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GB2271073B - Method of producing a semiconductor device - Google Patents

Method of producing a semiconductor device

Info

Publication number
GB2271073B
GB2271073B GB9323785A GB9323785A GB2271073B GB 2271073 B GB2271073 B GB 2271073B GB 9323785 A GB9323785 A GB 9323785A GB 9323785 A GB9323785 A GB 9323785A GB 2271073 B GB2271073 B GB 2271073B
Authority
GB
United Kingdom
Prior art keywords
ball
copper
electrode pad
less
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9323785A
Other versions
GB9323785D0 (en
GB2271073A (en
Inventor
Kiyoaki Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001467A external-priority patent/JPH03208355A/en
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9323785D0 publication Critical patent/GB9323785D0/en
Publication of GB2271073A publication Critical patent/GB2271073A/en
Application granted granted Critical
Publication of GB2271073B publication Critical patent/GB2271073B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/019—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/352—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W72/983—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)

Abstract

Electrical connection to an A1 electrode of a semiconductor is made by the attachment of a copper wire. A copper ball 8a formed by flaming out one end of a copper wire 8 is moved downward to an A1 electrode pad 5 on a semiconductor chip and brought into contact for less than 150 ms. Plastic deformation then occurs so that the copper ball is pressed to the aluminium electrode pad in such a manner that the height of the copper ball (h, Fig. 8) is 25 mu m or less. It is therefore possible to decrease the work hardening property of the Cu ball and prevent A1 exclusion when the Cu ball is bonded to the A1 electrode pad. <IMAGE>
GB9323785A 1990-01-10 1993-11-18 Method of producing a semiconductor device Expired - Fee Related GB2271073B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001467A JPH03208355A (en) 1990-01-10 1990-01-10 Semiconductor device and manufacture thereof
GB9010385A GB2239829B (en) 1990-01-10 1990-05-09 Semiconductor device and method of producing the same
SG155894A SG155894G (en) 1990-01-10 1994-10-21 Semiconductor device and method of producing the same

Publications (3)

Publication Number Publication Date
GB9323785D0 GB9323785D0 (en) 1994-01-05
GB2271073A GB2271073A (en) 1994-04-06
GB2271073B true GB2271073B (en) 1994-06-29

Family

ID=27265081

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9323785A Expired - Fee Related GB2271073B (en) 1990-01-10 1993-11-18 Method of producing a semiconductor device

Country Status (1)

Country Link
GB (1) GB2271073B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444349A (en) * 1981-05-04 1984-04-24 Kulicke & Soffa Industries, Inc. Wire bonding apparatus
GB2174032A (en) * 1985-03-01 1986-10-29 Mitsubishi Electric Corp Ball-type bonding wires for semiconductor devices and method for producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444349A (en) * 1981-05-04 1984-04-24 Kulicke & Soffa Industries, Inc. Wire bonding apparatus
GB2174032A (en) * 1985-03-01 1986-10-29 Mitsubishi Electric Corp Ball-type bonding wires for semiconductor devices and method for producing same

Also Published As

Publication number Publication date
GB9323785D0 (en) 1994-01-05
GB2271073A (en) 1994-04-06

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19950519

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080509