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GB1319882A - Polishing thin elements - Google Patents

Polishing thin elements

Info

Publication number
GB1319882A
GB1319882A GB4880571A GB4880571A GB1319882A GB 1319882 A GB1319882 A GB 1319882A GB 4880571 A GB4880571 A GB 4880571A GB 4880571 A GB4880571 A GB 4880571A GB 1319882 A GB1319882 A GB 1319882A
Authority
GB
United Kingdom
Prior art keywords
wafer
polishing
pad
friction
polishing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4880571A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of GB1319882A publication Critical patent/GB1319882A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P90/129—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

1319882 Polishing MONSANTO CO 20 Oct 1971 [21 Oct 1970] 48805/71 Heading B3D A process for polishing a wafer 44, such as a semi-conductor, comprises pressing the wafer between a mounting pad 40 and a polishing surface 17, the coefficient of static friction between the wafer and mounting pad being greater than the coefficient of static and dynamic friction between the wafer and the polishing surface, and producing relative motion between the polishing surface and the wafer, the wafer remaining fixed with respect to the mounting pad as a result of the different coefficients of friction. In apparatus for carrying out the method, the polishing surface is of poromeric material such as fibre reinforced polyurethane foam mounted with its substrate surface exposed on a turn-table 14 spaced from an outer wall 12 whereby a space 16 therebetween permits a polishing agent, such as silica sol supplied in droplets 50 to flow freely away from the table. The mounting pad 42 is also of poromeric material and is secured to a disc 40 with its front surface, i.e. its high friction surface which is a coating of unreinforced microporous polyurethane exposed. The disc is mounted by a spherical bearing 36 on a pin 32 extending from an arm 22 carried by a shaft 24 controlled for vertical and horizontal movement. The wafer 44 is initially held by surface tension on the pad 42 and is then pressed against the polishing surface 17, the higher friction retaining the wafer on the pad as it is rotated by the rotation of the turn-table. In another embodiment, the polishing surface has an outer annular area 18, Fig. 3, of low friction poromeric substrate material and an inner area of higher friction material such as polyester reinforced polyurethane with its front surface exposed. In the first embodiment, after polishing, the wafer is removed from the pad by a suction tool, whereas, in the second embodiment, at the end of polishing by the surface 20, a rotational impulse of the turn-table releases the wafer from the pad. More than one wafer may be polished at the same time by having a plurality of mounting pads carried by pins on arms extending from the arm 22. The wafer may be a refractory oxide or magnetic bubble material.
GB4880571A 1970-10-21 1971-10-20 Polishing thin elements Expired GB1319882A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8267370A 1970-10-21 1970-10-21

Publications (1)

Publication Number Publication Date
GB1319882A true GB1319882A (en) 1973-06-13

Family

ID=22172673

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4880571A Expired GB1319882A (en) 1970-10-21 1971-10-20 Polishing thin elements

Country Status (5)

Country Link
JP (1) JPS545160B1 (en)
BE (1) BE774209A (en)
DE (1) DE2152318A1 (en)
GB (1) GB1319882A (en)
NL (1) NL7114274A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2241607A (en) * 1990-03-01 1991-09-04 Intel Corp Method of planarizing a dielectric formed over a semiconductor substrate
GB2287422A (en) * 1994-03-16 1995-09-20 Nec Corp Conditioning by abrading of polishing cloth for semiconductor devices
GB2299895A (en) * 1992-05-26 1996-10-16 Toshiba Kk Semiconductor wafer polishing
US6358114B1 (en) 1995-06-16 2002-03-19 Optical Generics Limited Method and apparatus for optical polishing

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531582A (en) * 1978-08-15 1980-03-05 Ibm Free polishing device
JPS57149373U (en) * 1981-03-16 1982-09-20
JPS5871593U (en) * 1981-11-04 1983-05-14 三菱重工業株式会社 water cooled heat exchanger
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2241607A (en) * 1990-03-01 1991-09-04 Intel Corp Method of planarizing a dielectric formed over a semiconductor substrate
US5104828A (en) * 1990-03-01 1992-04-14 Intel Corporation Method of planarizing a dielectric formed over a semiconductor substrate
GB2241607B (en) * 1990-03-01 1994-01-12 Intel Corp Method of planarizing a dielectric formed over a semiconductor substrate
GB2299895A (en) * 1992-05-26 1996-10-16 Toshiba Kk Semiconductor wafer polishing
GB2299895B (en) * 1992-05-26 1997-01-08 Toshiba Kk polishing apparatus for planarizing layer on a semiconductor wafer
GB2287422A (en) * 1994-03-16 1995-09-20 Nec Corp Conditioning by abrading of polishing cloth for semiconductor devices
US5626509A (en) * 1994-03-16 1997-05-06 Nec Corporation Surface treatment of polishing cloth
GB2287422B (en) * 1994-03-16 1997-08-27 Nec Corp Surface treatment of polishing cloth
US6358114B1 (en) 1995-06-16 2002-03-19 Optical Generics Limited Method and apparatus for optical polishing

Also Published As

Publication number Publication date
DE2152318A1 (en) 1972-04-27
BE774209A (en) 1972-04-20
NL7114274A (en) 1972-04-25
JPS545160B1 (en) 1979-03-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee