GB2222721B - Cooling semiconductor devices - Google Patents

Cooling semiconductor devices

Info

Publication number: GB2222721B
Authority: GB; United Kingdom
Prior art keywords: semiconductor devices; cooling semiconductor; cooling; devices; semiconductor
Prior art date: 1988-08-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB8918867A

Other versions

GB2222721A (en

GB8918867D0 (en

Inventor

Nobuo Mikoshiba

Kazuo Tsubouchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-23

Filing date

1989-08-18

Publication date

1993-07-28

1988-08-23 Priority claimed from JP63209765A external-priority patent/JPH07120735B2/en

1988-08-23 Priority claimed from JP63209764A external-priority patent/JPH0258254A/en

1989-08-18 Application filed by Individual filed Critical Individual

1989-09-27 Publication of GB8918867D0 publication Critical patent/GB8918867D0/en

1990-03-14 Publication of GB2222721A publication Critical patent/GB2222721A/en

1993-07-28 Application granted granted Critical

1993-07-28 Publication of GB2222721B publication Critical patent/GB2222721B/en

2009-08-18 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W40/10—
- H10W40/22—
- H10W40/259—
- H10W72/07251—
- H10W72/20—
- H10W90/756—

GB8918867A 1988-08-23 1989-08-18 Cooling semiconductor devices Expired - Fee Related GB2222721B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP63209765A JPH07120735B2 (en)	1988-08-23	1988-08-23	Semiconductor chip
JP63209764A JPH0258254A (en)	1988-08-23	1988-08-23	Semiconductor element

Publications (3)

Publication Number	Publication Date
GB8918867D0 GB8918867D0 (en)	1989-09-27
GB2222721A GB2222721A (en)	1990-03-14
GB2222721B true GB2222721B (en)	1993-07-28

Family

ID=26517641

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB8918867A Expired - Fee Related GB2222721B (en)	1988-08-23	1989-08-18	Cooling semiconductor devices

Country Status (3)

Country	Link
DE (1)	DE3927866A1 (en)
FR (1)	FR2636777B1 (en)
GB (1)	GB2222721B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5057908A (en) *	1990-07-10	1991-10-15	Iowa State University Research Foundation, Inc.	High power semiconductor device with integral heat sink
EP0520294B1 (en) *	1991-06-24	1998-08-26	Siemens Aktiengesellschaft	Semiconductor device and method of manufacturing the same
US5396403A (en) *	1993-07-06	1995-03-07	Hewlett-Packard Company	Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
FR2754390A1 (en) *	1996-10-07	1998-04-10	Gec Alsthom Transport Sa	POWER MODULE WITH ELECTRICAL SEMICONDUCTOR POWER COMPONENTS AND HIGH POWER SWITCH COMPRISING AT LEAST ONE SUCH POWER MODULE
US6620045B2 (en)	2001-04-20	2003-09-16	King Show Games, Llc	System and method for executing trades for bonus activity in gaming systems
US7704142B2 (en)	2001-04-20	2010-04-27	King Show Games, Inc.	System and method for facilitating trades for bonus activity in gaming systems
JP2006229180A (en) *	2005-01-24	2006-08-31	Toyota Motor Corp	Semiconductor module and semiconductor device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1265007A (en) *	1968-12-09	1972-03-01
US3686748A (en) *	1970-04-13	1972-08-29	William E Engeler	Method and apparatus for providng thermal contact and electrical isolation of integrated circuits
GB1320924A (en) *	1969-07-22	1973-06-20	Gen Electric	Semiconductor device with thermally conductive dielectric barrier
EP0015053A1 (en) *	1979-01-27	1980-09-03	LUCAS INDUSTRIES public limited company	A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
EP0040552A1 (en) *	1980-05-20	1981-11-25	De Beers Industrial Diamond Division (Proprietary) Limited	Heat sinks
EP0153737A2 (en) *	1984-02-27	1985-09-04	Kabushiki Kaisha Toshiba	Circuit substrate having high thermal conductivity
EP0153618A2 (en) *	1984-02-24	1985-09-04	Kabushiki Kaisha Toshiba	Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same
EP0201170A1 (en) *	1985-04-12	1986-11-12	Raymonde Gene Clifford Artus	Heat sink
EP0253295A1 (en) *	1986-07-09	1988-01-20	Tektronix, Inc.	Thermally enhanced LSI integrated circuit package
EP0286690A1 (en) *	1986-08-13	1988-10-19	Hitachi Metals, Ltd.	Aluminum nitride and semiconductor substrate formed therefrom
GB2214719A (en) *	1988-01-26	1989-09-06	Gen Electric Co Plc	Housing for electronic devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2030809A1 (en) *	1970-06-23	1971-12-30	Semikron Gleichrichterbau	Semiconductor arrangement
US4236167A (en) *	1978-02-06	1980-11-25	Rca Corporation	Stepped oxide, high voltage MOS transistor with near intrinsic channel regions of different doping levels
JPS56101777A (en) *	1980-01-18	1981-08-14	Futaba Corp	Mos type semiconductor device
US4256792A (en) *	1980-01-25	1981-03-17	Honeywell Inc.	Composite electronic substrate of alumina uniformly needled through with aluminum nitride
US4620215A (en) *	1982-04-16	1986-10-28	Amdahl Corporation	Integrated circuit packaging systems with double surface heat dissipation
JPS6066843A (en) *	1983-09-22	1985-04-17	Hitachi Ltd	Integrated circuit package
JPS61212045A (en) *	1985-03-18	1986-09-20	Hitachi Ltd	Semiconductor device
JPH07107921B2 (en) *	1985-11-15	1995-11-15	富士通株式会社	Plastic / Package type semiconductor device

1989
- 1989-08-18 GB GB8918867A patent/GB2222721B/en not_active Expired - Fee Related
- 1989-08-22 FR FR8911128A patent/FR2636777B1/en not_active Expired - Fee Related
- 1989-08-23 DE DE19893927866 patent/DE3927866A1/en not_active Withdrawn

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1265007A (en) *	1968-12-09	1972-03-01
GB1320924A (en) *	1969-07-22	1973-06-20	Gen Electric	Semiconductor device with thermally conductive dielectric barrier
US3686748A (en) *	1970-04-13	1972-08-29	William E Engeler	Method and apparatus for providng thermal contact and electrical isolation of integrated circuits
EP0015053A1 (en) *	1979-01-27	1980-09-03	LUCAS INDUSTRIES public limited company	A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
EP0040552A1 (en) *	1980-05-20	1981-11-25	De Beers Industrial Diamond Division (Proprietary) Limited	Heat sinks
EP0153618A2 (en) *	1984-02-24	1985-09-04	Kabushiki Kaisha Toshiba	Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same
EP0153737A2 (en) *	1984-02-27	1985-09-04	Kabushiki Kaisha Toshiba	Circuit substrate having high thermal conductivity
EP0201170A1 (en) *	1985-04-12	1986-11-12	Raymonde Gene Clifford Artus	Heat sink
EP0253295A1 (en) *	1986-07-09	1988-01-20	Tektronix, Inc.	Thermally enhanced LSI integrated circuit package
EP0286690A1 (en) *	1986-08-13	1988-10-19	Hitachi Metals, Ltd.	Aluminum nitride and semiconductor substrate formed therefrom
GB2214719A (en) *	1988-01-26	1989-09-06	Gen Electric Co Plc	Housing for electronic devices

Also Published As

Publication number	Publication date
GB2222721A (en)	1990-03-14
DE3927866A1 (en)	1990-03-08
GB8918867D0 (en)	1989-09-27
FR2636777A1 (en)	1990-03-23
FR2636777B1 (en)	1994-02-11

Publication	Publication Date	Title
GB8609337D0 (en)	1986-05-21	Semiconductor devices
GB8803924D0 (en)	1988-03-23	Semiconductor devices
GB2209870B (en)	1992-02-05	Semiconductor devices
GB8612010D0 (en)	1986-06-25	Semiconductor devices
GB2188479B (en)	1990-05-23	Semiconductor devices
GB2215125B (en)	1991-04-24	Semiconductor device
IL96051A0 (en)	1991-07-18	Cryogenic semiconductor power devices
GB2222721B (en)	1993-07-28	Cooling semiconductor devices
EP0431586A3 (en)	1992-06-03	High-power semiconductor device
GB2228826B (en)	1993-01-27	Semiconductor device
GB8901342D0 (en)	1989-03-15	Semiconductor device
GB8819949D0 (en)	1988-09-21	Semiconductor devices
EP0334759A3 (en)	1990-01-24	Semiconductor device
GB9117667D0 (en)	1991-10-02	Cooling semiconductor devices
GB2246471B (en)	1993-07-28	Cooling semiconductor devices
EP0346120A3 (en)	1990-07-18	Semiconductor device
KR910009358B1 (en)	1991-11-12	Semiconductor devices
GB8719817D0 (en)	1987-09-30	Semiconductor devices
EP0415318A3 (en)	1992-05-27	Semiconductor device
KR930001219B1 (en)	1993-02-22	Semiconductor device
GB8921884D0 (en)	1989-11-15	Heatsink for semiconductor devices
GB8829161D0 (en)	1989-01-25	Semiconductor device manufacture
GB8914554D0 (en)	1989-08-16	Semiconductor device
EP0421404A3 (en)	1992-12-02	Semiconductor device
EP0405501A3 (en)	1991-07-24	Semiconductor device

Legal Events

Date	Code	Title	Description
1996-12-04	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
2005-04-13	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20040818