GB2354881B - Integrated circuit packaging structure - Google Patents

Integrated circuit packaging structure

Info

Publication number: GB2354881B
Authority: GB; United Kingdom
Prior art keywords: integrated circuit; packaging structure; circuit packaging; integrated; packaging
Prior art date: 1999-06-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB0015843A

Other versions

GB2354881A (en

GB0015843D0 (en

Inventor

Ming-Tung Shen

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CTS COMP TECHNOLOGY SYSTEM COR

CTS Computer Tech System Corp

Original Assignee

CTS COMP TECHNOLOGY SYSTEM COR

CTS Computer Tech System Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-06-28

Filing date

2000-06-28

Publication date

2002-01-23

2000-06-28 Application filed by CTS COMP TECHNOLOGY SYSTEM COR, CTS Computer Tech System Corp filed Critical CTS COMP TECHNOLOGY SYSTEM COR

2000-08-23 Publication of GB0015843D0 publication Critical patent/GB0015843D0/en

2001-04-04 Publication of GB2354881A publication Critical patent/GB2354881A/en

2002-01-23 Application granted granted Critical

2002-01-23 Publication of GB2354881B publication Critical patent/GB2354881B/en

2020-06-28 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W90/00—
- H10W70/415—
- H10W74/114—
- H10W70/682—
- H10W70/685—
- H10W72/075—
- H10W72/951—
- H10W90/291—
- H10W90/297—
- H10W90/754—

GB0015843A 1999-06-28 2000-06-28 Integrated circuit packaging structure Expired - Fee Related GB2354881B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GBGB9915076.5A GB9915076D0 (en)	1999-06-28	1999-06-28	Integrated circuit packaging structure

Publications (3)

Publication Number	Publication Date
GB0015843D0 GB0015843D0 (en)	2000-08-23
GB2354881A GB2354881A (en)	2001-04-04
GB2354881B true GB2354881B (en)	2002-01-23

Family

ID=10856191

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
GBGB9915076.5A Ceased GB9915076D0 (en)	1999-06-28	1999-06-28	Integrated circuit packaging structure
GB0015843A Expired - Fee Related GB2354881B (en)	1999-06-28	2000-06-28	Integrated circuit packaging structure

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
GBGB9915076.5A Ceased GB9915076D0 (en)	1999-06-28	1999-06-28	Integrated circuit packaging structure

Country Status (1)

Country	Link
GB (2)	GB9915076D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9343449B2 (en) *	2012-07-06	2016-05-17	Nvidia Corporation	Alternative 3D stacking scheme for DRAMs atop GPUs

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2083285A (en) *	1980-02-12	1982-03-17	Mostek Corp	Over/under dual in-line chip package
EP0067677A2 (en) *	1981-06-15	1982-12-22	Fujitsu Limited	Chip-array-constructed semiconductor device
US5723907A (en) *	1996-06-25	1998-03-03	Micron Technology, Inc.	Loc simm
US5804874A (en) *	1996-03-08	1998-09-08	Samsung Electronics Co., Ltd.	Stacked chip package device employing a plurality of lead on chip type semiconductor chips
US5811879A (en) *	1996-06-26	1998-09-22	Micron Technology, Inc.	Stacked leads-over-chip multi-chip module
US5854740A (en) *	1995-04-27	1998-12-29	Lg Semicon Co., Ltd.	Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor
US5899705A (en) *	1997-11-20	1999-05-04	Akram; Salman	Stacked leads-over chip multi-chip module

1999
- 1999-06-28 GB GBGB9915076.5A patent/GB9915076D0/en not_active Ceased
2000
- 2000-06-28 GB GB0015843A patent/GB2354881B/en not_active Expired - Fee Related

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2083285A (en) *	1980-02-12	1982-03-17	Mostek Corp	Over/under dual in-line chip package
EP0067677A2 (en) *	1981-06-15	1982-12-22	Fujitsu Limited	Chip-array-constructed semiconductor device
US5854740A (en) *	1995-04-27	1998-12-29	Lg Semicon Co., Ltd.	Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor
US5804874A (en) *	1996-03-08	1998-09-08	Samsung Electronics Co., Ltd.	Stacked chip package device employing a plurality of lead on chip type semiconductor chips
US5723907A (en) *	1996-06-25	1998-03-03	Micron Technology, Inc.	Loc simm
US5811879A (en) *	1996-06-26	1998-09-22	Micron Technology, Inc.	Stacked leads-over-chip multi-chip module
US5899705A (en) *	1997-11-20	1999-05-04	Akram; Salman	Stacked leads-over chip multi-chip module

Also Published As

Publication number	Publication date
GB2354881A (en)	2001-04-04
GB9915076D0 (en)	1999-08-25
GB0015843D0 (en)	2000-08-23

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Legal Events

Date	Code	Title	Description
2006-03-01	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20050628