GB1356073A - Adhesive based on an epoxy resin - Google Patents
Adhesive based on an epoxy resinInfo
- Publication number
- GB1356073A GB1356073A GB5063272A GB5063272A GB1356073A GB 1356073 A GB1356073 A GB 1356073A GB 5063272 A GB5063272 A GB 5063272A GB 5063272 A GB5063272 A GB 5063272A GB 1356073 A GB1356073 A GB 1356073A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- weight
- polybutadiene
- nov
- amide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 title abstract 4
- 230000001070 adhesive effect Effects 0.000 title abstract 4
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- 239000005062 Polybutadiene Substances 0.000 abstract 2
- 150000001408 amides Chemical class 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 229920002857 polybutadiene Polymers 0.000 abstract 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 abstract 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
1356073 Epoxy-resin compositions TH GOLDSCHMIDT AG 2 Nov 1972 [27 Nov 1971] 50632/72 Heading C3B An adhesive composition comprises an epoxy resin, preferably one based on diphenylol propane, a curing agent selected from an amine, an amide, a derivative of an amine or amide or a mixture of two or more thereof, and from 1- 15% by weight based on the total weight of the adhesive of a 1,4-polybutadiene of predominantly cis-configuration preferably containing not more than 25% by weight of 1,4-transpolybutadiene. In the examples adhesives are prepared from an epoxy resin based on diphenylol propane; 1,4-cis-polybutadiene; and any one of the following curing agents; polyaminoamide, triethylenetetramine and isophoronediamine, and their tensile shear strengths and peel strengths are determined.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2158878A DE2158878C3 (en) | 1971-11-27 | 1971-11-27 | Use of 1,4-polybutadiene as an additive for adhesives based on epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1356073A true GB1356073A (en) | 1974-06-12 |
Family
ID=5826321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5063272A Expired GB1356073A (en) | 1971-11-27 | 1972-11-02 | Adhesive based on an epoxy resin |
Country Status (4)
| Country | Link |
|---|---|
| AT (1) | AT320824B (en) |
| CH (1) | CH569073A5 (en) |
| DE (1) | DE2158878C3 (en) |
| GB (1) | GB1356073A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2207139A (en) * | 1987-07-17 | 1989-01-25 | Inventa Ag | Impact-resistant and rigid polyamide alloys |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022183010A (en) | 2021-05-27 | 2022-12-08 | エボニック オペレーションズ ゲーエムベーハー | Defoamer composition based on organofunctionally modified polybutadienes |
| JP2022183009A (en) | 2021-05-27 | 2022-12-08 | エボニック オペレーションズ ゲーエムベーハー | Polyester-polyether modified polybutadiene and method for producing the same |
| JP2022183014A (en) | 2021-05-27 | 2022-12-08 | エボニック オペレーションズ ゲーエムベーハー | Universal adhesion promoter based on organofunctional modified polybutadiene |
-
1971
- 1971-11-27 DE DE2158878A patent/DE2158878C3/en not_active Expired
-
1972
- 1972-10-27 CH CH1571972A patent/CH569073A5/xx not_active IP Right Cessation
- 1972-11-02 GB GB5063272A patent/GB1356073A/en not_active Expired
- 1972-11-27 AT AT1007972A patent/AT320824B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2207139A (en) * | 1987-07-17 | 1989-01-25 | Inventa Ag | Impact-resistant and rigid polyamide alloys |
| GB2207139B (en) * | 1987-07-17 | 1991-03-13 | Inventa Ag | Impact-resistant and rigid polyamide alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| CH569073A5 (en) | 1975-11-14 |
| DE2158878C3 (en) | 1975-03-20 |
| DE2158878A1 (en) | 1973-06-14 |
| DE2158878B2 (en) | 1974-07-25 |
| AT320824B (en) | 1975-02-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |