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GB2046024B - Circuit assembly - Google Patents

Circuit assembly

Info

Publication number
GB2046024B
GB2046024B GB7911308A GB7911308A GB2046024B GB 2046024 B GB2046024 B GB 2046024B GB 7911308 A GB7911308 A GB 7911308A GB 7911308 A GB7911308 A GB 7911308A GB 2046024 B GB2046024 B GB 2046024B
Authority
GB
United Kingdom
Prior art keywords
circuit assembly
assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7911308A
Other versions
GB2046024A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB7911308A priority Critical patent/GB2046024B/en
Priority to DE3010770A priority patent/DE3010770A1/en
Priority to FR8006659A priority patent/FR2452787B1/en
Publication of GB2046024A publication Critical patent/GB2046024A/en
Application granted granted Critical
Publication of GB2046024B publication Critical patent/GB2046024B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/114—
    • H10W76/157—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H10W72/50—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W90/753—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Conductors (AREA)
  • Details Of Resistors (AREA)
GB7911308A 1979-03-30 1979-03-30 Circuit assembly Expired GB2046024B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB7911308A GB2046024B (en) 1979-03-30 1979-03-30 Circuit assembly
DE3010770A DE3010770A1 (en) 1979-03-30 1980-03-20 CIRCUIT ARRANGEMENT WITH THIN FILM COMPONENTS
FR8006659A FR2452787B1 (en) 1979-03-30 1980-03-26 THIN FILM CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7911308A GB2046024B (en) 1979-03-30 1979-03-30 Circuit assembly

Publications (2)

Publication Number Publication Date
GB2046024A GB2046024A (en) 1980-11-05
GB2046024B true GB2046024B (en) 1983-01-26

Family

ID=10504247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7911308A Expired GB2046024B (en) 1979-03-30 1979-03-30 Circuit assembly

Country Status (3)

Country Link
DE (1) DE3010770A1 (en)
FR (1) FR2452787B1 (en)
GB (1) GB2046024B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875863A (en) * 1981-10-13 1983-05-07 フエアチヤイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Hybrid circuit module and method of producing same
FR2524707B1 (en) * 1982-04-01 1985-05-31 Cit Alcatel METHOD OF ENCAPSULATION OF SEMICONDUCTOR COMPONENTS, AND ENCAPSULATED COMPONENTS OBTAINED
JPS59208800A (en) * 1983-05-12 1984-11-27 株式会社日立製作所 Electronic device for vehicle
DE3407784A1 (en) * 1984-03-02 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim THICK-LAYER HYBRID CIRCUIT
FR2605463A1 (en) * 1986-10-17 1988-04-22 Renault Vehicules Ind Electrical connection device
GB2220107B (en) * 1988-04-30 1992-06-24 Pressac Ltd Circuit board assembly
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404213A (en) * 1962-07-26 1968-10-01 Owens Illinois Inc Hermetic packages for electronic components
US3178506A (en) * 1962-08-09 1965-04-13 Westinghouse Electric Corp Sealed functional molecular electronic device
IE33422B1 (en) * 1968-12-09 1974-06-26 Gen Electric Semiconductor device with shock absorbing and passivation means
US3714709A (en) * 1970-07-06 1973-02-06 Rca Corp Method of manufacturing thick-film hybrid integrated circuits
DE2419157C3 (en) * 1974-04-20 1979-06-28 W.C. Heraeus Gmbh, 6450 Hanau Metallic carrier for semiconductor components and process for its manufacture
JPS51138179A (en) * 1975-05-23 1976-11-29 Seiko Instr & Electronics Ltd Semi-conductor device

Also Published As

Publication number Publication date
FR2452787A1 (en) 1980-10-24
GB2046024A (en) 1980-11-05
FR2452787B1 (en) 1985-12-06
DE3010770A1 (en) 1980-10-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee