GB2246471B - Cooling semiconductor devices - Google Patents

Cooling semiconductor devices

Info

Publication number: GB2246471B
Authority: GB; United Kingdom
Prior art keywords: semiconductor devices; cooling semiconductor; cooling; devices; semiconductor
Prior art date: 1988-08-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB9117666A

Other versions

GB2246471A (en

GB9117666D0 (en

Inventor

Nobuo Mikoshiba

Kazuo Tsubouchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-23

Filing date

1991-08-15

Publication date

1993-07-28

1988-08-23 Priority claimed from JP63209765A external-priority patent/JPH07120735B2/en

1988-08-23 Priority claimed from JP63209764A external-priority patent/JPH0258254A/en

1991-08-15 Application filed by Individual filed Critical Individual

1991-08-15 Priority to GB9117666A priority Critical patent/GB2246471B/en

1991-10-02 Publication of GB9117666D0 publication Critical patent/GB9117666D0/en

1992-01-29 Publication of GB2246471A publication Critical patent/GB2246471A/en

1993-07-28 Application granted granted Critical

1993-07-28 Publication of GB2246471B publication Critical patent/GB2246471B/en

2011-08-15 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W40/47—
- H10W40/259—
- H10W90/00—
- H10W72/884—
- H10W90/724—
- H10W90/734—
- H10W90/756—

GB9117666A 1988-08-23 1991-08-15 Cooling semiconductor devices Expired - Fee Related GB2246471B (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
GB9117666A GB2246471B (en)	1988-08-23	1991-08-15	Cooling semiconductor devices

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP63209765A JPH07120735B2 (en)	1988-08-23	1988-08-23	Semiconductor chip
JP63209764A JPH0258254A (en)	1988-08-23	1988-08-23	Semiconductor element
GB9117666A GB2246471B (en)	1988-08-23	1991-08-15	Cooling semiconductor devices

Publications (3)

Publication Number	Publication Date
GB9117666D0 GB9117666D0 (en)	1991-10-02
GB2246471A GB2246471A (en)	1992-01-29
GB2246471B true GB2246471B (en)	1993-07-28

Family

ID=27265826

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB9117666A Expired - Fee Related GB2246471B (en)	1988-08-23	1991-08-15	Cooling semiconductor devices

Country Status (1)

Country	Link
GB (1)	GB2246471B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2276032B (en) *	1993-03-08	1997-04-16	Prp Optoelectronics Limited	High intensity light source
US7067406B2 (en)	1997-03-31	2006-06-27	Intel Corporation	Thermal conducting trench in a semiconductor structure and method for forming the same
US6222254B1 (en)	1997-03-31	2001-04-24	Intel Corporation	Thermal conducting trench in a semiconductor structure and method for forming the same
US6785137B2 (en)	2002-07-26	2004-08-31	Stmicroelectronics, Inc.	Method and system for removing heat from an active area of an integrated circuit device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3567506A (en) *	1968-03-22	1971-03-02	Hughes Aircraft Co	Method for providing a planar transistor with heat-dissipating top base and emitter contacts
US3609474A (en) *	1969-11-10	1971-09-28	Texas Instruments Inc	Semiconductor with improved heat dissipation characteristics
GB1587865A (en) *	1976-12-06	1981-04-08	Ibm	Electrical components
WO1983002527A1 (en) *	1982-01-07	1983-07-21	Ncr Co	Holding device for an integrated circuit chip
EP0201170A1 (en) *	1985-04-12	1986-11-12	Raymonde Gene Clifford Artus	Heat sink
EP0224141A2 (en) *	1985-11-21	1987-06-03	General Electric Company	Improved semiconductor power devices
US4715430A (en) *	1986-10-27	1987-12-29	International Business Machines Corporation	Environmentally secure and thermally efficient heat sink assembly
US4730665A (en) *	1983-07-14	1988-03-15	Technology Enterprises Company	Apparatus for cooling high-density integrated circuit packages
GB2214719A (en) *	1988-01-26	1989-09-06	Gen Electric Co Plc	Housing for electronic devices
EP0368743A2 (en) *	1988-11-10	1990-05-16	Mcnc	High performance integrated circuit chip package and method of making same

1991
- 1991-08-15 GB GB9117666A patent/GB2246471B/en not_active Expired - Fee Related

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3567506A (en) *	1968-03-22	1971-03-02	Hughes Aircraft Co	Method for providing a planar transistor with heat-dissipating top base and emitter contacts
US3609474A (en) *	1969-11-10	1971-09-28	Texas Instruments Inc	Semiconductor with improved heat dissipation characteristics
GB1587865A (en) *	1976-12-06	1981-04-08	Ibm	Electrical components
WO1983002527A1 (en) *	1982-01-07	1983-07-21	Ncr Co	Holding device for an integrated circuit chip
US4730665A (en) *	1983-07-14	1988-03-15	Technology Enterprises Company	Apparatus for cooling high-density integrated circuit packages
EP0201170A1 (en) *	1985-04-12	1986-11-12	Raymonde Gene Clifford Artus	Heat sink
EP0224141A2 (en) *	1985-11-21	1987-06-03	General Electric Company	Improved semiconductor power devices
US4715430A (en) *	1986-10-27	1987-12-29	International Business Machines Corporation	Environmentally secure and thermally efficient heat sink assembly
GB2214719A (en) *	1988-01-26	1989-09-06	Gen Electric Co Plc	Housing for electronic devices
EP0368743A2 (en) *	1988-11-10	1990-05-16	Mcnc	High performance integrated circuit chip package and method of making same

Also Published As

Publication number	Publication date
GB2246471A (en)	1992-01-29
GB9117666D0 (en)	1991-10-02

Publication	Publication Date	Title
GB8609337D0 (en)	1986-05-21	Semiconductor devices
GB8803924D0 (en)	1988-03-23	Semiconductor devices
GB2209870B (en)	1992-02-05	Semiconductor devices
GB8612010D0 (en)	1986-06-25	Semiconductor devices
GB2188479B (en)	1990-05-23	Semiconductor devices
GB2215125B (en)	1991-04-24	Semiconductor device
IL96051A (en)	1993-08-18	Cryogenic semiconductor power devices
GB2222721B (en)	1993-07-28	Cooling semiconductor devices
EP0431586A3 (en)	1992-06-03	High-power semiconductor device
GB2228826B (en)	1993-01-27	Semiconductor device
GB8901342D0 (en)	1989-03-15	Semiconductor device
GB8819949D0 (en)	1988-09-21	Semiconductor devices
EP0334759A3 (en)	1990-01-24	Semiconductor device
GB9117667D0 (en)	1991-10-02	Cooling semiconductor devices
GB2246471B (en)	1993-07-28	Cooling semiconductor devices
EP0346120A3 (en)	1990-07-18	Semiconductor device
KR910009358B1 (en)	1991-11-12	Semiconductor devices
GB8719817D0 (en)	1987-09-30	Semiconductor devices
EP0415318A3 (en)	1992-05-27	Semiconductor device
KR930001219B1 (en)	1993-02-22	Semiconductor device
GB8921884D0 (en)	1989-11-15	Heatsink for semiconductor devices
GB8829161D0 (en)	1989-01-25	Semiconductor device manufacture
EP0421404A3 (en)	1992-12-02	Semiconductor device
EP0405501A3 (en)	1991-07-24	Semiconductor device
GB8914554D0 (en)	1989-08-16	Semiconductor device

Legal Events

Date	Code	Title	Description
1996-12-04	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
2005-04-13	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20040818