GB2168078A - Brazing alloy - Google Patents
Brazing alloy Download PDFInfo
- Publication number
- GB2168078A GB2168078A GB08528375A GB8528375A GB2168078A GB 2168078 A GB2168078 A GB 2168078A GB 08528375 A GB08528375 A GB 08528375A GB 8528375 A GB8528375 A GB 8528375A GB 2168078 A GB2168078 A GB 2168078A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alloy
- brazing
- mild steel
- component
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 54
- 239000000956 alloy Substances 0.000 title claims abstract description 54
- 238000005219 brazing Methods 0.000 title claims abstract description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 239000011135 tin Substances 0.000 claims abstract description 7
- 229910052718 tin Inorganic materials 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011574 phosphorus Substances 0.000 claims abstract description 5
- 229910004837 P—Sn Inorganic materials 0.000 claims description 8
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 101100457461 Caenorhabditis elegans mnm-2 gene Proteins 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 4
- 238000009472 formulation Methods 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A brazing alloy which comprises copper, phosphorus and tin to which has been added a component which prevents the formation of a sheet of brittle phosphides when used with mild steel. The component for preventing the formation of a sheet of phosphide is a Group VIIA or VIIIA metal, preferably nickel.
Description
SPECIFICATION
Brazing alloy
This invention relates to an alloy, in particular to an alloy suitable for brazing metals such as mild steel.
Brazing is the joining of two pieces of metal by fusing a third metal. The temperatures involved are generally in excess of 4500C (below this the process is referred to as soldering), and a typical brazing operation employing brass as the filler metal will require temperatures in the order of 950 C.
So-called "silver solder" is in fact a brazing alloy for joining, e.g., mild steel, with an application temperature in the region of 650 - 700 , but is relatively expensive. Other low temperature brazing alloys are available, for example the Cu-P-Sn system.
These also operate in the region of 650 - 700 , but are not suitable for joining articles of mild steel since the joints are too brittle and lack the necessary strength.
The invention seeks to provide a low-temperature brazing alloy less expensive than silver solder and which can be used to join mild steel.
According to the present invention there provided a brazing alloy which comprises copper, phosphorus and tin to which has been added a component which prevents the formation of a sheet of brittle phosphides when used with mild steel.
It has been found that the low strength of mild steel joints produced with conventional Cu-P-Sn alloys is due to formation of a sheet of brittle phosphides in the joint. The addition of a component which prevents the formation of this brittle sheet, or causes the phosphides to be formed in a discontinuous manner, greatly increase the strength of joints.
The preferred component for preventing the formation of a sheet of phosphide is nickel, but other
Group VIIA and VIIIA metals may also be employed. The amount of component employed may be varied through fairly wide limits, from 2% through to 22% or more, although for most purposes from 4 to 20% will be used. In the lower ranges, e.g. from 4 to 15% a useful increase in strength is obtained at temperatures around 700 C.
Amounts above 15% Ni give even greater strengths of joint but may require higher brazing temperatures.
The base alloy may be any of the conventionally used Cu-P-Sn brazing systems currently available.
The alloy of the invention is preferably formulated as a paste for convenience in brazing applications, and moreover we have found that at least in some end-uses formulation as a paste allows results to be achieved which are not possible with wires, foils or the like. A typical paste formulation would have about 70% alloy in an organic binder, typically a suspension, usually with a flux.
In a particular Example a standard brazing alloy of the composition 7.1% P, 5.6% Sn, 87.3% Cu was made up with the following amounts of nickel, and organic binders suitable for torch brazing. Six mm x 25mm single lap specimens of mild steel were brazed with the alloys and tested for shear strength.
With from 4 to 15% Ni shear strengths in the region of 40 to 50 MNm-2 were obtained. For example, with 8% Ni the following results were obtained: 42, 43, 51, 45, 43, 54 MNm-2, which is less than a similar brass braze but nevertheless useful, and of course obtained at temperatures of about 2500 less than those require for brazing with brass.
Above 15% Ni causes the joint strength to increase to around 60 MNm-2, but the brazing temperature may have to be raised somewhat.
The alloys of the invention provide a cheaper alternative to silver solder in the brazing of mild steels.
1. A brazing alloy which comprises copper, phosphorus and tin to which has been added a component which prevents the formation of a sheet of brittle phosphides when used with mild steel.
2. An alloy as claimed in claim 1 in which the component for preventing the formation of a sheet of phosphide is a Group VIIA or VIIIA metal.
3. An alloy as claimed in claim 2 in which the metal is nickel.
4. An alloy as claimed in any of claims 1 to 3 in which the amount of component employed may be varied from 2% through to 22% or more.
5. An alloy as claimed in claim 4 in the amount of component ranges from 4 to 20%.
6. An alloy as claimed in any of claims 1 to 5 in which the base alloy is a Cu-P-Sn brazing alloy.
7. An alloy as claimed in any of claims 1 to 6 formulated as a paste.
8. An alloy as claimed in claim 7 in which the paste comprises about 70% alloy in an organic binder, with a flux.
9. An alloy according to claim 1 substantially as hereinbefore described with reference to the foregoing examples.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (9)
1. A brazing alloy which comprises copper, phosphorus and tin to which has been added a component which prevents the formation of a sheet of brittle phosphides when used with mild steel.
2. An alloy as claimed in claim 1 in which the component for preventing the formation of a sheet of phosphide is a Group VIIA or VIIIA metal.
3. An alloy as claimed in claim 2 in which the metal is nickel.
4. An alloy as claimed in any of claims 1 to 3 in which the amount of component employed may be varied from 2% through to 22% or more.
5. An alloy as claimed in claim 4 in the amount of component ranges from 4 to 20%.
6. An alloy as claimed in any of claims 1 to 5 in which the base alloy is a Cu-P-Sn brazing alloy.
7. An alloy as claimed in any of claims 1 to 6 formulated as a paste.
8. An alloy as claimed in claim 7 in which the paste comprises about 70% alloy in an organic binder, with a flux.
9. An alloy according to claim 1 substantially as hereinbefore described with reference to the foregoing examples.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08528375A GB2168078A (en) | 1984-11-16 | 1985-11-18 | Brazing alloy |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB848429080A GB8429080D0 (en) | 1984-11-16 | 1984-11-16 | Brazing alloy |
| GB08528375A GB2168078A (en) | 1984-11-16 | 1985-11-18 | Brazing alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8528375D0 GB8528375D0 (en) | 1985-12-24 |
| GB2168078A true GB2168078A (en) | 1986-06-11 |
Family
ID=26288466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08528375A Withdrawn GB2168078A (en) | 1984-11-16 | 1985-11-18 | Brazing alloy |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2168078A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| US5130090A (en) * | 1989-11-17 | 1992-07-14 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| US5178827A (en) * | 1989-11-17 | 1993-01-12 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| WO2004018147A1 (en) * | 2002-08-23 | 2004-03-04 | J.W. Harris Co., Inc. | Phosphorus-copper base brazing alloy |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3674471A (en) * | 1970-04-09 | 1972-07-04 | Eutectic Corp | Alloy |
| GB1385191A (en) * | 1971-05-10 | 1975-02-26 | British Oxygen Co Ltd | Alloys |
-
1985
- 1985-11-18 GB GB08528375A patent/GB2168078A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3674471A (en) * | 1970-04-09 | 1972-07-04 | Eutectic Corp | Alloy |
| GB1385191A (en) * | 1971-05-10 | 1975-02-26 | British Oxygen Co Ltd | Alloys |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130090A (en) * | 1989-11-17 | 1992-07-14 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| US5178827A (en) * | 1989-11-17 | 1993-01-12 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| WO2004018147A1 (en) * | 2002-08-23 | 2004-03-04 | J.W. Harris Co., Inc. | Phosphorus-copper base brazing alloy |
| US9533379B2 (en) | 2002-08-23 | 2017-01-03 | Lincoln Global, Inc. | Phosphorous-copper base brazing alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8528375D0 (en) | 1985-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |