GB1051383A - - Google Patents
Info
- Publication number
- GB1051383A GB1051383A GB1051383DA GB1051383A GB 1051383 A GB1051383 A GB 1051383A GB 1051383D A GB1051383D A GB 1051383DA GB 1051383 A GB1051383 A GB 1051383A
- Authority
- GB
- United Kingdom
- Prior art keywords
- palladium
- alloys
- gold
- acetic acid
- sulphate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000576 coating method Methods 0.000 abstract 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- 229910001252 Pd alloy Inorganic materials 0.000 abstract 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 2
- 239000000337 buffer salt Substances 0.000 abstract 2
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 2
- RNMCCPMYXUKHAZ-UHFFFAOYSA-N 2-[3,3-diamino-1,2,2-tris(carboxymethyl)cyclohexyl]acetic acid Chemical compound NC1(N)CCCC(CC(O)=O)(CC(O)=O)C1(CC(O)=O)CC(O)=O RNMCCPMYXUKHAZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004254 Ammonium phosphate Substances 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 abstract 1
- 229910001361 White metal Inorganic materials 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 abstract 1
- 235000019289 ammonium phosphates Nutrition 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- -1 diamino-di-nitrite Chemical compound 0.000 abstract 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 abstract 1
- 150000002940 palladium Chemical class 0.000 abstract 1
- 150000002941 palladium compounds Chemical class 0.000 abstract 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052700 potassium Inorganic materials 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K potassium phosphate Substances [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 abstract 1
- 229910000160 potassium phosphate Inorganic materials 0.000 abstract 1
- 235000011009 potassium phosphates Nutrition 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 abstract 1
- 239000010969 white metal Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
1,051,383. Gold-Palladium alloys; coating metal surfaces. TECHNIC, Inc. Feb.16, 1965 [March 17, 1964], No.6640/65. Headings C7B and C7F. Gold-palladium alloys are made, or applied as a plating to metal surfaces using as electrolyte a palladium compound free of cyanide, gold cyanide, and a buffer salt. Palladium complexes specified are the ethylene diamine sulphate, cyclohexane diamine tetra-acetic acid, diamino-di-nitrite, potassium di-nitritosulphato-palladite, or the diethylene triamine pent acetic acid, which are preferred, but palladium chloride or sulphate may be used. As buffer salts potassium or ammonium phosphate or ammonium citrate are used. The pH of the solution is adjusted to 4 to 11 by adding alkali or ammonia. Coatings containing up to 12À6% of Pd are described, the coatings of high Pd content being applied by electroless deposition, and of lower Pd content by electrolysis at preferably 5 to 10 A.S.F. and at temperatures up to 2000F. Substrates are copper and copper alloys, brass and white metal alloys.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DET0028009 | 1965-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1051383A true GB1051383A (en) |
Family
ID=7553858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1051383D Active GB1051383A (en) | 1965-02-17 |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1521043B2 (en) |
| GB (1) | GB1051383A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3617452A (en) * | 1969-07-03 | 1971-11-02 | Engelhard Min & Chem | Gold plating |
| US3637473A (en) * | 1969-07-03 | 1972-01-25 | Engelhard Min & Chem | Method for electroplating gold |
| US4358350A (en) * | 1980-06-10 | 1982-11-09 | Degussa Ag | Strongly acid gold alloy bath |
| US6743346B2 (en) * | 2000-04-06 | 2004-06-01 | Metalor Technologies France Sas A French Simplified Joint Stock Company | Electrolytic solution for electrochemical deposit of palladium or its alloys |
| US6743950B2 (en) * | 2000-04-06 | 2004-06-01 | Metalor Technologies France Sas | Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012001132A1 (en) * | 2010-06-30 | 2012-01-05 | Schauenburg Ruhrkunststoff Gmbh | Tribologically loadable mixed noble metal/metal layers |
| WO2012001134A2 (en) | 2010-06-30 | 2012-01-05 | Schauenburg Ruhrkunststoff Gmbh | Method for depositing a nickel-metal layer |
-
0
- GB GB1051383D patent/GB1051383A/en active Active
-
1965
- 1965-02-17 DE DE19651521043 patent/DE1521043B2/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3617452A (en) * | 1969-07-03 | 1971-11-02 | Engelhard Min & Chem | Gold plating |
| US3637473A (en) * | 1969-07-03 | 1972-01-25 | Engelhard Min & Chem | Method for electroplating gold |
| US4358350A (en) * | 1980-06-10 | 1982-11-09 | Degussa Ag | Strongly acid gold alloy bath |
| US6743346B2 (en) * | 2000-04-06 | 2004-06-01 | Metalor Technologies France Sas A French Simplified Joint Stock Company | Electrolytic solution for electrochemical deposit of palladium or its alloys |
| US6743950B2 (en) * | 2000-04-06 | 2004-06-01 | Metalor Technologies France Sas | Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1521043B2 (en) | 1970-12-17 |
| DE1521043A1 (en) | 1969-07-03 |
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