GB2083285B - Over/under dual in-line chip package - Google Patents

Over/under dual in-line chip package

Info

Publication number: GB2083285B
Authority: GB; United Kingdom
Prior art keywords: over; chip package; under dual; line chip; line
Prior art date: 1980-02-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB8129603A

Other versions

GB2083285A (en

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CTU of Delaware Inc

Original Assignee

Mostek Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-02-12

Filing date

1980-05-22

Publication date

1984-08-15

1980-05-22 Application filed by Mostek Corp filed Critical Mostek Corp

1982-03-17 Publication of GB2083285A publication Critical patent/GB2083285A/en

1984-08-15 Application granted granted Critical

1984-08-15 Publication of GB2083285B publication Critical patent/GB2083285B/en

Status Expired legal-status Critical Current

Classifications

- H10W76/157—
- H10W70/60—
- H10W70/611—
- H10W70/685—

GB8129603A 1980-02-12 1980-05-22 Over/under dual in-line chip package Expired GB2083285B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US12091780A	1980-02-12	1980-02-12

Publications (2)

Publication Number	Publication Date
GB2083285A GB2083285A (en)	1982-03-17
GB2083285B true GB2083285B (en)	1984-08-15

Family

ID=22393267

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB8129603A Expired GB2083285B (en)	1980-02-12	1980-05-22	Over/under dual in-line chip package

Country Status (6)

Country	Link
JP (1)	JPS6356706B2 (en)
CA (1)	CA1165465A (en)
FR (1)	FR2476389A1 (en)
GB (1)	GB2083285B (en)
NL (1)	NL8020334A (en)
WO (1)	WO1981002367A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS58159360A (en) *	1982-03-17	1983-09-21	Fujitsu Ltd	Semiconductor device
US4727410A (en) *	1983-11-23	1988-02-23	Cabot Technical Ceramics, Inc.	High density integrated circuit package
WO1985002941A1 (en) *	1983-12-28	1985-07-04	Hughes Aircraft Company	Flat package for integrated circuit memory chips
US4598308A (en) *	1984-04-02	1986-07-01	Burroughs Corporation	Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
US4630096A (en) *	1984-05-30	1986-12-16	Motorola, Inc.	High density IC module assembly
EP0204568A3 (en) *	1985-06-05	1988-07-27	Harry Arthur Hele Spence-Bate	Low power circuitry components
EP0241236A3 (en) *	1986-04-11	1989-03-08	AT&T Corp.	Cavity package for saw devices and associated electronics
GB2199182A (en) *	1986-12-18	1988-06-29	Marconi Electronic Devices	Multilayer circuit arrangement
FR2625042B1 (en) *	1987-12-22	1990-04-20	Thomson Csf	MODULAR HYBRID MICROELECTRONIC STRUCTURE WITH HIGH INTEGRATION DENSITY
US5150196A (en) *	1989-07-17	1992-09-22	Hughes Aircraft Company	Hermetic sealing of wafer scale integrated wafer
FR2772516B1 (en) *	1997-12-12	2003-07-04	Ela Medical Sa	ELECTRONIC CIRCUIT, IN PARTICULAR FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE SUCH AS A CARDIAC STIMULATOR OR DEFIBRILLATOR, AND ITS MANUFACTURING METHOD
GB9915076D0 (en) *	1999-06-28	1999-08-25	Shen Ming Tung	Integrated circuit packaging structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3341649A (en) *	1964-01-17	1967-09-12	Signetics Corp	Modular package for semiconductor devices
US3372310A (en) *	1965-04-30	1968-03-05	Radiation Inc	Universal modular packages for integrated circuits
US3500440A (en) *	1968-01-08	1970-03-10	Interamericano Projects Inc	Functional building blocks facilitating mass production of electronic equipment by unskilled labor
US3555364A (en) *	1968-01-31	1971-01-12	Drexel Inst Of Technology	Microelectronic modules and assemblies
JPS5332233B1 (en) *	1968-12-25	1978-09-07
US3746934A (en) *	1971-05-06	1973-07-17	Siemens Ag	Stack arrangement of semiconductor chips
US3760090A (en) *	1971-08-19	1973-09-18	Globe Union Inc	Electronic circuit package and method for making same
US3927815A (en) *	1971-11-22	1975-12-23	Ngk Insulators Ltd	Method for producing multilayer metallized beryllia ceramics
US3777220A (en) *	1972-06-30	1973-12-04	Ibm	Circuit panel and method of construction
US3777221A (en) *	1972-12-18	1973-12-04	Ibm	Multi-layer circuit package
US4012766A (en) *	1973-08-28	1977-03-15	Western Digital Corporation	Semiconductor package and method of manufacture thereof
US4038488A (en) *	1975-05-12	1977-07-26	Cambridge Memories, Inc.	Multilayer ceramic multi-chip, dual in-line packaging assembly
US4079511A (en) *	1976-07-30	1978-03-21	Amp Incorporated	Method for packaging hermetically sealed integrated circuit chips on lead frames
US4224637A (en) *	1978-08-10	1980-09-23	Minnesota Mining And Manufacturing Company	Leaded mounting and connector unit for an electronic device

1980
- 1980-05-22 GB GB8129603A patent/GB2083285B/en not_active Expired
- 1980-05-22 NL NL8020334A patent/NL8020334A/nl unknown
- 1980-05-22 WO PCT/US1980/000662 patent/WO1981002367A1/en not_active Ceased
- 1980-05-22 JP JP55502028A patent/JPS6356706B2/ja not_active Expired
1981
- 1981-02-11 CA CA000370651A patent/CA1165465A/en not_active Expired
- 1981-02-12 FR FR8102748A patent/FR2476389A1/en active Granted

Also Published As

Publication number	Publication date
NL8020334A (en)	1982-01-04
CA1165465A (en)	1984-04-10
GB2083285A (en)	1982-03-17
JPS6356706B2 (en)	1988-11-09
FR2476389B1 (en)	1983-12-16
FR2476389A1 (en)	1981-08-21
WO1981002367A1 (en)	1981-08-20
JPS57500220A (en)	1982-02-04

Publication	Publication Date	Title
GB2093338B (en)	1985-09-25	Coffee package
GB8307427D0 (en)	1983-04-27	Beverage package
JPS57134953A (en)	1982-08-20	Integrated circuit package
DE3366315D1 (en)	1986-10-23	Oval dual-ac-capacitor package
JPS56103751A (en)	1981-08-19	Sequential chip selection decoder
GB2068337B (en)	1983-07-06	Packages
GB2096394B (en)	1985-02-20	Four-lead dual in-line package module for semiconductor devices
JPS5786474A (en)	1982-05-29	Package for drink
GB8329071D0 (en)	1983-12-07	Semiconductor
DE3380780D1 (en)	1989-11-30	Semiconductor sense-amplifier circuitry
GB2083285B (en)	1984-08-15	Over/under dual in-line chip package
JPS57133861A (en)	1982-08-18	Package
JPS5738958A (en)	1982-03-03	Spray chip
JPS55126059A (en)	1980-09-29	Package
JPS5796970A (en)	1982-06-16	Package
JPS56131135A (en)	1981-10-14	Package
JPS56140602A (en)	1981-11-04	Semiconductor composition
DE3372354D1 (en)	1987-08-13	Stopcock package
JPS56113561A (en)	1981-09-07	Shaoomai package
ZA818655B (en)	1982-11-24	Coffee package
JPS5772316A (en)	1982-05-06	Chip type electronic part
JPS5796587A (en)	1982-06-15	Chip part
GB8325985D0 (en)	1983-11-02	Packages
JPS56131134A (en)	1981-10-14	Package
JPS5796968A (en)	1982-06-16	Package

Legal Events

Date	Code	Title	Description
1993-09-29	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
1996-01-17	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 19950522