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GB2614045B - Power semiconductor apparatus - Google Patents

Power semiconductor apparatus Download PDF

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Publication number
GB2614045B
GB2614045B GB2118078.1A GB202118078A GB2614045B GB 2614045 B GB2614045 B GB 2614045B GB 202118078 A GB202118078 A GB 202118078A GB 2614045 B GB2614045 B GB 2614045B
Authority
GB
United Kingdom
Prior art keywords
power semiconductor
semiconductor apparatus
power
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2118078.1A
Other versions
GB202118078D0 (en
GB2614045A (en
Inventor
Li Yun
Ma Yaqing
Li Jianfeng
Dong Fangfang
Du Yuekang
Castillo Arcillas Joseph
Yan Jiayi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuzhou CRRC Times Electric Co Ltd
Original Assignee
Zhuzhou CRRC Times Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuzhou CRRC Times Electric Co Ltd filed Critical Zhuzhou CRRC Times Electric Co Ltd
Priority to GB2118078.1A priority Critical patent/GB2614045B/en
Publication of GB202118078D0 publication Critical patent/GB202118078D0/en
Priority to PCT/CN2022/137130 priority patent/WO2023109605A1/en
Publication of GB2614045A publication Critical patent/GB2614045A/en
Application granted granted Critical
Publication of GB2614045B publication Critical patent/GB2614045B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H10W40/47—
    • H10W40/613—
    • H10W44/501—
    • H10W90/00—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H10W40/60—
    • H10W70/468—
    • H10W70/481—
    • H10W90/701—
    • H10W90/811—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2118078.1A 2021-12-14 2021-12-14 Power semiconductor apparatus Active GB2614045B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2118078.1A GB2614045B (en) 2021-12-14 2021-12-14 Power semiconductor apparatus
PCT/CN2022/137130 WO2023109605A1 (en) 2021-12-14 2022-12-07 Power semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2118078.1A GB2614045B (en) 2021-12-14 2021-12-14 Power semiconductor apparatus

Publications (3)

Publication Number Publication Date
GB202118078D0 GB202118078D0 (en) 2022-01-26
GB2614045A GB2614045A (en) 2023-06-28
GB2614045B true GB2614045B (en) 2024-06-12

Family

ID=80080127

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2118078.1A Active GB2614045B (en) 2021-12-14 2021-12-14 Power semiconductor apparatus

Country Status (2)

Country Link
GB (1) GB2614045B (en)
WO (1) WO2023109605A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2529387A1 (en) * 1982-06-29 1983-12-30 Jeumont Schneider Mounting for power semiconductor chip-electrode stack - has heat dissipating end-plates with connecting rods and tightening screw
US20100302733A1 (en) * 2009-05-29 2010-12-02 Gm Global Technology Operations, Inc. Stacked busbar assembly with integrated cooling
US20160064305A1 (en) * 2014-08-28 2016-03-03 Toyota Jidosha Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US20200321884A1 (en) * 2019-04-08 2020-10-08 Toyota Jidosha Kabushiki Kaisha Power converter
CN111970909A (en) * 2020-08-27 2020-11-20 安徽祥博传热科技有限公司 Laminated double-sided liquid cooling radiator for new energy automobile inverter

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7808781B2 (en) * 2008-05-13 2010-10-05 International Business Machines Corporation Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
JP5879233B2 (en) 2012-08-31 2016-03-08 日立オートモティブシステムズ株式会社 Power semiconductor module
US9570374B2 (en) * 2014-01-03 2017-02-14 Rockwell Automation Technologies, Inc. Systems and methods for coupling a semiconductor device of an automation device to a heat sink
JP6187448B2 (en) 2014-12-24 2017-08-30 トヨタ自動車株式会社 Laminated unit
JP6354801B2 (en) 2016-07-21 2018-07-11 トヨタ自動車株式会社 Boost converter
US10874037B1 (en) * 2019-09-23 2020-12-22 Ford Global Technologies, Llc Power-module assembly with cooling arrangement
US20210293495A1 (en) * 2020-03-17 2021-09-23 Northrop Grumman Systems Corporation Mechanism for variable thermal conductance

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2529387A1 (en) * 1982-06-29 1983-12-30 Jeumont Schneider Mounting for power semiconductor chip-electrode stack - has heat dissipating end-plates with connecting rods and tightening screw
US20100302733A1 (en) * 2009-05-29 2010-12-02 Gm Global Technology Operations, Inc. Stacked busbar assembly with integrated cooling
US20160064305A1 (en) * 2014-08-28 2016-03-03 Toyota Jidosha Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US20200321884A1 (en) * 2019-04-08 2020-10-08 Toyota Jidosha Kabushiki Kaisha Power converter
CN111970909A (en) * 2020-08-27 2020-11-20 安徽祥博传热科技有限公司 Laminated double-sided liquid cooling radiator for new energy automobile inverter

Also Published As

Publication number Publication date
GB202118078D0 (en) 2022-01-26
WO2023109605A1 (en) 2023-06-22
GB2614045A (en) 2023-06-28

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