULAR MATERIAL.
US4849284A (en) *	1987-02-17	1989-07-18	Rogers Corporation	Electrical substrate material
US4869954A (en) *	1987-09-10	1989-09-26	Chomerics, Inc.	Thermally conductive materials
US5194480A (en) *	1991-05-24	1993-03-16	W. R. Grace & Co.-Conn.	Thermally conductive elastomer
US5213868A (en) *	1991-08-13	1993-05-25	Chomerics, Inc.	Thermally conductive interface materials and methods of using the same
US5234712A (en) *	1992-06-08	1993-08-10	The Dow Chemical Company	Method of making moisture resistant aluminum nitride powder and powder produced thereby
JPH08183906A (en) *	1994-12-28	1996-07-16	Shin Etsu Chem Co Ltd	Boron nitride suspension
DE19620942A1 (en) *	1995-06-05	1996-12-12	Gen Electric	Efficient process for hydrophobicizing inorganic powder
JPH11134944A (en) *	1997-10-28	1999-05-21	Fujikura Ltd	High thermal conductive insulating material and superconducting cable
JP3290127B2 (en) *	1998-01-27	2002-06-10	松下電工株式会社	Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition

2000
- 2000-09-20 GB GB0204971A patent/GB2370040B/en not_active Expired - Fee Related
- 2000-09-20 WO PCT/US2000/025811 patent/WO2001021393A1/en not_active Ceased
- 2000-09-20 AU AU38868/01A patent/AU3886801A/en not_active Abandoned
- 2000-09-20 DE DE10085011T patent/DE10085011T1/en not_active Ceased
- 2000-09-20 JP JP2001524797A patent/JP2003509578A/en not_active Withdrawn
2006
- 2006-05-15 JP JP2006135616A patent/JP2006241470A/en active Pending

Also Published As

Publication number	Publication date
JP2003509578A (en)	2003-03-11
WO2001021393A1 (en)	2001-03-29
GB2370040A (en)	2002-06-19
GB2370040B (en)	2003-10-29
JP2006241470A (en)	2006-09-14
AU3886801A (en)	2001-04-24
DE10085011T1 (en)	2003-01-16
GB0204971D0 (en)	2002-04-17

Publication	Publication Date	Title
GB2370040B (en)	2003-10-29	Thermally conductive materials in a hydrophobic compound for thermal management
AU1348901A (en)	2001-05-08	Improved diamond thermal management components
GB2349485B (en)	2003-12-10	Application management
AU2501000A (en)	2000-08-01	Thermally conductive thermoplastic
AU2050901A (en)	2001-06-12	Thermally conductive electronic device case
PL343424A1 (en)	2001-08-13	Amidine compounds
EP1150871A4 (en)	2003-05-21	Energy management system
GB2351846B (en)	2002-03-13	Thermally sensitive controls
AU1455101A (en)	2001-06-06	Thermal energy storage materials
TW573947U (en)	2004-01-21	Heat sink including heat receiving surface with protruding portion
GB9809429D0 (en)	1998-07-01	Thermal storage holding device
GB9715578D0 (en)	1997-10-01	Thermal storage
AU9644901A (en)	2002-04-15	Laser thermal management system
EP1080939A4 (en)	2004-07-28	Thermal recording material
GB9828750D0 (en)	1999-02-17	Memory management
EP1092553A4 (en)	2003-07-09	Thermal recording material
TW453470U (en)	2001-09-01	Heat dissipation structure
AU2001281624A1 (en)	2002-03-04	Distributed thermal management system for electronic components
GB2352385B (en)	2003-06-18	Thermal management system for clothing
TW447735U (en)	2001-07-21	Heat sink with compound structure
TW447693U (en)	2001-07-21	Uniform thermal energy dissipation device
GB9821034D0 (en)	1998-11-18	Thermal retention pack
TW342863U (en)	1998-10-11	Thermal air-tent
GB9905548D0 (en)	1999-05-05	A thermal imager
TW534583U (en)	2003-05-21	Improved heat sink structure

Legal Events

Date	Code	Title	Description
2012-05-23	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20110920