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GB2285943B - Bonding tool for electronic device - Google Patents

Bonding tool for electronic device

Info

Publication number
GB2285943B
GB2285943B GB9501151A GB9501151A GB2285943B GB 2285943 B GB2285943 B GB 2285943B GB 9501151 A GB9501151 A GB 9501151A GB 9501151 A GB9501151 A GB 9501151A GB 2285943 B GB2285943 B GB 2285943B
Authority
GB
United Kingdom
Prior art keywords
gold
bonding tool
bonding
aluminum oxide
oxide ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9501151A
Other versions
GB9501151D0 (en
GB2285943A (en
Inventor
Lawrence E Linn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of GB9501151D0 publication Critical patent/GB9501151D0/en
Publication of GB2285943A publication Critical patent/GB2285943A/en
Application granted granted Critical
Publication of GB2285943B publication Critical patent/GB2285943B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/077—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H10W72/0711—
    • H10W99/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
    • H10W72/07141—
    • H10W72/07533—
    • H10W72/522—
    • H10W72/5522—
    • H10W72/701—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

An ultrasonic bonding tool (102) for use in tape automated bonding and wedge bonding of gold and gold plated leads, or wires to contact pads of electronic devices is fabricated of hard material such as Aluminum Oxide ceramic without electrically conductive metallic binders and has a microscopically rough contact surface (106). The Aluminum Oxide ceramic bonding tool (102) is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions, and is not readily abraded by the gold leads. The roughness pattern may be parallel lines (Fig. 2B, not shown) or circular (Figs. 3B, 3C, not shown). <IMAGE>
GB9501151A 1994-01-28 1995-01-20 Bonding tool for electronic device Expired - Fee Related GB2285943B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18828294A 1994-01-28 1994-01-28

Publications (3)

Publication Number Publication Date
GB9501151D0 GB9501151D0 (en) 1995-03-08
GB2285943A GB2285943A (en) 1995-08-02
GB2285943B true GB2285943B (en) 1996-09-11

Family

ID=22692510

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9501151A Expired - Fee Related GB2285943B (en) 1994-01-28 1995-01-20 Bonding tool for electronic device

Country Status (2)

Country Link
JP (1) JPH07263496A (en)
GB (1) GB2285943B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5816472A (en) * 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
US6612479B2 (en) 2001-10-10 2003-09-02 Ford Global Technologies, Llc Apparatus and method for joining layers of materials
US6691909B2 (en) 2001-10-10 2004-02-17 Ford Global Technologies, Llc Sonotrode for ultrasonic welding apparatus
US6523732B1 (en) * 2001-10-10 2003-02-25 Ford Global Technologies, Inc. Ultrasonic welding apparatus
US7597231B2 (en) 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps
KR101221928B1 (en) * 2007-07-24 2013-01-14 스몰 프리시젼 툴즈 인코포레이티드 Wire bonding capillary tool having multiple outer steps
CN111822842A (en) * 2020-07-14 2020-10-27 中车株洲电机有限公司 Ultrasonic welding method
CN114309920A (en) * 2021-12-23 2022-04-12 潮州三环（集团）股份有限公司 Ceramic cleaver and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0268230A2 (en) * 1986-11-20 1988-05-25 Air Products And Chemicals, Inc. Silicon carbide capillaries
US4776509A (en) * 1986-10-13 1988-10-11 Microelectronics And Computer Technology Corporation Single point bonding method and apparatus
US5147082A (en) * 1987-08-17 1992-09-15 Siemens Aktiengesellschaft Tool configuration for ultrasonic welding
US5180093A (en) * 1991-09-05 1993-01-19 Cray Research, Inc. Apparatus for ultrasonic bonding

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776509A (en) * 1986-10-13 1988-10-11 Microelectronics And Computer Technology Corporation Single point bonding method and apparatus
EP0268230A2 (en) * 1986-11-20 1988-05-25 Air Products And Chemicals, Inc. Silicon carbide capillaries
US5147082A (en) * 1987-08-17 1992-09-15 Siemens Aktiengesellschaft Tool configuration for ultrasonic welding
US5180093A (en) * 1991-09-05 1993-01-19 Cray Research, Inc. Apparatus for ultrasonic bonding

Also Published As

Publication number Publication date
GB9501151D0 (en) 1995-03-08
JPH07263496A (en) 1995-10-13
GB2285943A (en) 1995-08-02

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee