GB1594834A - Method of bonding a heat sink to a printed circuit board - Google Patents
Method of bonding a heat sink to a printed circuit board Download PDFInfo
- Publication number
- GB1594834A GB1594834A GB2537877A GB2537877A GB1594834A GB 1594834 A GB1594834 A GB 1594834A GB 2537877 A GB2537877 A GB 2537877A GB 2537877 A GB2537877 A GB 2537877A GB 1594834 A GB1594834 A GB 1594834A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- heat sink
- adhesive
- circuit board
- heat sinks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 32
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229920000260 silastic Polymers 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 235000009854 Cucurbita moschata Nutrition 0.000 claims description 2
- 240000001980 Cucurbita pepo Species 0.000 claims description 2
- 235000009852 Cucurbita pepo Nutrition 0.000 claims description 2
- 239000004825 One-part adhesive Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 235000020354 squash Nutrition 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
(54) A METHOD OF BONDING A HEAT SINK TO A PRINTeD
CIRCUIT BOARD
(71) We, THE PLESSEY COMPANY LIM
ITED, a British Company of Vicarage Lane,
Ilford, Essex, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:- This invention relates to a method of bonding a heat sink to a printed circuit board.
Printed circuit boards are well known.
During operation of the printed circuit boards, heat is usually generated and this heat can sometimes become so great that it prevents the printed circuit board operating correctly or, alternatively, reduces the life of the printed circuit board components. In order to dissipate the heat generated by the printed circuit board, it is known to bond a heat sink, for example a metal plate, to be printed circuit board.
The heat sinks have to be provided with a plurality of apertures in order to allow various electrical connections to be made to the printed circuits. Hitherto, the heat sinks have been stuck to the printed circuit boards by first applying and adhesive in the form of a solid sheet over the whole of the printed circuit board and then cutting out the adhesive in the pattern of the holes. This operation is time consuming and, since the holes in various heat sinks often differ in position from each other, it is difficult to standardize the process. After the sheet has been cut, the heat sink is then bonded to the printed circuit board using heat and a relatively high degree of pressure.
It is an aim of the present invention to provide a method of bonding a heat sink to a printed circuit board which does not involve the cutting of a solid sheet of adhesive, and which also does not involve the use of elevated temperature and high pressures.
Accordingly, the present invention provides a method of cold bonding a heat sink on to a printed circuit board, which method comprises coating the heat sink with a room temperature curing silicon-containing adhesive, and then bringing the printed circuit board and the heat sink together under sufficient pressure to ensure that the printed circuit board and the heat sink are in contact and for a period of time until curing has taken place.
Preferably, the adhesive is sprayed on to the heat sink to form a coating of the required thickness. Since the adhesive is sprayed, it does not form over the various holes in the heat sink. In order to spray the adhesive, it may be necessary to dilute the adhesive and various solvents can be used such for example as trichloroethane.
As an alternative to spraying, the adhesive can be brushed or silk screened on to the heat sink. When a silk screen is employed, a relatively slow curing adhesive is preferred, since otherwise the adhesive may cure too quickly and may tend to clog the silk screen.
The amount of adhesive on the heat sink should be such that there is insufficient adhesive to flow into the apertures when the bonding takes place. There should however be sufficient adhesive to give good bonding and insulation, and to get around the sides of the track.
Usually, the heat sinks will be sprayed and then substantially directly contacted with a printed circuit board. However, if desired, a sprayed or otherwise coated heat sink can be allowed to cure and can then be stored.
When it is desired to contact the heat sink with a printed circuit board, then the heat sink can be given a further light adhesive coating.
The adhesive is preferably a silastomer, i.e.
a silicon containing elastomer. A presently preferred silastomer is that sold by Dow
Corning under their trade mark SILASTIC 732. This silastomer is a rubber material which allows the printed circuit boards and their heat plates to expand by slightly different amounts without buckling the resulting assembly.
The heat sinks are preferably metal plates, for example anodized aluminium or copper plates.
The pressure may be applied to the printed circuit board merely by applying a weight on top of the printed circuit board and the heat sink. Alternatively, the pressure can be ap plied by means of vacuum. Excess pressure should be avoided since it may squash the adhesive into the apertures.
The printed circuit boards can be such that they have tracks on one or both sides. Also, the method of the invention can be such that several sets, e.g. up to ten or more, of the combined circuit boards and heat sinks are adhered together in one operation. The various sets of the printed circuit boards and heat sinks can be separated from each other by separator means, such for example as a sheet of paper, to avoid the various sets adhering together.
An embodiment of the invention will now be described solely by way of example and with reference to the accompanying drawing which is an exploded view of the printed circuit boards as they are being provided with the heat sinks.
Referring to the drawing, there is shown a jig 2 having upstanding jig members 4. On the jig 2 and over the members 4 is respectively provided a paper layer 6, a printed circuit board 8, a heat sink 10, a paper layer 12, a printed circuit board 14 and a heat sink 16. The paper layers, the printed circuit boards and the heat sinks are apertured as shown to go over the members 4.
The heat sinks 10, 16 are coated with the aforementioned SILASTIC 732 which is sprayed on to the heat sinks 10, 16 from a solvent solution to form adhesive layers 10A, 16A respectively. The assembly is gently pressed together by means of a weight in the form of a plate 18 which rests on top of the heat sink 16 and locates over the upstanding members 20 formed on a base plate 22.
Usually, it will be necessary to leave the assembly for about 48 hours at room temperature before the curing is complete. If necessary, the assembly can be left for a further period, for example 24 hours.
It is to be appreciated that the embodiment of the invention described above has been given by way of example and that modifications may be effected. Thus, for example, the adhesive could be brushed on. It should also be appreciated that the drawing is schematic and the electrical circuit on the boards and the apertures in the heat sinks have not been shown. The SILASTIC 732 is a one part adhesive but two part room temperature curing silicon-containing adhesives (i.e. adhesives requiring two ingredients to be mixed together for curing) can be employed.
WHAT WE CLAIM IS:
1. A method of cold bonding a heat sink on to a printed circuit board, which method comprises coating the heat sink with a room temperature curing silicon-containing adhesive, and then bringing the printed circuit board and the heat sink together under sufficient pressure to ensure that the printed circuit board and the heat sink are in contact and for a period of time until curing has taken place.
2. A method as claimed in claim 1 in which the adhesive is sprayed on to the heat sink to form a coating of the required thickness.
3. A method as claimed in claim 2 in which the adhesive is diluted with a solvent.
4. A method as claimed in claim 1 in which the adhesive is brushed or silk screened on to the heat sink.
5. A method as claimed in any one of claims 1 to 3 in which the heat sink is sprayed and then substantially directly contacted with a printed circuit board.
6. A method as claimed in any one of the preceding claims in which the adhesive is a silastomer.
7. A method as claimed in any one of the preceding claims in which the heat sink is a metal plate.
8. A method as claimed in claim 7 in which the metal plate is an aluminium or copper plate.
9. A method as claimed in any one of the preceding claims in which several sets of the combined circuit boards and heat sinks are adhered together in one operation.
10. A method of cold bonding a heat sink on to a printed circuit board, substantially as herein described with reference to the accompanying drawing.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (10)
1. A method of cold bonding a heat sink on to a printed circuit board, which method comprises coating the heat sink with a room temperature curing silicon-containing adhesive, and then bringing the printed circuit board and the heat sink together under sufficient pressure to ensure that the printed circuit board and the heat sink are in contact and for a period of time until curing has taken place.
2. A method as claimed in claim 1 in which the adhesive is sprayed on to the heat sink to form a coating of the required thickness.
3. A method as claimed in claim 2 in which the adhesive is diluted with a solvent.
4. A method as claimed in claim 1 in which the adhesive is brushed or silk screened on to the heat sink.
5. A method as claimed in any one of claims 1 to 3 in which the heat sink is sprayed and then substantially directly contacted with a printed circuit board.
6. A method as claimed in any one of the preceding claims in which the adhesive is a silastomer.
7. A method as claimed in any one of the preceding claims in which the heat sink is a metal plate.
8. A method as claimed in claim 7 in which the metal plate is an aluminium or copper plate.
9. A method as claimed in any one of the preceding claims in which several sets of the combined circuit boards and heat sinks are adhered together in one operation.
10. A method of cold bonding a heat sink on to a printed circuit board, substantially as herein described with reference to the accompanying drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2537877A GB1594834A (en) | 1978-05-08 | 1978-05-08 | Method of bonding a heat sink to a printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2537877A GB1594834A (en) | 1978-05-08 | 1978-05-08 | Method of bonding a heat sink to a printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1594834A true GB1594834A (en) | 1981-08-05 |
Family
ID=10226705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2537877A Expired GB1594834A (en) | 1978-05-08 | 1978-05-08 | Method of bonding a heat sink to a printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1594834A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2137422A (en) * | 1983-03-30 | 1984-10-03 | Ferranti Plc | Printed circuit board |
| GB2190795A (en) * | 1986-05-09 | 1987-11-25 | Hella Kg Hueck & Co | Circuit arrangement comprising planar resistors |
| EP0902609A1 (en) * | 1997-09-05 | 1999-03-17 | Ascom Hasler AG | Process for manufacturing a circuit board, circuit board and device for carrying out the process |
| WO2000074449A1 (en) * | 1999-05-26 | 2000-12-07 | Siemens Aktiengesellschaft | Main board with printed circuit board mounted thereon |
-
1978
- 1978-05-08 GB GB2537877A patent/GB1594834A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2137422A (en) * | 1983-03-30 | 1984-10-03 | Ferranti Plc | Printed circuit board |
| GB2190795A (en) * | 1986-05-09 | 1987-11-25 | Hella Kg Hueck & Co | Circuit arrangement comprising planar resistors |
| GB2190795B (en) * | 1986-05-09 | 1990-01-10 | Hella Kg Hueck & Co | Circuit arrangement |
| EP0902609A1 (en) * | 1997-09-05 | 1999-03-17 | Ascom Hasler AG | Process for manufacturing a circuit board, circuit board and device for carrying out the process |
| WO2000074449A1 (en) * | 1999-05-26 | 2000-12-07 | Siemens Aktiengesellschaft | Main board with printed circuit board mounted thereon |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19940508 |