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GB2299895B - polishing apparatus for planarizing layer on a semiconductor wafer - Google Patents

polishing apparatus for planarizing layer on a semiconductor wafer

Info

Publication number
GB2299895B
GB2299895B GB9611070A GB9611070A GB2299895B GB 2299895 B GB2299895 B GB 2299895B GB 9611070 A GB9611070 A GB 9611070A GB 9611070 A GB9611070 A GB 9611070A GB 2299895 B GB2299895 B GB 2299895B
Authority
GB
United Kingdom
Prior art keywords
semiconductor wafer
polishing apparatus
planarizing layer
planarizing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9611070A
Other versions
GB2299895A (en
GB9611070D0 (en
Inventor
Masako Kodera
Atsushi Shigeta
Hiromi Yajima
Hiroyuki Yano
Riichirou Aoki
Haruo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13297892A external-priority patent/JP3335667B2/en
Priority claimed from JP25688992A external-priority patent/JP3187554B2/en
Priority claimed from JP4331945A external-priority patent/JPH06181192A/en
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority claimed from GB9326510A external-priority patent/GB2275130B/en
Publication of GB9611070D0 publication Critical patent/GB9611070D0/en
Publication of GB2299895A publication Critical patent/GB2299895A/en
Application granted granted Critical
Publication of GB2299895B publication Critical patent/GB2299895B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H10P74/238—
    • H10P95/062—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB9611070A 1992-05-26 1993-05-26 polishing apparatus for planarizing layer on a semiconductor wafer Expired - Lifetime GB2299895B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP13297892A JP3335667B2 (en) 1992-05-26 1992-05-26 Method for manufacturing semiconductor device
JP25688992A JP3187554B2 (en) 1992-09-25 1992-09-25 Method for manufacturing semiconductor device
JP28119492 1992-10-20
JP31917592 1992-11-30
JP4331945A JPH06181192A (en) 1992-12-11 1992-12-11 Fabrication of semiconductor device
GB9326510A GB2275130B (en) 1992-05-26 1993-05-26 Polishing apparatus and method for planarizing layer on a semiconductor wafer

Publications (3)

Publication Number Publication Date
GB9611070D0 GB9611070D0 (en) 1996-07-31
GB2299895A GB2299895A (en) 1996-10-16
GB2299895B true GB2299895B (en) 1997-01-08

Family

ID=27547212

Family Applications (3)

Application Number Title Priority Date Filing Date
GB9611090A Expired - Lifetime GB2298960B (en) 1992-05-26 1993-05-26 Polishing apparatus and method for planarizing layer on a semiconductor wafer
GB9611104A Expired - Lifetime GB2298961B (en) 1992-05-26 1993-05-26 Polishing apparatus for planarizing layer on a semiconductor wafer
GB9611070A Expired - Lifetime GB2299895B (en) 1992-05-26 1993-05-26 polishing apparatus for planarizing layer on a semiconductor wafer

Family Applications Before (2)

Application Number Title Priority Date Filing Date
GB9611090A Expired - Lifetime GB2298960B (en) 1992-05-26 1993-05-26 Polishing apparatus and method for planarizing layer on a semiconductor wafer
GB9611104A Expired - Lifetime GB2298961B (en) 1992-05-26 1993-05-26 Polishing apparatus for planarizing layer on a semiconductor wafer

Country Status (1)

Country Link
GB (3) GB2298960B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6283828B1 (en) 1998-11-09 2001-09-04 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus
EP1052060A3 (en) * 1999-05-03 2001-04-18 Applied Materials, Inc. Method for chemical mechanical planarization
JP2002126998A (en) * 2000-10-26 2002-05-08 Hitachi Ltd Polishing method and polishing apparatus
JP2003124171A (en) 2001-10-19 2003-04-25 Nec Corp Polishing method and polishing apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1319882A (en) * 1970-10-21 1973-06-13 Monsanto Co Polishing thin elements
GB1499490A (en) * 1975-07-14 1978-02-01 Wacker Chemitronic Polishing semi-conductor surfaces
EP0537627A2 (en) * 1991-10-15 1993-04-21 Texas Instruments Incorporated Semiconductor wafer planarization

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4671851A (en) * 1985-10-28 1987-06-09 International Business Machines Corporation Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1319882A (en) * 1970-10-21 1973-06-13 Monsanto Co Polishing thin elements
GB1499490A (en) * 1975-07-14 1978-02-01 Wacker Chemitronic Polishing semi-conductor surfaces
EP0537627A2 (en) * 1991-10-15 1993-04-21 Texas Instruments Incorporated Semiconductor wafer planarization

Also Published As

Publication number Publication date
GB2298961B (en) 1997-01-08
GB2298960B (en) 1997-01-08
GB2299895A (en) 1996-10-16
GB2298960A (en) 1996-09-18
GB9611104D0 (en) 1996-07-31
GB2298961A (en) 1996-09-18
GB9611070D0 (en) 1996-07-31
GB9611090D0 (en) 1996-07-31

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20130525