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GB2200135B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB2200135B
GB2200135B GB08803057A GB8803057A GB2200135B GB 2200135 B GB2200135 B GB 2200135B GB 08803057 A GB08803057 A GB 08803057A GB 8803057 A GB8803057 A GB 8803057A GB 2200135 B GB2200135 B GB 2200135B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08803057A
Other versions
GB2200135A (en
GB8803057D0 (en
Inventor
Susumu Okikaway
Hiroshi Mikino
Hiromichi Suzuki
Wahei Kitamura
Daiji Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59032434A external-priority patent/JPS60177637A/en
Priority claimed from JP59032433A external-priority patent/JPS60177666A/en
Priority claimed from JP59032435A external-priority patent/JPS60177667A/en
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB8803057D0 publication Critical patent/GB8803057D0/en
Publication of GB2200135A publication Critical patent/GB2200135A/en
Application granted granted Critical
Publication of GB2200135B publication Critical patent/GB2200135B/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45164Palladium (Pd) as principal constituent
    • H10W70/682
    • H10W72/07141
    • H10W72/073
    • H10W72/07336
    • H10W72/075
    • H10W72/07533
    • H10W72/325
    • H10W72/352
    • H10W72/536
    • H10W72/5363
    • H10W72/5522
    • H10W72/5524
    • H10W72/884
    • H10W74/00
    • H10W90/734
    • H10W90/736
    • H10W90/754
    • H10W90/756

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
GB08803057A 1984-02-24 1985-02-22 Semiconductor device Expired GB2200135B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59032434A JPS60177637A (en) 1984-02-24 1984-02-24 Semiconductor device
JP59032433A JPS60177666A (en) 1984-02-24 1984-02-24 Semiconductor device
JP59032435A JPS60177667A (en) 1984-02-24 1984-02-24 Semiconductor device

Publications (3)

Publication Number Publication Date
GB8803057D0 GB8803057D0 (en) 1988-03-09
GB2200135A GB2200135A (en) 1988-07-27
GB2200135B true GB2200135B (en) 1988-11-30

Family

ID=27287695

Family Applications (3)

Application Number Title Priority Date Filing Date
GB08803057A Expired GB2200135B (en) 1984-02-24 1985-02-22 Semiconductor device
GB08803056A Expired GB2199846B (en) 1984-02-24 1985-02-22 Semiconductor device
GB08504656A Expired GB2155036B (en) 1984-02-24 1985-02-22 Semiconductor device

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB08803056A Expired GB2199846B (en) 1984-02-24 1985-02-22 Semiconductor device
GB08504656A Expired GB2155036B (en) 1984-02-24 1985-02-22 Semiconductor device

Country Status (7)

Country Link
DE (1) DE3506264A1 (en)
FR (1) FR2561446B1 (en)
GB (3) GB2200135B (en)
HK (3) HK94990A (en)
IT (1) IT1183375B (en)
MY (1) MY101028A (en)
SG (1) SG82790G (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8349462B2 (en) 2009-01-16 2013-01-08 Alcoa Inc. Aluminum alloys, aluminum alloy products and methods for making the same
EP4131349A4 (en) * 2020-03-25 2023-12-27 Nippon Micrometal Corporation ALUMINUM CONNECTION WIRE

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1297872B (en) * 1966-07-30 1969-06-19 Aluminium Giesserei Villingen Use of an aluminum casting alloy for the production of highly electrically conductive cast parts
CH524225A (en) * 1968-05-21 1972-06-15 Southwire Co Aluminum alloy wire or bar
DE2029584A1 (en) * 1969-06-18 1970-12-23 Kaiser Aluminum & Chemical Corp., Oakland, Calif. (V.St.A.) Method of manufacturing an electrical conductor using aluminum
ZA723663B (en) * 1971-06-07 1973-03-28 Southwire Co Aluminum nickel alloy electrical conductor
DE2143808A1 (en) * 1971-09-01 1973-03-08 Siemens Ag ELECTRICALLY CONDUCTIVE CONNECTION BETWEEN THE METALS GOLD AND ALUMINUM
BE791269R (en) * 1971-11-11 1973-03-01 Southwire Co ALUMINUM ALLOY TREFILE PRODUCTS AND PROCESS FOR THE
CA1037742A (en) * 1973-07-23 1978-09-05 Enrique C. Chia High iron aluminum alloy
NO146166C (en) * 1974-08-01 1982-08-11 Southwire Co COMPOSITION ELECTRICAL POWER PIPE
FR2289035A1 (en) * 1974-08-29 1976-05-21 Trefimetaux ELECTRICAL CONDUCTORS IN ALUMINUM ALLOYS AND PROCESS FOR OBTAINING
JPS5251867A (en) * 1975-10-23 1977-04-26 Nec Corp Bonding wire for semiconductor device
GB1510940A (en) * 1975-12-09 1978-05-17 Southwire Co Aluminium-iron-nickel alloy electrical conductor
DE2625092A1 (en) * 1976-06-04 1977-12-15 Demetron Contact sheet for semiconductor devices - comprising sandwich of metal of specified conductivity with softer outer layers
DE2929623C2 (en) * 1979-07-21 1981-11-26 W.C. Heraeus Gmbh, 6450 Hanau Fine wire made from an aluminum alloy
DE3023528C2 (en) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Fine wire containing aluminum
NL184184C (en) * 1981-03-20 1989-05-01 Philips Nv METHOD FOR APPLYING CONTACT INCREASES TO CONTACT PLACES OF AN ELECTRONIC MICROCKETES
JPS58154241A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Electric apparatus and preparation thereof and bonding wire used thereto and preparation thereof
JPS5928553A (en) * 1982-08-11 1984-02-15 Hitachi Ltd Corrosion resistant aluminum electronic material
FR2555813B1 (en) * 1983-09-28 1986-06-20 Hitachi Ltd SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

Also Published As

Publication number Publication date
GB2155036A (en) 1985-09-18
HK94990A (en) 1990-11-23
IT8519571A0 (en) 1985-02-20
DE3506264A1 (en) 1985-08-29
GB2199846A (en) 1988-07-20
GB2199846B (en) 1988-11-30
HK95190A (en) 1990-11-23
MY101028A (en) 1991-06-29
GB2200135A (en) 1988-07-27
HK95090A (en) 1990-11-23
GB8803056D0 (en) 1988-03-09
SG82790G (en) 1990-11-23
GB2155036B (en) 1988-11-09
GB8504656D0 (en) 1985-03-27
IT1183375B (en) 1987-10-22
FR2561446A1 (en) 1985-09-20
FR2561446B1 (en) 1987-02-06
GB8803057D0 (en) 1988-03-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19970222