GB1380093A - Polyepoxide polysiloxane compounds - Google Patents
Polyepoxide polysiloxane compoundsInfo
- Publication number
- GB1380093A GB1380093A GB4901972A GB4901972A GB1380093A GB 1380093 A GB1380093 A GB 1380093A GB 4901972 A GB4901972 A GB 4901972A GB 4901972 A GB4901972 A GB 4901972A GB 1380093 A GB1380093 A GB 1380093A
- Authority
- GB
- United Kingdom
- Prior art keywords
- polyepoxide
- resins
- adduct
- polysiloxanes
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- -1 polysiloxane Polymers 0.000 title abstract 12
- 229920001296 polysiloxane Polymers 0.000 title abstract 7
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 150000001875 compounds Chemical class 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 abstract 6
- 229920000728 polyester Polymers 0.000 abstract 6
- 229920005989 resin Polymers 0.000 abstract 6
- 239000011347 resin Substances 0.000 abstract 6
- 239000002253 acid Substances 0.000 abstract 5
- 239000003795 chemical substances by application Substances 0.000 abstract 5
- 150000002118 epoxides Chemical class 0.000 abstract 4
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- 239000011230 binding agent Substances 0.000 abstract 2
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- 150000002148 esters Chemical class 0.000 abstract 2
- 125000000623 heterocyclic group Chemical group 0.000 abstract 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 abstract 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 abstract 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000004606 Fillers/Extenders Substances 0.000 abstract 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 150000004982 aromatic amines Chemical class 0.000 abstract 1
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000004104 aryloxy group Chemical group 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 150000001735 carboxylic acids Chemical class 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 238000000748 compression moulding Methods 0.000 abstract 1
- 125000000753 cycloalkyl group Chemical group 0.000 abstract 1
- 150000001991 dicarboxylic acids Chemical class 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000009472 formulation Methods 0.000 abstract 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 abstract 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 abstract 1
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
- 239000004922 lacquer Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 abstract 1
- 239000011707 mineral Substances 0.000 abstract 1
- 239000003607 modifier Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 abstract 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 125000004430 oxygen atom Chemical group O* 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 239000000049 pigment Substances 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 abstract 1
- 239000012744 reinforcing agent Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 abstract 1
- 239000013008 thixotropic agent Substances 0.000 abstract 1
- 150000003608 titanium Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Polyesters Or Polycarbonates (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
1380093 Polyepoxide-polysiloxanes CIBAGEIGY AG 24 Oct 1972 [25 Oct 1971] 49019/72 Headings C3T and C3B Polyepoxide-polysiloxanes having the unit formula in which Z denotes a n-valent radical of a polycarboxylic acid or of an acid polyester, Q denotes an aliphatic, cycloaliphatic, heterocyclic or aromatic epoxide containing group in which the two oxygen atoms bonded to Q are attached to adjacent carbon atoms, R 1 and R 2 denote an alkyl, alkenyl, aralkyl, aryl, cycloalkyl, alkoxy or aryloxy group or an epoxide-containing polysiloxane chain, m is greater than 1, preferably 2-30, and n is 2 or 3, are prepared by esterifying or trans-esterifying at a temperature of 50- 200‹ C. a stoichiometric mixture of a polysiloxane of the formula in which R denotes a hydrogen atom or a C 1-4 alkyl group, and an adduct, prepared from a polyepoxide and a polycarboxylic acid or an acid polyester, of the formula preferably in the presence of a catalyst such as quaternary ammonium salts, titanium salts of organic acid, aluminium halides or boron halides. Preferably Q represents the 3-(3<SP>1</SP>,4<SP>1</SP>- epoxy - cyclohexyl) - 2,4 - dioxaspiro - (5,5)- undecylene-(8,9)-radical. Preferred polysiloxanes used for forming the adduct are 1,4-diethoxyoctamethyltetrasiloxane; 1,3-dimethyl- 1,2,3 - triphenyl - 1,2,3 - trimethoxytrisiloxane; and 1,6 - dimethoxyhexamethylhexaphenylhexasiloxane. Numerous examples of polyepoxides suitable for the formation of the adduct are listed and belong to the following groups:- cycloaliphatic epoxides with at least 1 five- or six-membered ring to which a 1,2-epoxide group is bonded; cycloaliphatic epoxides in which the epoxide groups are in alkyl side chains particularly glycidyl groups; polyglycidyl compounds containing a nitrogen-containing heterocyclic ring; di- or poly-glycidyl ethers of polyhydric alcohols; polyglycidyl esters of polybasic carboxylic acids or of polyesters with terminal carboxyl groups; and N-glycidyl derivatives of aromatic amines. Preferred polyesters for forming the adduct are esters of dicarboxylic acids, especially straight-chain aliphatic dicarboxylic acids, and aliphatic diols, the polyesters preferably possessing at least 8 carbon atoms in the recurring units and having a melting point of 50-140‹ C. Curable mixtures suitable for mouldings can be prepared from the polyepoxide-polysiloxanes, epoxide resin curing agents and optionally a curing accelerator, and other polyepoxide compounds and customary modifiers such as extenders, fillers, reinforcing agents, pigments, dyestuffs, organic solvents, flow control agents, plasticizers, thixotropic agents, flameproofing substances and mould release agents; examples of each ingredient being listed. In the examples polyepoxide-polysiloxanes are prepared by reacting an adduct prepared by reacting an acid polyester of sebacic acid and hexanediol or neopentyl glycol with 3-(3<SP>1</SP>,4<SP>1</SP>- epoxycyclohexyl) - 8,9 - epoxy - 2,4 - dioxaspiro - (5,5)-undecane, with a methoxy-containing methylphenylpolysiloxane using tetramethyl ammonium chloride as catalyst. The resulting resins are each cured in an aluminium mould using hexahydrophthalic anhydride as curing agent in the presence of a solution of sodium in 2,4-dioxy-3-methylolpentane. Uses.-Paints, lacquers, compression moulding compositions, sintering powders, dipping resins, casting resins, injection moulding formulations, impregnating resins and binders, adhesives, tool resins, laminating resins, sealing and filling compositions, floor covering compositions, and binders for mineral aggregates.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1548671A CH565209A5 (en) | 1971-10-25 | 1971-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1380093A true GB1380093A (en) | 1975-01-08 |
Family
ID=4409475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4901972A Expired GB1380093A (en) | 1971-10-25 | 1972-10-24 | Polyepoxide polysiloxane compounds |
Country Status (16)
| Country | Link |
|---|---|
| JP (1) | JPS4851099A (en) |
| AT (2) | AT319610B (en) |
| AU (1) | AU4775472A (en) |
| BE (1) | BE790533A (en) |
| CA (1) | CA1019871A (en) |
| CH (1) | CH565209A5 (en) |
| CS (2) | CS175440B2 (en) |
| DD (1) | DD105819A5 (en) |
| DE (1) | DE2251953A1 (en) |
| ES (1) | ES407900A1 (en) |
| FR (1) | FR2157918B1 (en) |
| GB (1) | GB1380093A (en) |
| IT (1) | IT969866B (en) |
| NL (1) | NL7213816A (en) |
| SU (1) | SU539535A3 (en) |
| ZA (1) | ZA727578B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2152946A (en) * | 1984-01-23 | 1985-08-14 | Postans Limited | Non-stick coatings |
| CN115449228A (en) * | 2022-09-28 | 2022-12-09 | 汇涌进光电(浙江)有限公司 | High-temperature high-humidity and photo-aging resistant photoelectric packaging material, and preparation method and application thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4328466C1 (en) * | 1993-08-24 | 1995-04-13 | Siemens Ag | Cast resin system containing siloxane |
| DE102007038314A1 (en) * | 2007-08-14 | 2009-04-16 | Evonik Degussa Gmbh | Process for the controlled hydrolysis and condensation of epoxy-functional organosilanes and their condensation with further organofunctional alkoxysilanes |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE537769A (en) * | 1954-04-30 | |||
| JPS4949176A (en) * | 1972-09-18 | 1974-05-13 |
-
0
- BE BE790533D patent/BE790533A/en unknown
-
1971
- 1971-10-25 CH CH1548671A patent/CH565209A5/xx not_active IP Right Cessation
-
1972
- 1972-10-11 CA CA153,645A patent/CA1019871A/en not_active Expired
- 1972-10-12 NL NL7213816A patent/NL7213816A/xx not_active Application Discontinuation
- 1972-10-13 AU AU47754/72A patent/AU4775472A/en not_active Expired
- 1972-10-20 CS CS7082A patent/CS175440B2/cs unknown
- 1972-10-20 CS CS3149A patent/CS175450B2/cs unknown
- 1972-10-23 DD DD172359*A patent/DD105819A5/xx unknown
- 1972-10-23 SU SU1839954A patent/SU539535A3/en active
- 1972-10-23 DE DE2251953A patent/DE2251953A1/en not_active Ceased
- 1972-10-24 ZA ZA727578A patent/ZA727578B/en unknown
- 1972-10-24 ES ES407900A patent/ES407900A1/en not_active Expired
- 1972-10-24 FR FR7237620A patent/FR2157918B1/fr not_active Expired
- 1972-10-24 IT IT30866/72A patent/IT969866B/en active
- 1972-10-24 AT AT1036073A patent/AT319610B/en not_active IP Right Cessation
- 1972-10-24 AT AT906672A patent/AT319608B/en not_active IP Right Cessation
- 1972-10-24 GB GB4901972A patent/GB1380093A/en not_active Expired
- 1972-10-25 JP JP47107050A patent/JPS4851099A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2152946A (en) * | 1984-01-23 | 1985-08-14 | Postans Limited | Non-stick coatings |
| CN115449228A (en) * | 2022-09-28 | 2022-12-09 | 汇涌进光电(浙江)有限公司 | High-temperature high-humidity and photo-aging resistant photoelectric packaging material, and preparation method and application thereof |
| CN115449228B (en) * | 2022-09-28 | 2023-11-10 | 汇涌进光电(浙江)有限公司 | High-temperature-resistant, high-humidity-resistant and photo-aging-resistant photoelectric packaging material as well as preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7213816A (en) | 1973-04-27 |
| ZA727578B (en) | 1973-07-25 |
| CA1019871A (en) | 1977-10-25 |
| DE2251953A1 (en) | 1973-05-03 |
| CH565209A5 (en) | 1975-08-15 |
| AT319610B (en) | 1974-12-27 |
| FR2157918A1 (en) | 1973-06-08 |
| AT319608B (en) | 1974-12-27 |
| SU539535A3 (en) | 1976-12-15 |
| IT969866B (en) | 1974-04-10 |
| CS175450B2 (en) | 1977-05-31 |
| FR2157918B1 (en) | 1975-03-14 |
| ES407900A1 (en) | 1975-11-16 |
| BE790533A (en) | 1973-04-25 |
| CS175440B2 (en) | 1977-05-31 |
| AU4775472A (en) | 1974-04-26 |
| DD105819A5 (en) | 1974-05-12 |
| JPS4851099A (en) | 1973-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |