GB2200135B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- GB2200135B GB2200135B GB08803057A GB8803057A GB2200135B GB 2200135 B GB2200135 B GB 2200135B GB 08803057 A GB08803057 A GB 08803057A GB 8803057 A GB8803057 A GB 8803057A GB 2200135 B GB2200135 B GB 2200135B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/45164—Palladium (Pd) as principal constituent
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- H10W70/682—
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- H10W72/07141—
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- H10W72/073—
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- H10W72/07336—
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- H10W72/075—
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- H10W72/07533—
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- H10W72/325—
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- H10W72/352—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5522—
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- H10W72/5524—
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- H10W72/884—
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- H10W74/00—
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- H10W90/734—
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- H10W90/736—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59032434A JPS60177637A (en) | 1984-02-24 | 1984-02-24 | Semiconductor device |
| JP59032433A JPS60177666A (en) | 1984-02-24 | 1984-02-24 | Semiconductor device |
| JP59032435A JPS60177667A (en) | 1984-02-24 | 1984-02-24 | Semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8803057D0 GB8803057D0 (en) | 1988-03-09 |
| GB2200135A GB2200135A (en) | 1988-07-27 |
| GB2200135B true GB2200135B (en) | 1988-11-30 |
Family
ID=27287695
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08803057A Expired GB2200135B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
| GB08803056A Expired GB2199846B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
| GB08504656A Expired GB2155036B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08803056A Expired GB2199846B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
| GB08504656A Expired GB2155036B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| DE (1) | DE3506264A1 (en) |
| FR (1) | FR2561446B1 (en) |
| GB (3) | GB2200135B (en) |
| HK (3) | HK94990A (en) |
| IT (1) | IT1183375B (en) |
| MY (1) | MY101028A (en) |
| SG (1) | SG82790G (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8349462B2 (en) | 2009-01-16 | 2013-01-08 | Alcoa Inc. | Aluminum alloys, aluminum alloy products and methods for making the same |
| EP4131349A4 (en) * | 2020-03-25 | 2023-12-27 | Nippon Micrometal Corporation | ALUMINUM CONNECTION WIRE |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1297872B (en) * | 1966-07-30 | 1969-06-19 | Aluminium Giesserei Villingen | Use of an aluminum casting alloy for the production of highly electrically conductive cast parts |
| CH524225A (en) * | 1968-05-21 | 1972-06-15 | Southwire Co | Aluminum alloy wire or bar |
| DE2029584A1 (en) * | 1969-06-18 | 1970-12-23 | Kaiser Aluminum & Chemical Corp., Oakland, Calif. (V.St.A.) | Method of manufacturing an electrical conductor using aluminum |
| ZA723663B (en) * | 1971-06-07 | 1973-03-28 | Southwire Co | Aluminum nickel alloy electrical conductor |
| DE2143808A1 (en) * | 1971-09-01 | 1973-03-08 | Siemens Ag | ELECTRICALLY CONDUCTIVE CONNECTION BETWEEN THE METALS GOLD AND ALUMINUM |
| BE791269R (en) * | 1971-11-11 | 1973-03-01 | Southwire Co | ALUMINUM ALLOY TREFILE PRODUCTS AND PROCESS FOR THE |
| CA1037742A (en) * | 1973-07-23 | 1978-09-05 | Enrique C. Chia | High iron aluminum alloy |
| NO146166C (en) * | 1974-08-01 | 1982-08-11 | Southwire Co | COMPOSITION ELECTRICAL POWER PIPE |
| FR2289035A1 (en) * | 1974-08-29 | 1976-05-21 | Trefimetaux | ELECTRICAL CONDUCTORS IN ALUMINUM ALLOYS AND PROCESS FOR OBTAINING |
| JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
| GB1510940A (en) * | 1975-12-09 | 1978-05-17 | Southwire Co | Aluminium-iron-nickel alloy electrical conductor |
| DE2625092A1 (en) * | 1976-06-04 | 1977-12-15 | Demetron | Contact sheet for semiconductor devices - comprising sandwich of metal of specified conductivity with softer outer layers |
| DE2929623C2 (en) * | 1979-07-21 | 1981-11-26 | W.C. Heraeus Gmbh, 6450 Hanau | Fine wire made from an aluminum alloy |
| DE3023528C2 (en) * | 1980-06-24 | 1984-11-29 | W.C. Heraeus Gmbh, 6450 Hanau | Fine wire containing aluminum |
| NL184184C (en) * | 1981-03-20 | 1989-05-01 | Philips Nv | METHOD FOR APPLYING CONTACT INCREASES TO CONTACT PLACES OF AN ELECTRONIC MICROCKETES |
| JPS58154241A (en) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | Electric apparatus and preparation thereof and bonding wire used thereto and preparation thereof |
| JPS5928553A (en) * | 1982-08-11 | 1984-02-15 | Hitachi Ltd | Corrosion resistant aluminum electronic material |
| FR2555813B1 (en) * | 1983-09-28 | 1986-06-20 | Hitachi Ltd | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE |
-
1985
- 1985-02-20 IT IT19571/85A patent/IT1183375B/en active
- 1985-02-22 GB GB08803057A patent/GB2200135B/en not_active Expired
- 1985-02-22 DE DE19853506264 patent/DE3506264A1/en not_active Withdrawn
- 1985-02-22 GB GB08803056A patent/GB2199846B/en not_active Expired
- 1985-02-22 GB GB08504656A patent/GB2155036B/en not_active Expired
- 1985-05-09 FR FR8506995A patent/FR2561446B1/en not_active Expired
-
1987
- 1987-09-25 MY MYPI87001951A patent/MY101028A/en unknown
-
1990
- 1990-10-11 SG SG827/90A patent/SG82790G/en unknown
- 1990-11-15 HK HK949/90A patent/HK94990A/en not_active IP Right Cessation
- 1990-11-15 HK HK951/90A patent/HK95190A/en not_active IP Right Cessation
- 1990-11-15 HK HK950/90A patent/HK95090A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| GB2155036A (en) | 1985-09-18 |
| HK94990A (en) | 1990-11-23 |
| IT8519571A0 (en) | 1985-02-20 |
| DE3506264A1 (en) | 1985-08-29 |
| GB2199846A (en) | 1988-07-20 |
| GB2199846B (en) | 1988-11-30 |
| HK95190A (en) | 1990-11-23 |
| MY101028A (en) | 1991-06-29 |
| GB2200135A (en) | 1988-07-27 |
| HK95090A (en) | 1990-11-23 |
| GB8803056D0 (en) | 1988-03-09 |
| SG82790G (en) | 1990-11-23 |
| GB2155036B (en) | 1988-11-09 |
| GB8504656D0 (en) | 1985-03-27 |
| IT1183375B (en) | 1987-10-22 |
| FR2561446A1 (en) | 1985-09-20 |
| FR2561446B1 (en) | 1987-02-06 |
| GB8803057D0 (en) | 1988-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19970222 |