[go: up one dir, main page]

GB1309502A - Semiconductor device and method of making the same - Google Patents

Semiconductor device and method of making the same

Info

Publication number
GB1309502A
GB1309502A GB3321971A GB3321971A GB1309502A GB 1309502 A GB1309502 A GB 1309502A GB 3321971 A GB3321971 A GB 3321971A GB 3321971 A GB3321971 A GB 3321971A GB 1309502 A GB1309502 A GB 1309502A
Authority
GB
United Kingdom
Prior art keywords
type
region
ring
diffused
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3321971A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB1309502A publication Critical patent/GB1309502A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H10D84/0119—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including complementary BJTs
    • H10D84/0121—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including complementary BJTs the complementary BJTs being vertical BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/67—Complementary BJTs
    • H10D84/673—Vertical complementary BJTs
    • H10W10/031—
    • H10W10/30—

Landscapes

  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)

Abstract

1309502 Semi-conductor devices SONY CORP 15 July 1971 [16 July 1970] 33219/71 Heading H1K In an IC two superposed epitaxial layers of the same conductivity type formed on a substrate of the opposite conductivity type are subdivided into two sections by an isolating wall of the same conductivity type of the substrate, a first transistor formed in one section having a buried layer of the same conductivity type as the epitaxial layers arranged between the lower epitaxial layer and the substrate, and a second transistor formed in the other section and having a buried layer of the same conductivity type as the substrate arranged between the two epitaxial layers. As shown, Fig. 1D, a P<SP>+</SP> type ring 3 and an N<SP>+</SP> type region 2 are diffused into a P-type wafer 1, an N-type epitaxial layer 4 is deposited, a second P<SP>+</SP> type ring 5 is diffused above the first ring 3, a P+ type region 6 is diffused into the layer outside ring 5 and a small N+ type region 26 is diffused within ring 5, a second N-type epitaxial layer is deposited, two P+ type rings 9, 13 are diffused-in one above rings 3 and 5 and the other above the region 6, and the structure is then heated to redistribute the impurities so that the rings join up to form isolation walls surrounding N-type islands 11, 14. An NPN transistor is formed in island 11 by diffusing-in a P-type base region (15) and N<SP>+</SP> type emitter and collector contact regions (16, 17). A PNP transistor is formed using island 14 as part of the base region by diffusing-in an N<SP>+</SP> type base region (18) within which is diffused a P-type emitter region (19), the buried region 6 and ring 13 forming the collector region. The N+ type emitter and collector regions of the NPN transistor and the base region of the PNP transistor are formed by a single diffusion step. In a modification, Fig. 2 (not shown), the initial isolation rings are extended to enclose both islands in a figure-8 configuration and the portion containing the P+ type buried layer is processed to form an FET by diffusing a P-type gate region diametrically across the contacting P+ type ring and diffusing in N+ type source and drain regions. These P-type and N<SP>+</SP> type are formed simultaneously with the base and emitter regions of an NPN bipolar transistor formed in the other island.
GB3321971A 1970-07-16 1971-07-15 Semiconductor device and method of making the same Expired GB1309502A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45062437A JPS50278B1 (en) 1970-07-16 1970-07-16

Publications (1)

Publication Number Publication Date
GB1309502A true GB1309502A (en) 1973-03-14

Family

ID=13200155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3321971A Expired GB1309502A (en) 1970-07-16 1971-07-15 Semiconductor device and method of making the same

Country Status (3)

Country Link
JP (1) JPS50278B1 (en)
CA (1) CA936624A (en)
GB (1) GB1309502A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2543739A1 (en) * 1983-03-30 1984-10-05 Radiotechnique Compelec METHOD FOR MAKING A HIGH VOLTAGE BIPOLAR TRANSISTOR
CN118091384A (en) * 2024-04-29 2024-05-28 杭州广立微电子股份有限公司 SDB isolation test structure generation method, SDB isolation test structure and storage medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2543739A1 (en) * 1983-03-30 1984-10-05 Radiotechnique Compelec METHOD FOR MAKING A HIGH VOLTAGE BIPOLAR TRANSISTOR
EP0126499A1 (en) * 1983-03-30 1984-11-28 Rtc-Compelec Process for making a high-voltage bipolar transistor
CN118091384A (en) * 2024-04-29 2024-05-28 杭州广立微电子股份有限公司 SDB isolation test structure generation method, SDB isolation test structure and storage medium

Also Published As

Publication number Publication date
CA936624A (en) 1973-11-06
JPS50278B1 (en) 1975-01-07

Similar Documents

Publication Publication Date Title
GB1402376A (en) Zener diode structure
GB1314355A (en) Semiconductor device
GB1280022A (en) Improvements in and relating to semiconductor devices
ES346217A1 (en) Monolithic ic with complementary transistors and plural buried layers
GB1444633A (en) Semiconductor integrated circuits
GB1483801A (en) Planar diffusion process for manufacturing monolithic integrated circuits
GB1263127A (en) Integrated circuits
GB1046152A (en) Diode structure in semiconductor integrated circuit and method of making same
GB1298059A (en) Improvements in semiconductor devices
GB1073551A (en) Integrated circuit comprising a diode and method of making the same
GB1217472A (en) Integrated circuits
GB1260977A (en) Improvements in semiconductor devices
GB1220023A (en) Integrated semiconductor circuit arrangement
GB1372607A (en) Semiconductor devices
GB1505103A (en) Semiconductor device having complementary transistors and method of manufacturing same
GB1229294A (en)
GB1244508A (en) Zener diode semiconductor devices
GB1368190A (en) Monolithic integrated circuit
GB1309502A (en) Semiconductor device and method of making the same
GB1241809A (en) A method for manufacturing a semiconductor device
GB1496306A (en) Semiconductor integrated circuit including an epitaxial base type vertical transistor
GB1514578A (en) Semiconductor devices
JPS5582461A (en) Semiconductor integrated circuit device
GB1429696A (en)
GB1211117A (en) Integrated semiconductor devices

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee