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CA1293394C - Copper-zinc-manganese-nickel alloys - Google Patents

Copper-zinc-manganese-nickel alloys

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Publication number
CA1293394C
CA1293394C CA000518645A CA518645A CA1293394C CA 1293394 C CA1293394 C CA 1293394C CA 000518645 A CA000518645 A CA 000518645A CA 518645 A CA518645 A CA 518645A CA 1293394 C CA1293394 C CA 1293394C
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Canada
Prior art keywords
copper
weight percent
alloy
brazing
carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA000518645A
Other languages
French (fr)
Inventor
Allen S. Mcdonald
Charles W. Philp
Thomas A. Sperakis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Handy and Harman
Original Assignee
Handy and Harman
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Filing date
Publication date
Application filed by Handy and Harman filed Critical Handy and Harman
Priority to CA000518645A priority Critical patent/CA1293394C/en
Application granted granted Critical
Publication of CA1293394C publication Critical patent/CA1293394C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

ABSTRACT Copper-zinc-manganese-nickel alloys comprising 30 to 70 weight percent copper, 15 to 45 weight percent zinc, 5 to 20 weight percent manganese, 1 to 20 weight percent nickel, 0.05 to 2 weight percent silicon and less than about 0.05 weight percent of other elements. Also, use of this alloy as a brazing material and a method for brazing carbide compounds to a suitable substrate utilizing such brazing materials.

Description

3~

COPPER-ZINC-MANGANESE-NICKEL ALLOYS

Technical Field:
The invention relates to copper-zinc alloys and, more particular, to copper-zinc-manganese-nickel alloys for use as brazin~ materials.

Back~round Art As a material of construction, copper and copper alloys constitute one of the major ~roups of commercial metals. They are widely used due to their combination of physical properties which include electrical conductivity, thermal conductivity, corrosion resistance, machinability, fati~ue characteristics, workability, formability, and 20 strength. In addition, copper alloys can be made in a variety of colors, are non-magnetic, and can be finished by plating or lacquering. Most copper alloys can be welded, brazed or soldered with little difficulty.

To improve certain of these basic properties, the various alloying elements can be selected. Zinc has been found to be a particularly useful element and a number of commercial copper-zinc alloys include the family of brasses.
Yellow brass for example, an alloy of 65% copper 35% zinc is ~useful due to its golden color and good workability. Due to its relatively low melting temperature and compatibility with ~ ~ ~ most steels and copper alloys, the brasses were also used as - ~ ~ brazing alloys to joln these different base metals together.

~ 35 :
~' ~3~

Today there are a multitude of copper-zinc base brazing alloys containing a wide variety of additional alloying elements for particular applications.

One particularly effective elemental additive is nickel, and the family of copper-zinc-nickel alloys are known as the nickel-silvers due to their whitish appearance.
Typical compositions of nickel-silver alloys range from 55-65% copper, 17-27% zinc and 15-20~ nickel. While having a higher melting temperature than the brasses, the nickel-silvers provide compatibility with a number of other materials, such as tungsten carbide, and also provide higher strength.

A very popular family of brazing alloys include those containing silver. Such silver-copper-zinc (and optional nickel) brazing alloys have been used for joining carbide compounds to various substrates because of their relatively low melting temperatures (approximately 550-750C). While these alloys exhibit good bonding strength, sufficient plasticity and highly preferred brazing temperatures, they are expensive due to the silver content.
Also, higher joint strengths and better high temperature 25 properties are desireable. Therefore, substitute alloys have traditionally been sought by those skilled in the art for brazing carbide components to various substrates.

One family of alloys which has been suggested as 30 substitute for such silver-base or nickel-silver alloys is the copper-nickel-manganese-family. TypicallyJ such alloys contain about 50-55~ copper, 8-11~ nickel and the balance manqanese. These brazing alloys are relatively ~ree flowing and compatible with various carbides and base metals such as 33~4 cast irons, steels and tool steels as well as some stainless steels and nickel-base alloys. However, since zinc is not included in this family of alloys, the alloy melting temperature ranges from about 850C to about 930C.
Therefore, brazing temperatures on the order of about 950 to 1050C are required to produce suitably brazed joints.

Applicants now have found, however, that copper-zinc-manganese-nickel alloys provide compatibility with a variety of carbide compounds and substrates, and comparable strengths and ~luidity in comparison to the copper-manganese-nickel alloys of the prior art while decreasing the brazing temperature to a lower range. In comparison to silver alloys, the alloys of the present invention provide improved strengths at much lower cost in addition to providing compatibility with a wide range of carbide compounds and substrates~

Summary~of the Invention The invention relates to a copper alloy composition essentially about 30 to 70 weight percent copper, about 15 to 45 weight percent zinc, about 5 to 20 weight percent 25 manganese, about 1 to 20 weight percent nickel, and about 0.05 to 2 weight percent silicon. Other elements can be present in small amounts, generally less than 0.5 weight percent. The total of such other elements should be less than about 3 weight percent.

Preferably, the copper content is about 35 to 60 weight percent, the zinc content is about 15 to ~0 weight percent, the manganese content of about 5 to 15 wei~ht 3~

percent, the nickel content is about 4 to 18 weight percent and preferably about 5 to 15 weight percen-t. In all these alloys, a preferred silicon content is about 0.05 to 0.25 weight percent.

One particular alloy family includes those having a the copper content of about 50 to SO weight percent, a zinc content of about 20 to 30 weight percent, a manganese content of about 10 to 14 weight percent, a nickel content of about 6 to 10 wei~ht percent and a silicon content of about 0.05 to 0.25 wei~ht percent. Specifically, this alloy contains about 53 to 57 weight percent copper, about 23 to 27 weight percent zinc, about 11 to 13 weight percent manganese, about 7 to 9 weiqht percent nickel, and a~out 0.05 to 0.25 weiqht percent silicon. These alloys have a solidus tempera~ure of about 1575~F (857C) and a liquidus temperature of abou~ 1675F
(913~C).
Another group of alloys which are suitable according to the invention have a copper content of about 40 to 50 weight percent, a zinc content of about 30 to 40 weight percent, a manganese content of about 6 to 10 weight percent, : a nickel content of about 10 to 14 weight percent and a silicon content of about 0.05 to 0.25 weight percent.
: Specifically, this alloy include~ about 43 to 47 weight 25 percent copper, about 33 to 37 weight percent zinc, about 7 : to 9 wei3ht percent manaanese, about 11 to 13 weight percent ~: nickel, and abo~t 0.05 to 0.25 weight percent Yilicon. These ; alloys have a solidus te~peratùre of about 1610F (877C) and : ~ a llquidus temperature of about 1670F (910C).

The inven~ion also relates to the use of these alloys as brazing products in the form of wir~, strip, powder, or paste. Alternately, a bra2ing product comprising ~ ~ .

~ :
~; `

a layer of copper or copper-nickel alloy strip sandwiched between two layers of the copper alloy compositions of the invention can be utilized. The relative amounts of each layer in these brazing product range between about 1:2:1 to 1:4:1.

The invention also relates to a method for joining a carbide compound to a suitable substrate which comprises providing a copper brazing alloy according to the invention and brazin~ the carbide. This method is useful for substrates of carbon or low alloy steel, tool steel, stainless steel or a copper or nickel alloy having a higher melting point than the brazing alloy. Any carbide compound such as tungsten carbide, silicon carbide, vanadium carbide, tantalum carbide, titanium carbide or the like, can be used.
This method is useful when furnace, induction, resistance, or oxygen ~as torch heating is used to heat the substrate and 20 carbide compound to the proper brazing temperature range.

Description of Preferred ~

For joining a carbide insert to a suitable 25 substrate, such as a tool steel, for use on mining, construction, and machining bits or saw blades, the following method would be used for brazing the parts togetherO

The substrate, carbide and bra2e metal are prepared 30 for brazing in such a manner as to avoid contamination of the joint. The sur~aces to be brazed are coated with a brazing flux which remains active ~o at least 2200F (1205C)o such as ~andy ~ Harman High Temp M Flux. The compon~nts can be joined together by a number of different procedure~, all 35 which require the parts to be heated to a temperature of * Trade-mark ' ap~roximately at least about 1750F (955C). The heating time would vary depending upon the specific procedure used.
In each case, a joint clearance of between 0.002 and 0.005 inches is desired to produce optimum properties of the brazed assembly.

One method for completing the brazed joint is to use an alloy having a composition of 55 weight percent copper, 12 weight percent manganese, 8 weight percent nickel, 0.15 weight percent silicon and the balance being essentially zinc. This alloy is then manufactured in the form of a wire having a diameter of appro~imately 1/16 of an inch.

The parts to be joined are cleaned and fluxed as described above, and then heated with an oxy~en acetylene torch to the necessary brazing temperature range. The rod is applied by touching it to the parts to be joined. When the parts achieve the proper temperature, the rod becomes liquid 20 and flows between the parts. After the alloy flows co~pletely between the parts to be joined, the heat is removed and the assembly is allowed to cool to room temperature.

In another embodiment of the invention, an alloy having a composition of about 45% copper, 8% manganese, 12%
; nickel and 0.15 percent silicon with the balance being essentially zinc is formed into a bra-zing product by rolling two layers of this alloy in the form of strip onto each side 30 of a layer of copper. The rolling is completed until the thickness of the clad layer is about 0.0025 for each of the two layers of braze alloy strip according to the invention and 0.005 for the pure copper core. Thus, the overall thickness of this tri-layer braze product is approximately 0.010 inches. This product is then cut to conform to the shape of the tun~sten carbide insert, and placed between the carbide and substrate to which it is to be joined. In this case, 8740 low alloy steel is used as the substrate. The parts and filler metal are cleaned as described above and the braze surfaces are coated with the high temperatùre brazing flux. The parts are then heated by induction until flow of the filler metal occurs. A heating time of approximately 15 seconds is desirable and again the temperature in the joint area attains approximately 1750~F (955C).

Shear strength values of tungsten carbide/8740 steel at ambient temperatures are suitable for the intended applications. Performance life tests have exceeded those of copper-nickel-manganese or copper-nickel-zinc alloys. No embrittlement or joint cracking was found under the conditions of brazing described above, either immediately after brazing or after final heat treatment.

While it is apparent that the invention herein disclosed is well calculated to fulfill the objects above stated, it will be appreciated that numerous modifications and embodiments may be devised by those skilled in the art, 25 and it is intended that the appended claims cover all such modifications and embodiments as fall within the true spirit and scope of the present invention.

: `

Claims (39)

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:
1. A copper alloy composition consisting essentially of about 40 to 57 weight percent copper, from 23 to 37 weight percent zinc, 5 to 13 weight percent manganese, 7 to 20 weight percent nickel, 0.05 to 2%
silicon and in which the total of all other components is less than 3 weight percent, each of said other components being less than 0.5 weight percent.
2. The copper alloy according to claim 1 wherein the nickel content is about 7 to 18 weight percent and the silicon content is about 0.05 to 0.25 weight percent.
3. The copper alloy according to claim 2 wherein the copper content is about 50 to 57 weight percent, the zinc content is about 23 to 30 weight percent, the manganese content is about 10 to 13 weight percent, the nickel content is about 7 to 10 weight percent.
4. A copper alloy consisting essentially of about 53 to 57 weight percent copper, about 23 to 27 weight percent zinc, about 11 to 13 weight percent manganese, about 7 to 9 weight percent nickel, and about 0.05 to 0.25 weight percent silicon.
5. The copper alloy according to claim 1 wherein the copper content is about 40 to 50 weight percent, the zinc content is about 30 to 37 weight percent, the manganese con-tent is about 6 to 10 weight percent and the nickel content is about 10 to 14 weight percent.
6. A copper alloy consisting essentially of about 43 to 47 weight percent copper, about 33 to 37 weight percent zinc, about 7 to 9 weight percent manganese, about 11 to 13 weight percent nickel, and about 0.05 to 0.25 weight percent silicon.
7. A brazing product comprising the copper alloy of claim 1 in the form of wire, strip powder, or paste.
8. A brazing product comprising the copper alloy of claim 4 in the form of wire, strip, powder, or paste.
9. A brazing product comprising the copper alloy of claim 6 in the form of wire, strip, powder, or paste.
10. A brazing product comprising a layer of copper or copper-nickel alloy strip sandwiched between two layers of the copper alloy composition according to claim 1, the rela-tive amounts of each layer ranging between about 1:2:1 to 1:4:1.
11. A brazing product comprising a layer of copper or copper-nickel alloy strip sandwiched between two layers of the copper alloy composition according to claim 4, the rela-tive amounts of each layer ranging between about 1:2:1 to 1:4:1.
12. A brazing product comprising a layer of copper or copper-nickel alloy strip sandwiched between two layers of the copper alloy composition according to claim 6, the relative amounts of each layer ranging between about 1:2:1 to 1:4:1.
13. A method for joining a carbide compound to a suitable substrate which comprises:

(a) providing a copper brazing alloy having the composition according to claim 7; and (b) brazing the carbide compound to the substrate with said brazing alloy at a temperature above the liquidus temperature of the copper brazing alloy.
14. The method according to claim 13 wherein the substrate is carbon or low alloy steel, tool steel, stainless steel or a copper or nickel alloy having a higher melting point than the brazing alloy.
15. The method according to claim 14 wherein the carbide compound is tungsten carbide, silicon carbide, vanadium carbide, tantalum carbide, or titanium carbide.
16. The method according to claim 15 wherein the brazing temperature is achieved by furnace, induction, resistance or oxygen-gas torch heating.
17. A method for joining a carbide compound to a suitable substrate which comprises:

(a) providing a copper brazing alloy having the composition according to claim 8; and (b) brazing the carbide compound to the substrate with said brazing alloy at a temperature above the liquidus temperature of the copper brazing alloy.
18. The method according to claim 17 wherein said substrate is carbon or low alloy steel, tool steel, stainless steel or a copper or nickel alloy having a higher melting point than the brazing alloy.
19. The method according to claim 18 wherein said carbide compound is tungsten carbide, silicon carbide, vanadium carbide, tantalum carbide or titanium carbide.
20. The method according to claim 19 wherein the brazing temperature is achieved by furnace, induction, resistance or oxygen-gas torch heating.
21. A method for joining a carbide compound to a suitable substrate which comprises:

(a) providing a copper brazing alloy having the composition according to claim 9; and (b) brazing the carbide compound to the substrate with said brazing alloy at a temperature above the liquidus temperature of the copper brazing alloy.
22. The method according to claim 21 wherein said substrate is carbon or low alloy steel, tool steel, stainless steel or a copper or nickel alloy having a higher melting point than the brazing alloy.
23. The method according to claim 22 wherein said carbide compound is tungsten carbide, silicon carbide, vanadium carbide, tantalum carbide or titanium carbide.
24. The method according to claim 23 wherein the brazing temperature is achieved by furnace, induction, resistance or oxygen-gas torch heating.
25. A method for joining a carbide compound to a suitable substrate which comprises:

(a) providing a copper brazing product according to claim 10; and (b) brazing the carbide compound to the substrate with said brazing alloy at a temperature above the liquidus temperature of the copper brazing alloy.
26. The method according to claim 25 wherein said substrate is carbon or low alloy steel, tool steel, stainless steel or a copper or nickel alloy having a higher melting point than the brazing alloy.
27. The method according to claim 22 wherein said carbide compound is tungsten carbide, silicon carbide, vanadium carbide, tantalum carbide or titanium carbide.
28. The method according to claim 25 wherein the brazing temperature is achieved by furnace, induction, resistance or oxygen-gas torch heating.
29. A copper alloy composition consisting of from 43 to 57 weight percent copper, from 23 to 37 weight percent zinc, from 7 to 13 weight percent manganese, from 7 to 13 weight percent nickel, and from 0.05 to 2 weight percent silicon, in which the total of other components is less than 3 weight percent, each of said other components being less than 0.5 weight percent.
30. The copper alloy composition according to claim 29, wherein the copper content is about 45 to 55 weight percent, the zinc content is about 25 to 35 weight percent, the manganese content is about 8 to 12 weight percent, the nickel content is about 8 to 12 weight percent and the silicon content is about 0.05 to 0.25 weight percent.
31. The copper alloy according to claim 29 wherein the copper content is about 55 weight percent, the manganese content is about 12 weight percent, the nickel content is about 8 weight percent, the silicon content is from 0.05 to 0.25 weight percent, and the balance is essentially zinc.
32. The copper alloy according to claim 29 wherein the copper content is about 45 weight percent, the manganese content is about 8 weight percent, the nickel content is about 12 weight percent, the silicon content is from 0.05 to 0.25 weight percent and the balance is essentially zinc.
33. A brazing product comprising the copper alloy of claim 29 in the form of wire, strip, powder, or paste.
34. A brazing product comprising a layer of copper or copper-nickel alloy strip sandwiched between two layers of the copper alloy composition of claim 29, the relative amounts of each layer ranging between about 1:21:1 to 1:4:1.
35. A method for joining a carbide compound to a suitable substrate which comprises:
(a) providing a copper brazing alloy having the composition of claim 29;
(b) brazing the carbide compound to the substrate with said brazing alloy at a temperature above the liquidus temperature of the copper brazing alloy.
36. A method for joining a carbide compound to a suitable substrate which comprises:

(a) providing a copper alloy brazing product according to claim 33; and (b) brazing the carbide compound to the substrate with said brazing product at a temperature above the liquidus temperature of the copper brazing alloy.
37. The method according to claim 35 or 36 wherein the substrate is carbon or low alloy steel, stainless steel or a copper or nickel alloy having a higher melting point than the brazing alloy.
38. The method according to claim 35 or 36 wherein the carbide compound is tungsten carbide, silicon carbide, vanadium carbide, tantalum carbide, or titanium carbide.
39. The method according to claim 35 or 36 wherein the brazing temperature is achieved by furnance, induction, resistance or oxygen-gas torch heating.
CA000518645A 1986-09-19 1986-09-19 Copper-zinc-manganese-nickel alloys Expired - Lifetime CA1293394C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000518645A CA1293394C (en) 1986-09-19 1986-09-19 Copper-zinc-manganese-nickel alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000518645A CA1293394C (en) 1986-09-19 1986-09-19 Copper-zinc-manganese-nickel alloys

Publications (1)

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CA1293394C true CA1293394C (en) 1991-12-24

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011003857A3 (en) * 2009-07-08 2011-07-07 Berkenhoff Gmbh Auxiliary material for soldering sheets
EP2278033A4 (en) * 2008-03-09 2014-06-25 Mitsubishi Shindo Kk WHITE-SILVER COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
CN115491566A (en) * 2022-09-20 2022-12-20 河北中泊防爆工具集团股份有限公司 Low-copper alloy material and preparation method and application thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2278033A4 (en) * 2008-03-09 2014-06-25 Mitsubishi Shindo Kk WHITE-SILVER COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
WO2011003857A3 (en) * 2009-07-08 2011-07-07 Berkenhoff Gmbh Auxiliary material for soldering sheets
CN115491566A (en) * 2022-09-20 2022-12-20 河北中泊防爆工具集团股份有限公司 Low-copper alloy material and preparation method and application thereof

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