GB201607360D0 - Low temperature polycrystalline silicon thin film precleaning method and preparation method, and system for making low temperature polycrystalline silicon - Google Patents
Low temperature polycrystalline silicon thin film precleaning method and preparation method, and system for making low temperature polycrystalline siliconInfo
- Publication number
- GB201607360D0 GB201607360D0 GBGB1607360.3A GB201607360A GB201607360D0 GB 201607360 D0 GB201607360 D0 GB 201607360D0 GB 201607360 A GB201607360 A GB 201607360A GB 201607360 D0 GB201607360 D0 GB 201607360D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- low temperature
- polycrystalline silicon
- temperature polycrystalline
- preparation
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H10P70/15—
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- H10P70/20—
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- H10P34/42—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
-
- H10P14/27—
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- H10P14/2922—
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- H10P14/3238—
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- H10P14/3246—
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- H10P14/3411—
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- H10P14/3454—
-
- H10P14/3456—
-
- H10P14/3602—
-
- H10P14/3808—
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- H10P14/3816—
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- H10P70/27—
-
- H10P72/0414—
-
- H10P72/0431—
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- H10P72/0434—
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- H10P72/0468—
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- H10P95/04—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Recrystallisation Techniques (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310728592.4A CN103681244B (en) | 2013-12-25 | 2013-12-25 | The preparation method of low-temperature polysilicon film and manufacturing system thereof |
| PCT/CN2013/090627 WO2015096113A1 (en) | 2013-12-25 | 2013-12-27 | Low temperature polycrystalline silicon thin film precleaning method and preparation method, and system for making low temperature polycrystalline silicon thin film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB201607360D0 true GB201607360D0 (en) | 2016-06-15 |
| GB2535369A GB2535369A (en) | 2016-08-17 |
| GB2535369B GB2535369B (en) | 2018-12-05 |
Family
ID=50318455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1607360.3A Expired - Fee Related GB2535369B (en) | 2013-12-25 | 2013-12-27 | Pre-cleaning method and preparation method of low-temperature polysilicon thin film, liquid crystal display device, and manufacturing system thereof |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9287108B2 (en) |
| JP (1) | JP6286547B2 (en) |
| KR (1) | KR101944598B1 (en) |
| CN (1) | CN103681244B (en) |
| DE (1) | DE112013007733T5 (en) |
| GB (1) | GB2535369B (en) |
| RU (1) | RU2647561C2 (en) |
| WO (1) | WO2015096113A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037060B (en) * | 2014-05-14 | 2017-06-30 | 京东方科技集团股份有限公司 | The preparation method of polycrystalline metal oxide figure |
| CN104597609A (en) | 2015-02-06 | 2015-05-06 | 京东方科技集团股份有限公司 | Pixel array, display device and display method |
| CN106024707B (en) * | 2016-08-10 | 2018-11-13 | 昆山国显光电有限公司 | Array substrate and preparation method thereof |
| CN106981416B (en) * | 2017-05-17 | 2019-11-26 | 武汉华星光电技术有限公司 | Utilize the system and its bogey of quasi-molecule laser annealing production low temperature polycrystalline silicon |
| CN107275198B (en) * | 2017-05-31 | 2020-03-10 | 昆山国显光电有限公司 | Laser annealing method and laser annealing system |
| CN109643657B (en) * | 2017-06-22 | 2022-08-16 | 深圳市柔宇科技股份有限公司 | Manufacturing equipment and manufacturing method of array substrate |
| CN108155118A (en) * | 2017-12-06 | 2018-06-12 | 中建材浚鑫科技有限公司 | A kind of polysilicon chip cleaning system and its cleaning method |
| CN108231558B (en) * | 2018-01-02 | 2020-07-28 | 京东方科技集团股份有限公司 | Excimer laser annealing temperature control system and method and annealing device |
| FR3114251B1 (en) * | 2020-09-22 | 2023-04-28 | Commissariat Energie Atomique | Device and method for manufacturing a crystalline conversion layer from a solution |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2833545B2 (en) * | 1995-03-06 | 1998-12-09 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| US6083849A (en) * | 1995-11-13 | 2000-07-04 | Micron Technology, Inc. | Methods of forming hemispherical grain polysilicon |
| JPH11111683A (en) * | 1997-09-30 | 1999-04-23 | Sony Corp | Method for manufacturing semiconductor device |
| JPH11162876A (en) * | 1997-11-28 | 1999-06-18 | Nec Corp | Apparatus and method for manufacturing semiconductor device |
| JP3331999B2 (en) * | 1999-02-09 | 2002-10-07 | 日本電気株式会社 | Manufacturing method of semiconductor thin film |
| JP2002043274A (en) * | 2000-07-25 | 2002-02-08 | Kanto Chem Co Inc | Surface treatment agent for polysilicon film and method for surface treatment of polysilicon film using the same |
| TW452892B (en) * | 2000-08-09 | 2001-09-01 | Lin Jing Wei | Re-crystallization method of polysilicon thin film of thin film transistor |
| US6580053B1 (en) * | 2000-08-31 | 2003-06-17 | Sharp Laboratories Of America, Inc. | Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films |
| KR100737911B1 (en) * | 2001-02-01 | 2007-07-10 | 삼성전자주식회사 | Low temperature polycrystalline silicon thin film transistor manufacturing method |
| JP4599734B2 (en) * | 2001-03-14 | 2010-12-15 | ソニー株式会社 | Method for forming polycrystalline semiconductor thin film and method for manufacturing semiconductor device |
| JP2003133560A (en) * | 2001-10-30 | 2003-05-09 | Sony Corp | Method for manufacturing thin film transistor |
| JP2003158135A (en) * | 2001-11-26 | 2003-05-30 | Matsushita Electric Ind Co Ltd | Method of manufacturing thin film transistor and method of manufacturing display device including the same |
| US7235466B2 (en) * | 2002-10-31 | 2007-06-26 | Au Optronics Corporation | Method of fabricating a polysilicon layer |
| KR100947180B1 (en) * | 2003-06-03 | 2010-03-15 | 엘지디스플레이 주식회사 | Method of manufacturing polysilicon thin film transistor |
| JP2005349301A (en) * | 2004-06-10 | 2005-12-22 | Seiko Epson Corp | Cleaning device and cleaning method |
| US20060240647A1 (en) * | 2005-04-25 | 2006-10-26 | Toshiba Matsushita Display Technology Co., Ltd. | Film control method and device thereof |
| JP2006332589A (en) * | 2005-04-25 | 2006-12-07 | Toshiba Matsushita Display Technology Co Ltd | Method and apparatus for controlling film |
| KR100753432B1 (en) * | 2005-11-08 | 2007-08-31 | 경희대학교 산학협력단 | Polycrystalline Silicon and its Crystallization Method |
| JP2007188953A (en) * | 2006-01-11 | 2007-07-26 | Toshiba Matsushita Display Technology Co Ltd | Method for manufacturing polycrystal silicon layer |
| JP4001906B2 (en) * | 2006-12-22 | 2007-10-31 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| WO2009057223A1 (en) * | 2007-11-02 | 2009-05-07 | Canon Anelva Corporation | Surface treating apparatus and method for substrate treatment |
| RU2431215C1 (en) * | 2010-06-02 | 2011-10-10 | Учреждение Российской академии наук Институт физики полупроводников им. А.В. Ржанова Сибирского отделения РАН (ИФП СО РАН) | Method of obtaining layer of polycrystalline silicon |
| CN102021580A (en) * | 2010-10-30 | 2011-04-20 | 江苏顺风光电科技有限公司 | Improved clear water-washing process for solar crystalline silicon wafer |
| KR101298220B1 (en) * | 2012-01-20 | 2013-08-22 | 주식회사 엠엠테크 | Surface treating system for a substrate having a compact structure and surface treating method for the substrate |
| JP5964107B2 (en) * | 2012-03-29 | 2016-08-03 | 株式会社ニューフレアテクノロジー | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
| CN103346065A (en) * | 2013-06-08 | 2013-10-09 | 上海和辉光电有限公司 | Laser annealing method and device |
-
2013
- 2013-12-25 CN CN201310728592.4A patent/CN103681244B/en not_active Expired - Fee Related
- 2013-12-27 RU RU2016124648A patent/RU2647561C2/en active
- 2013-12-27 KR KR1020167016394A patent/KR101944598B1/en not_active Expired - Fee Related
- 2013-12-27 GB GB1607360.3A patent/GB2535369B/en not_active Expired - Fee Related
- 2013-12-27 US US14/234,144 patent/US9287108B2/en not_active Expired - Fee Related
- 2013-12-27 JP JP2016532049A patent/JP6286547B2/en not_active Expired - Fee Related
- 2013-12-27 DE DE112013007733.7T patent/DE112013007733T5/en not_active Ceased
- 2013-12-27 WO PCT/CN2013/090627 patent/WO2015096113A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20150214036A1 (en) | 2015-07-30 |
| RU2647561C2 (en) | 2018-03-16 |
| RU2016124648A (en) | 2017-12-26 |
| CN103681244A (en) | 2014-03-26 |
| CN103681244B (en) | 2016-09-14 |
| GB2535369A (en) | 2016-08-17 |
| WO2015096113A1 (en) | 2015-07-02 |
| GB2535369B (en) | 2018-12-05 |
| DE112013007733T5 (en) | 2017-01-12 |
| KR20160088405A (en) | 2016-07-25 |
| JP6286547B2 (en) | 2018-02-28 |
| JP2017511592A (en) | 2017-04-20 |
| US9287108B2 (en) | 2016-03-15 |
| KR101944598B1 (en) | 2019-01-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 789A | Request for publication of translation (sect. 89(a)/1977) |
Ref document number: 2015096113 Country of ref document: WO |
|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20221227 |