GB2276033B - Integrated circuits - Google Patents
Integrated circuitsInfo
- Publication number
- GB2276033B GB2276033B GB9404559A GB9404559A GB2276033B GB 2276033 B GB2276033 B GB 2276033B GB 9404559 A GB9404559 A GB 9404559A GB 9404559 A GB9404559 A GB 9404559A GB 2276033 B GB2276033 B GB 2276033B
- Authority
- GB
- United Kingdom
- Prior art keywords
- integrated circuits
- circuits
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W76/157—
-
- H10W90/00—
-
- H10W70/682—
-
- H10W76/63—
-
- H10W90/754—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB939304956A GB9304956D0 (en) | 1993-03-11 | 1993-03-11 | Integrated circuits |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9404559D0 GB9404559D0 (en) | 1994-04-20 |
| GB2276033A GB2276033A (en) | 1994-09-14 |
| GB2276033B true GB2276033B (en) | 1996-08-07 |
Family
ID=10731843
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB939304956A Pending GB9304956D0 (en) | 1993-03-11 | 1993-03-11 | Integrated circuits |
| GB9404559A Expired - Fee Related GB2276033B (en) | 1993-03-11 | 1994-03-09 | Integrated circuits |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB939304956A Pending GB9304956D0 (en) | 1993-03-11 | 1993-03-11 | Integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB9304956D0 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6364542B1 (en) * | 2000-05-09 | 2002-04-02 | National Semiconductor Corporation | Device and method for providing a true semiconductor die to external fiber optic cable connection |
| US6655854B1 (en) | 2001-08-03 | 2003-12-02 | National Semiconductor Corporation | Optoelectronic package with dam structure to provide fiber standoff |
| GB2379330A (en) * | 2001-08-29 | 2003-03-05 | Motorola Inc | Package for electronic components and method for forming a package for electronic components |
| US7001083B1 (en) | 2001-09-21 | 2006-02-21 | National Semiconductor Corporation | Technique for protecting photonic devices in optoelectronic packages with clear overmolding |
| US6906416B2 (en) * | 2002-10-08 | 2005-06-14 | Chippac, Inc. | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| US7102220B2 (en) * | 2003-08-19 | 2006-09-05 | Delaware Capital Formation, Inc. | Multiple cavity/compartment package |
-
1993
- 1993-03-11 GB GB939304956A patent/GB9304956D0/en active Pending
-
1994
- 1994-03-09 GB GB9404559A patent/GB2276033B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB2276033A (en) | 1994-09-14 |
| GB9404559D0 (en) | 1994-04-20 |
| GB9304956D0 (en) | 1993-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |