GB2190795B - Circuit arrangement - Google Patents
Circuit arrangementInfo
- Publication number
- GB2190795B GB2190795B GB8710880A GB8710880A GB2190795B GB 2190795 B GB2190795 B GB 2190795B GB 8710880 A GB8710880 A GB 8710880A GB 8710880 A GB8710880 A GB 8710880A GB 2190795 B GB2190795 B GB 2190795B
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit arrangement
- arrangement
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
- F02B77/00—Component parts, details or accessories, not otherwise provided for
- F02B77/08—Safety, indicating, or supervising devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863615583 DE3615583C2 (en) | 1986-05-09 | 1986-05-09 | Circuit arrangement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8710880D0 GB8710880D0 (en) | 1987-06-10 |
| GB2190795A GB2190795A (en) | 1987-11-25 |
| GB2190795B true GB2190795B (en) | 1990-01-10 |
Family
ID=6300419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8710880A Expired - Lifetime GB2190795B (en) | 1986-05-09 | 1987-05-08 | Circuit arrangement |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2190795B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5140298A (en) * | 1990-09-04 | 1992-08-18 | International Business Machines Corporation | Ceramic base component packaging assembly |
| DE4327144C2 (en) * | 1993-08-12 | 1995-08-10 | Siemens Nixdorf Inf Syst | Thermal foil |
| ATE170675T1 (en) * | 1993-10-07 | 1998-09-15 | Raychem Sa Nv | ENVIRONMENTAL PROTECTION DEVICE |
| JP4130628B2 (en) * | 2001-08-10 | 2008-08-06 | ブラック アンド デッカー インク | Electrical insulated module |
| US6731503B2 (en) * | 2001-08-10 | 2004-05-04 | Black & Decker Inc. | Electrically isolated module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1197281A (en) * | 1966-10-17 | 1970-07-01 | Ass Elect Ind | Improvements in Thin Film Circuits |
| GB1492285A (en) * | 1975-04-10 | 1977-11-16 | Ibm | Electrical component packages |
| GB2038102A (en) * | 1978-12-20 | 1980-07-16 | Ferranti Ltd | Circuit board temperature controller |
| GB1594834A (en) * | 1978-05-08 | 1981-08-05 | Plessey Co Ltd | Method of bonding a heat sink to a printed circuit board |
| GB2120860A (en) * | 1981-01-12 | 1983-12-07 | Owens Illinois Inc | Environmentally protected electronic control for a glassware forming machine |
| WO1985002750A1 (en) * | 1983-12-13 | 1985-06-20 | Rolf Dahlberg | Printed circuit board |
-
1987
- 1987-05-08 GB GB8710880A patent/GB2190795B/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1197281A (en) * | 1966-10-17 | 1970-07-01 | Ass Elect Ind | Improvements in Thin Film Circuits |
| GB1492285A (en) * | 1975-04-10 | 1977-11-16 | Ibm | Electrical component packages |
| GB1594834A (en) * | 1978-05-08 | 1981-08-05 | Plessey Co Ltd | Method of bonding a heat sink to a printed circuit board |
| GB2038102A (en) * | 1978-12-20 | 1980-07-16 | Ferranti Ltd | Circuit board temperature controller |
| GB2120860A (en) * | 1981-01-12 | 1983-12-07 | Owens Illinois Inc | Environmentally protected electronic control for a glassware forming machine |
| WO1985002750A1 (en) * | 1983-12-13 | 1985-06-20 | Rolf Dahlberg | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8710880D0 (en) | 1987-06-10 |
| GB2190795A (en) | 1987-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19940508 |