GB1595245A - Method of producing thinclad materials for printed circuits - Google Patents
Method of producing thinclad materials for printed circuits Download PDFInfo
- Publication number
- GB1595245A GB1595245A GB54191/77A GB5419177A GB1595245A GB 1595245 A GB1595245 A GB 1595245A GB 54191/77 A GB54191/77 A GB 54191/77A GB 5419177 A GB5419177 A GB 5419177A GB 1595245 A GB1595245 A GB 1595245A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- foil
- pressure
- pressure laminate
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 239000002184 metal Substances 0.000 claims abstract description 70
- 239000002131 composite material Substances 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 239000002699 waste material Substances 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 claims abstract 2
- 239000011888 foil Substances 0.000 claims description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 239000012777 electrically insulating material Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 229920002994 synthetic fiber Polymers 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 238000010924 continuous production Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000003302 ferromagnetic material Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 230000004913 activation Effects 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/208—Magnetic, paramagnetic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulating Bodies (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2659625A DE2659625C3 (de) | 1976-12-30 | 1976-12-30 | Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1595245A true GB1595245A (en) | 1981-08-12 |
Family
ID=5997078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB54191/77A Expired GB1595245A (en) | 1976-12-30 | 1977-12-29 | Method of producing thinclad materials for printed circuits |
Country Status (11)
| Country | Link |
|---|---|
| JP (1) | JPS53111480A (de) |
| BE (1) | BE862476A (de) |
| BR (1) | BR7708768A (de) |
| CH (1) | CH627405A5 (de) |
| DE (1) | DE2659625C3 (de) |
| ES (1) | ES466030A1 (de) |
| FR (1) | FR2376593A1 (de) |
| GB (1) | GB1595245A (de) |
| IT (1) | IT1091341B (de) |
| NL (1) | NL7714506A (de) |
| SE (1) | SE7714867L (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2486875A1 (fr) * | 1980-07-17 | 1982-01-22 | Dassault Avions | Procede pour metalliser au moins partiellement la surface d'une piece stratifiee |
| DE3631055C1 (de) * | 1986-09-12 | 1987-05-21 | Deutsche Automobilgesellsch | Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung |
| CN107529293B (zh) * | 2017-09-18 | 2019-05-28 | Oppo广东移动通信有限公司 | 一种移动终端、多层pcb电路板及其制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL93768C (de) * | 1957-06-07 | 1960-03-15 | Philips Nv | |
| DE1171485B (de) * | 1960-07-25 | 1964-06-04 | Photocircuits Corp | Verfahren zum Herstellen von elektrischen Bau-elementen nach Art der gedruckten Schaltungen |
| NL135706C (de) * | 1966-07-29 | 1900-01-01 | ||
| DE1646064C3 (de) * | 1966-12-29 | 1978-05-24 | Politechnika Slaska Im. Wincentego Pstrowskiego, Gleiwitz (Polen) | Verfahren zur Herstellung von mit Polyesterharzen beschichteten Metallfolien für elektro- und radiotechnische sowie elektronische Zwecke |
| DE1690025B2 (de) * | 1967-08-09 | 1976-10-07 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Vorbehandlungsverfahren fuer duenne isolierfolien aus polyaethylenterephthalat |
| BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
| DE2413932C2 (de) * | 1973-04-25 | 1984-08-30 | Yates Industries, Inc., Bordentown, N.J. | Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise |
| JPS5143571A (ja) * | 1974-10-09 | 1976-04-14 | Hiroki Katsuki | Keesuisosochi |
-
1976
- 1976-12-30 DE DE2659625A patent/DE2659625C3/de not_active Expired
-
1977
- 1977-12-26 JP JP15873377A patent/JPS53111480A/ja active Granted
- 1977-12-29 BE BE183974A patent/BE862476A/xx unknown
- 1977-12-29 NL NL7714506A patent/NL7714506A/xx not_active Application Discontinuation
- 1977-12-29 IT IT52423/77A patent/IT1091341B/it active
- 1977-12-29 CH CH1621877A patent/CH627405A5/de not_active IP Right Cessation
- 1977-12-29 ES ES466030A patent/ES466030A1/es not_active Expired
- 1977-12-29 SE SE7714867A patent/SE7714867L/xx not_active Application Discontinuation
- 1977-12-29 GB GB54191/77A patent/GB1595245A/en not_active Expired
- 1977-12-29 BR BR7708768A patent/BR7708768A/pt unknown
- 1977-12-30 FR FR7739862A patent/FR2376593A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| ES466030A1 (es) | 1978-10-01 |
| IT1091341B (it) | 1985-07-06 |
| BE862476A (fr) | 1978-04-14 |
| FR2376593A1 (fr) | 1978-07-28 |
| DE2659625B2 (de) | 1979-01-11 |
| CH627405A5 (en) | 1982-01-15 |
| DE2659625C3 (de) | 1981-07-02 |
| SE7714867L (sv) | 1978-07-01 |
| JPS5731675B2 (de) | 1982-07-06 |
| NL7714506A (nl) | 1978-07-04 |
| JPS53111480A (en) | 1978-09-29 |
| DE2659625A1 (de) | 1978-07-06 |
| FR2376593B1 (de) | 1980-07-04 |
| BR7708768A (pt) | 1978-09-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |