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GB2112388B - Carboxylic acid amides containing amino groups and mixtures containing these amides and epoxy resins - Google Patents

Carboxylic acid amides containing amino groups and mixtures containing these amides and epoxy resins

Info

Publication number
GB2112388B
GB2112388B GB08235554A GB8235554A GB2112388B GB 2112388 B GB2112388 B GB 2112388B GB 08235554 A GB08235554 A GB 08235554A GB 8235554 A GB8235554 A GB 8235554A GB 2112388 B GB2112388 B GB 2112388B
Authority
GB
United Kingdom
Prior art keywords
amides
carboxylic acid
amino groups
epoxy resins
acid amides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08235554A
Other versions
GB2112388A (en
Inventor
Jonas Weiss
Raymond Seltzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of GB2112388A publication Critical patent/GB2112388A/en
Application granted granted Critical
Publication of GB2112388B publication Critical patent/GB2112388B/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/54Amino amides>

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
GB08235554A 1981-12-17 1982-12-14 Carboxylic acid amides containing amino groups and mixtures containing these amides and epoxy resins Expired GB2112388B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33185681A 1981-12-17 1981-12-17

Publications (2)

Publication Number Publication Date
GB2112388A GB2112388A (en) 1983-07-20
GB2112388B true GB2112388B (en) 1985-10-30

Family

ID=23295660

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08235554A Expired GB2112388B (en) 1981-12-17 1982-12-14 Carboxylic acid amides containing amino groups and mixtures containing these amides and epoxy resins

Country Status (5)

Country Link
JP (1) JPS58110552A (en)
CH (1) CH650767A5 (en)
DE (1) DE3246267A1 (en)
FR (1) FR2518541B1 (en)
GB (1) GB2112388B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4578286A (en) * 1984-02-08 1986-03-25 E. I. Du Pont De Nemours And Company Electrically conductive coating composition of a chlorosulfonated polyethylene
US4572870A (en) * 1984-08-09 1986-02-25 E. I. Du Pont De Nemours And Company Chlorosulfonated ethylene vinyl acetate polymer coating composition
EP0329266A3 (en) * 1988-02-19 1989-10-11 Texaco Development Corporation Amidoamine and oxamidoamine co-curatives in epoxy thermoset adhesive
EP0507824B1 (en) * 1989-12-28 1994-10-19 Hoechst Aktiengesellschaft Biscationic acid amide and acid imide derivatives and process for preparing them
DE4024466C2 (en) * 1990-07-30 1995-04-20 Dainippon Ink & Chemicals Thermally curable mixtures of polyfunctional formamides and aromatic mono-, di- or polyglycidyl ethers and their use
US5117058A (en) * 1990-11-09 1992-05-26 Baker Hughes Incorporated Cationic amide/ester compositions as demulsifiers
EP0654465A1 (en) * 1993-11-15 1995-05-24 Ciba-Geigy Ag Polyaminopolyamides
US6111030A (en) * 1994-01-21 2000-08-29 Rheox, Inc. Epoxy, polysulfide and cyanoacrylate composites utilizing activatable amino-polyamide curatives
CA2365922C (en) * 2000-12-26 2010-03-09 Mitsubishi Gas Chemical Company, Inc. Composition for coating having a gas barrier property, coating and coated film having a gas barrier property using the same
CA2459379C (en) * 2001-09-05 2010-08-17 Mitsubishi Gas Chemical Company, Inc. Adhesive for gas barrier laminates and laminated films
US7119583B2 (en) 2004-03-31 2006-10-10 Micron Technology, Inc. Phase detector and method having hysteresis characteristics
RU2333197C1 (en) * 2007-04-16 2008-09-10 Федеральное государственное унитарное предприятие "Научно-исследовательский институт химии и технологии полимеров имени академика В.А. Каргина с опытным заводом" (ФГУП "НИИ полимеров") 4-hexyl-3-(octene-2-yl)-5-cyclohexene-1,2-di[n,n-di(2-aminoethyl)]-diheptanamide
RU2331633C1 (en) * 2007-04-16 2008-08-20 Федеральное государственное унитарное предприятие "Научно-исследовательский институт химии и технологии полимеров имени академика В.А. Каргина с опытным заводом" (ФГУП "НИИ полимеров") 4-hexyl-3-(octen-2-yl)-5-cyclohexene-1,2-di[n,n-di(2-alkyl/cycloalkylimino)ethyl]-diheptaneamide
CN117025117B (en) * 2023-08-11 2024-09-24 青岛德聚胶接技术有限公司 High-temperature-resistant and deformation-resistant chip epoxy adhesive film and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2041772A1 (en) * 1970-08-22 1972-02-24 Bayer Ag Amide group-containing aliphatic diamines and a process for their preparation

Also Published As

Publication number Publication date
CH650767A5 (en) 1985-08-15
FR2518541B1 (en) 1986-09-12
FR2518541A1 (en) 1983-06-24
JPS58110552A (en) 1983-07-01
GB2112388A (en) 1983-07-20
DE3246267A1 (en) 1983-06-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee