GB1448659A - Electroless deposition of copper silver and gold - Google Patents
Electroless deposition of copper silver and goldInfo
- Publication number
- GB1448659A GB1448659A GB1712775A GB1712775A GB1448659A GB 1448659 A GB1448659 A GB 1448659A GB 1712775 A GB1712775 A GB 1712775A GB 1712775 A GB1712775 A GB 1712775A GB 1448659 A GB1448659 A GB 1448659A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alkali metal
- bath
- gold
- electroless deposition
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010931 gold Substances 0.000 title abstract 5
- 229910052737 gold Inorganic materials 0.000 title abstract 4
- 230000008021 deposition Effects 0.000 title abstract 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical group [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 title 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052783 alkali metal Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 229910052709 silver Inorganic materials 0.000 abstract 3
- -1 alkali metal cyanide Chemical class 0.000 abstract 2
- 150000001340 alkali metals Chemical class 0.000 abstract 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052763 palladium Inorganic materials 0.000 abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- 239000010944 silver (metal) Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 abstract 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 abstract 1
- 229910019142 PO4 Inorganic materials 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 229910000085 borane Inorganic materials 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 239000006172 buffering agent Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 abstract 1
- 150000003949 imides Chemical class 0.000 abstract 1
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000011572 manganese Substances 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 239000011707 mineral Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000010452 phosphate Substances 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 229940095064 tartrate Drugs 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1448659 Electroless deposition of Cu Ag or Au ENGELHARD MINERALS & CHEMICALS CORP 24 April 1975 [26 April 1974] 17127/75 Heading C7F An aqueous, electroless Au, Ag or Cu plating bath pH 11 to 14 comprises an imide complex of the metal, an alkali metal cyanide and a reducing agent which is an alkali metal borohydride, amine borane or formaldehyde. A buffering agent which is a phosphate, citrate, tartrate, borate or metaborate of an alkali metal, and a chelating agent, e.g. e.d.t.a. or n.t.a. The substrate may be Co, Fe, steel, Pd, Pt, Cu, brass, Mn, Cr, Mo, W, Ti, Sn, Ag or glass, ceramic or plastics which have been contacted with stannous and palladium chlorides. Metal substrates may be first plated with Au using a gold cyanide bath. The Specification gives a specific example of a Au, Ag and a Cu bath.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US464666A US3917885A (en) | 1974-04-26 | 1974-04-26 | Electroless gold plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1448659A true GB1448659A (en) | 1976-09-08 |
Family
ID=23844812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1712775A Expired GB1448659A (en) | 1974-04-26 | 1975-04-24 | Electroless deposition of copper silver and gold |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3917885A (en) |
| JP (1) | JPS5818430B2 (en) |
| BR (1) | BR7502540A (en) |
| CA (1) | CA1038559A (en) |
| DD (1) | DD117488A5 (en) |
| DE (1) | DE2518559A1 (en) |
| FR (1) | FR2268595B1 (en) |
| GB (1) | GB1448659A (en) |
| IT (1) | IT1035454B (en) |
| MX (1) | MX146110A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2747562A1 (en) * | 1977-10-20 | 1979-05-03 | Schering Ag | PROCESS AND PLANT FOR THE RECOVERY OF METALS AND OTHER RECYCLING SUBSTANCES IN WASTE WATER FROM CHEMICAL SURFACE TREATMENT PLANTS |
| GB2133046A (en) * | 1982-12-01 | 1984-07-18 | Omi Int Corp | Electroless direct deposition of gold in metallized ceramics |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4082908A (en) * | 1976-05-05 | 1978-04-04 | Burr-Brown Research Corporation | Gold plating process and product produced thereby |
| US4162337A (en) * | 1977-11-14 | 1979-07-24 | Bell Telephone Laboratories, Incorporated | Process for fabricating III-V semiconducting devices with electroless gold plating |
| FR2441666A1 (en) * | 1978-11-16 | 1980-06-13 | Prost Tournier Patrick | PROCESS FOR CHEMICAL DEPOSITION OF GOLD BY SELF-CATALYTIC REDUCTION |
| US4340451A (en) * | 1979-12-17 | 1982-07-20 | Bell Telephone Laboratories, Incorporated | Method of replenishing gold/in plating baths |
| DE3029785A1 (en) * | 1980-08-04 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | ACID GOLD BATH FOR ELECTRIC DEPOSIT OF GOLD |
| US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| JPS60179127U (en) * | 1984-05-09 | 1985-11-28 | ヤンマー農機株式会社 | combine |
| US4822641A (en) * | 1985-04-30 | 1989-04-18 | Inovan Gmbh & Co. Kg | Method of manufacturing a contact construction material structure |
| US4863766A (en) * | 1986-09-02 | 1989-09-05 | General Electric Company | Electroless gold plating composition and method for plating |
| US4798626A (en) * | 1986-09-30 | 1989-01-17 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
| US4925491A (en) * | 1986-09-30 | 1990-05-15 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
| US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
| EP0369545B1 (en) * | 1988-11-15 | 1992-08-19 | H.B.T. Holland Biotechnology B.V. | Process for the preparation of elemental sols |
| US5130168A (en) * | 1988-11-22 | 1992-07-14 | Technic, Inc. | Electroless gold plating bath and method of using same |
| US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
| US4979988A (en) * | 1989-12-01 | 1990-12-25 | General Electric Company | Autocatalytic electroless gold plating composition |
| US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
| US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
| EP1245697A3 (en) * | 2002-07-17 | 2003-02-19 | ATOTECH Deutschland GmbH | Process for electroles silver plating |
| JP2004176171A (en) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | Non-cyanide electrolytic gold plating solution |
| US20060141149A1 (en) * | 2004-12-29 | 2006-06-29 | Industrial Technology Research Institute | Method for forming superparamagnetic nanoparticles |
| US20090139264A1 (en) * | 2007-11-30 | 2009-06-04 | Rachel Brown | Antique jewelry articles and methods of making same |
| US20150345039A1 (en) * | 2015-07-20 | 2015-12-03 | National Institute Of Standards And Technology | Composition having alkaline ph and process for forming superconformation therewith |
| US11579344B2 (en) | 2012-09-17 | 2023-02-14 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metallic grating |
| CN102925933B (en) * | 2012-11-05 | 2015-03-04 | 福州大学 | Au-FeNi double-section type alloy nano motor and production method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
| US3515571A (en) * | 1963-07-02 | 1970-06-02 | Lockheed Aircraft Corp | Deposition of gold films |
| US3294578A (en) * | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
| US3589916A (en) * | 1964-06-24 | 1971-06-29 | Photocircuits Corp | Autocatalytic gold plating solutions |
| US3506462A (en) * | 1966-10-29 | 1970-04-14 | Nippon Electric Co | Electroless gold plating solutions |
| US3482974A (en) * | 1966-12-27 | 1969-12-09 | Gen Electric | Method of plating gold films onto oxide-free silicon substrates |
| US3700469A (en) * | 1971-03-08 | 1972-10-24 | Bell Telephone Labor Inc | Electroless gold plating baths |
| US3697296A (en) * | 1971-03-09 | 1972-10-10 | Du Pont | Electroless gold plating bath and process |
-
1974
- 1974-04-26 US US464666A patent/US3917885A/en not_active Expired - Lifetime
-
1975
- 1975-04-09 MX MX157698A patent/MX146110A/en unknown
- 1975-04-23 CA CA225,269A patent/CA1038559A/en not_active Expired
- 1975-04-24 IT IT49280/75A patent/IT1035454B/en active
- 1975-04-24 GB GB1712775A patent/GB1448659A/en not_active Expired
- 1975-04-24 JP JP50050163A patent/JPS5818430B2/en not_active Expired
- 1975-04-24 FR FR7512789A patent/FR2268595B1/fr not_active Expired
- 1975-04-25 DD DD185707A patent/DD117488A5/xx unknown
- 1975-04-25 DE DE19752518559 patent/DE2518559A1/en not_active Ceased
- 1975-04-25 BR BR3224/75A patent/BR7502540A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2747562A1 (en) * | 1977-10-20 | 1979-05-03 | Schering Ag | PROCESS AND PLANT FOR THE RECOVERY OF METALS AND OTHER RECYCLING SUBSTANCES IN WASTE WATER FROM CHEMICAL SURFACE TREATMENT PLANTS |
| GB2133046A (en) * | 1982-12-01 | 1984-07-18 | Omi Int Corp | Electroless direct deposition of gold in metallized ceramics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50149542A (en) | 1975-11-29 |
| US3917885A (en) | 1975-11-04 |
| DE2518559A1 (en) | 1975-11-13 |
| MX146110A (en) | 1982-05-18 |
| DD117488A5 (en) | 1976-01-12 |
| FR2268595A1 (en) | 1975-11-21 |
| AU8052375A (en) | 1976-10-28 |
| BR7502540A (en) | 1976-03-03 |
| IT1035454B (en) | 1979-10-20 |
| JPS5818430B2 (en) | 1983-04-13 |
| CA1038559A (en) | 1978-09-19 |
| FR2268595B1 (en) | 1981-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |